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In this role, you will be primarily responsible for evaluating electronic and mechanical component specifications, identifying compliance requirements, and defining precise packaging and handling (P&H) instructions to ensure component integrity throughout the supply chain. You may collaborate closely with procurement, quality assurance, engineering, and external suppliers to identify risks related to electrostatic discharge (ESD), moisture sensitivity, and physical damage.

Zobility

Component Engineer

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This position is responsible for thermal analysis and design of thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Analyzing simulation and measurement results to enhance product thermal management, Integrate cooling solutions to next generation SOC architecture design. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development.

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<h3 style="color: #ffffff; font-size: 16px; font-weight: normal;">We bring amazing people together to make amazing things happen.</h3>
<p>We’re a diverse collection of thinkers and doers, continually reimagining what’s possible to help us all do what we love in new ways. The people who work here have reinvented entire industries with the Mac, iPhone, iPad, and Apple Watch, as well as with services, including iTunes, the App Store, Apple Music, and Apple Pay. And the same passion for innovation that goes into our products also applies to our practices — strengthening our commitment to leave the world better than we found it.</p>
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<h3 style="color: #666666; font-weight: 500;">About Apple</h3>
<p>There’s a place here for every kind of brilliant.
Everyone here is an innovator, or an innovator-to-be, no matter what your team or your role. So bring your passion, courage, and original thinking and get ready to share it, because every new product, service, or feature we invent is the result of people working together to make each others’ ideas stronger. Innovation at this level depends on people who represent the variety of the human experience and inspire us with their own fresh perspectives. Together, we’ll do amazing work that can make a difference in people’s lives. Including your own.

<a href="https://www.apple.com/jobs/us">Learn more about working at Apple.</a>
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Apple Inc

SOC Thermal Engineer

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Instrument & Electrical Engineer - Victoria, Texas, United States - 194209 - Koch. Join our Talent Community.

Koch Inc

Instrument & Electrical Engineer

Enabling the movement toward advanced chip design, KLA's Measurement, Analytics and Control group (MACH) is looking for the best and brightest research scientists, software engineers, application development engineers and senior product technology process engineers to join our team. The Applications Engineer within the Computational Products team partners closely with customers, as well as internal software and algorithm development teams, to deliver effective solutions to complex technical challenges.

Regional Development Applications Engineer - MACH

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The Process Engineer III / Lead Process Engineer will be responsible for overseeing the process design performed by A&E firms working on projects, ensuring that process concepts, user requirements, equipment selections, facility layouts, utilities, process flows, and engineering deliverables align with the company's operational, technical, quality, regulatory, and business objectives. Project Farma (PF) team members collaborate with cross-functional teams to build trusted client relationships, deliver an exceptional customer experience, and contribute to business growth by identifying opportunities and applying data-driven insights to support project planning, cost, schedule, and performance management.

PerkinElmer US LLC

Manufacturing & Tech Ops - Process Engineer III/Lead Process Engineer - Project Farma

This includes investigating semiconductor manufacturing yield issues and providing inspection solutions; creating & sharing product value statements and use-cases with engineering, marketing and sales groups; training customers and other applications engineers. The Customer Engagement (CE) division is a field-based group of technical experts who partner closely with customers to provide a comprehensive portfolio of KLA products that support yield improvement from R&D through high-volume production.

YEAR

Customer Engagement Applications Engineer

In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.

Silicon Photonics & Optical Packaging Eng

You will lead packaging across the full development flow for DX-1, including package architecture, detailed design, layout, simulation, and product readiness, while simultaneously defining the packaging technology strategy, partner ecosystem, and internal capability that future generations will require. The Advanced Packaging Architect will own OLIXs packaging technology direction: defining the packaging architecture and roadmap across current and future products, and delivering the packaging solutions that turn our ASICs into high-performance systems.

Olix Computing Ltd

Packaging Architect

Leadership Experience: Minimum 8–10+ years of progressive manufacturing leadership experience, including at least 5 years as a Plant Manager, Operations Manager, or Director overseeing a complex manufacturing facility. The ideal candidate is an operational leader who drives margin expansion through cost containment, waste reduction, labor optimization, and operational efficiency, while serving as a key ambassador during executive customer plant tours.

Accredo Packaging

Plant Manager, Flexible Packaging

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What You'll Be Brewing: Perform set-up, adjustment, timing, troubleshooting, replacement and programming of electrical equipment using ladder logic, electrical prints and/or schematics. Complete root cause analysis/ breakdown elimination activities for all failures and implement corrective actions to prevent similar failures in the future.

HOUR

Molson Coors Brewing Company

Electrician - Packaging - Fort Worth

Ensure work-center's downtime is minimized by ensuring proper equipment set-ups, material is present prior to changeover and report lack of raw materials, tooling and / or equipment issues to the appropriate personnel. From tapes and films to packaging and protective products, as well as engineered coated materials and advanced packaging machinery, we develop innovative solutions that protect the world.

Intertape Polymer Group Inc. (IPG) is an acknowledged leader in the packaging industry. Leveraging its advanced manufacturing and technologies, extensive research and development capabilities and a comprehensive strategic acquisition program, the company believes it has assembled the broadest and deepest range of products in the industry.</p><p>IPG is widely recognized for its development and manufacture of specialized polyolefin, plastic and paper-based packaging products, as well as complementary packaging systems for industrial and retail use. Additionally, IPG is a woven and flexible intermediate bulk container (FIBC) manufacturer. Its performance products, including tapes and cloths, are designed for demanding aerospace, automotive and industrial applications and are sold to a broad range of industry/specialty distributors, retail stores and large end-users in diverse industries. </p><br />

Intertape Polymer Group Inc

Packaging Machine Operator

System and component EMC Design consultant who designs and de-bugs engineering solutions for electrical and electronic parts, subsystems, integrated circuitry, and algorithms based on established engineering principles and in accordance with development technology practices and guidelines including PCB EMC focused design reviews. Please note that Hewlett Packard Enterprise (HPE), its direct and indirect subsidiaries and affiliated companies, and its authorized recruitment agencies/vendors will never charge a candidate a registration fee, hiring fee, or any other fee in connection with its recruitment and hiring process.

Hewlett Packard Enterprise

Senior Compliance Engineer- EMC Regulatory and Energy Test Engineer

Proficient in understanding of DDR type interfaces (DDR, LPDDR, GDDR, HBM, eMMC), including the challenges associated with SoC PHY integration, timing analysis, packaging, and multi-chip integrated packaging. As a 3rd party core integrator, you will be involved in all stages of SoC development including defining core requirements, validating IP developer competence, overseeing core development, technology compliance, core integration, test compliance and silicon validation.

Marvell

Principal Hardware Engineer - 3Rd Party IP Engineer

The engineer will be responsible for leading board level reliability on products, development of new test procedures to quantify the reliability of a design, and failure analysis resulting from these tests. Experience performing reliability testing including Mechanical Stress Tests, Shock/Drop/Vibration Testing, Environmental Testing.

Artech LLC

MLB Reliability Engineer

You will work on the development of high-performance and high-speed AMS circuits used in SerDes PHY, including evaluation of different circuit topologies for specific product requirements (e.g., Rx, CDR, Tx, bias generator, high-speed clock generation and low-jitter distribution, high-speed analog signal chain, mixed-signal calibration and algorithms) with best in class power, performance, and area (PPA). Understanding and experience of designing analog mixed signal circuit blocks including Bandgap, biasing circuits, LDO regulators, amplifiers, comparators, switched-cap circuits, ADCs, DACs, Oscillators, Filters.

SerDes Circuit Design Engineer

Understanding and working knowledge and characteristics of magnetics (including inductor/transformer modeling), magnetization inductance, magnetization current, leakage inductance, intra-winding and inter-winding capacitance, self-resonant frequency, characteristics and limitations of magnetic cores, core saturation, core loss, high frequency losses, and winding techniques for optimization of desired magnetics. LaunchPoint designs and manufactures lightweight, high-specific-power motors, starter/generators and alternators for combat aircraft, uncrewed aircraft systems, drones and airborne pods.

Launchpoint Electric Propulsion Solutions, Inc.

Electrical Engineer II

We are looking for talented contributors who enjoy working on revolutionary products and aspiring to make them better through creation and execution of comprehensive test suites, identification of potential failure modes, and collaboration with design teams to drive product improvements. The engineer will be responsible for leading board level reliability on new Mac portables, development of new test procedures to quantify the reliability of a design, and failure analysis resulting from these tests.

Mac Reliability Engineer

Experience with various design features and calculations for mechanical packaging of electronics including vent analyses, EMI/EMC mitigation strategies, multi-component tolerance stack-up calculations, bolt load calculations, Steinberg PCB solder joint fatigue, etc. Firefly Avionics Mechanical Engineers will leverage their creative design and experience to develop electronics enclosures, mechanical components, integration hardware, tooling, and test fixtures for launch vehicles.

Firefly Aerospace

Mechanical Engineer II

Design complex, multi-layer printed circuit boards (8+ layers) for engine controllers, fuel system devices, lithium-ion battery management systems, chargers, and IoT telematics products. Compensation: based on experience level — ranging from approximately $80K for early-career designers up to $160K+ for principal/lead-level designers with deep, complex-board experience.

JCSI

PCB Design Engineer

Crelate

Act as the primary technical liaison between internal cross-functional teams-including RF HW Design, Wireless Module Test Engineering, System EE, EPMs, Reliability Engineering, Quality Engineering, DFM, Global Supply Managers, and Product Design-and corresponding technical teams at OSATs, ensuring alignment on architecture, specifications, deliverables, and development milestones. This role is expected to drive OSATs, set priorities, and collaborate closely with them to validate and approve the final ATE hardware and software integration, test coverage, and corresponding test limits, ensuring timely delivery of tested modules for product NPI builds.

Packaging Engineer Jobs in Texas

Component Engineer Zobility

SOC Thermal Engineer Apple Inc

Instrument & Electrical Engineer Koch Inc

Regional Development Applications Engineer - MACH KLA

Manufacturing & Tech Ops - Process Engineer III/Lead Process Engineer - Project Farma PerkinElmer US LLC

Customer Engagement Applications Engineer KLA

Silicon Photonics & Optical Packaging Eng Apple Inc

Packaging Architect Olix Computing Ltd

Plant Manager, Flexible Packaging Accredo Packaging

Electrician - Packaging - Fort Worth Molson Coors Brewing Company

Packaging Machine Operator Intertape Polymer Group Inc

Senior Compliance Engineer- EMC Regulatory and Energy Test Engineer Hewlett Packard Enterprise

Principal Hardware Engineer - 3Rd Party IP Engineer Marvell

MLB Reliability Engineer Artech LLC

SerDes Circuit Design Engineer Apple Inc

Electrical Engineer II Launchpoint Electric Propulsion Solutions, Inc.

Mac Reliability Engineer Apple Inc

Mechanical Engineer II Firefly Aerospace

PCB Design Engineer JCSI

Wireless Module Engineer Apple Inc

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