NewSenior Package Design Engineer – Semiconductor Packaging JobotSenior Package Design Engineer – Semiconductor PackagingAustin, TX$150,000–$300,000 / yearOur engineering teams are building advanced processors, software platforms, networking solutions, and semiconductor technologies from the ground up while fostering a highly collaborative environment focused on innovation and solving technically demanding challenges. Information collected and processed as part of your Jobot candidate profile, and any job applications, resumes, or other information you choose to submit is subject to Jobot's Privacy Policy, as well as the Jobot California Worker Privacy Notice and Jobot Notice Regarding Automated Employment Decision Tools which are available at jobot.com/legal.
NewSenior PCIe Bridge Design Verification Engineer MicrosoftSenior PCIe Bridge Design Verification EngineerAustin, TX$119,800–$234,700 / yearDoctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience. 7+ years of related technical engineering experience OR Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience or internship experience.
Senior IC Packaging Engineer Microsoft CorpSenior IC Packaging EngineerAustin, TX$119,800–$234,700 / yearPreferred Qualifications: Doctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 3+ years technical engineering experience OR Masters Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 8+ years technical engineering experience OR equivalent experience. Required Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 5+ years technical engineering experience OR equivalent experience.
Sr. Packaging Engineer Tesla IncSr. Packaging EngineerAustin, TXThe successful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define tradition. Tesla is seeking a highly motivated Packaging Engineer to join our Packaging team in developing world-class designs for automation equipment.
Packaging engineer Info Way Solutions LLCPackaging engineerAustin, TXsuccessful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define. • Apply industrial design techniques of CAD, technical drawings, including datum structure, GD&T and tolerance stack up analysis.
Silicon Photonics & Optical Packaging Engineer Apple IncSilicon Photonics & Optical Packaging EngineerTXIn this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.
Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs Amazon.com IncSr. Thermal & Mechanical Packaging Engineer, Annapurna LabsAustin, TXYou develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions and see those systems all the way through to high volume manufacturing. You'll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience.
Silicon Packaging Process Engineer, Production Starlink Space Exploration Technologies CorpSilicon Packaging Process Engineer, Production StarlinkTXDevelop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, surface mount technology (SMT), flip chip, bonding, molding, underfill, dispense, sputter, lid attach, solder ball attach, and advanced packaging processes. ITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
Packaging Engineer I YETI CoolersPackaging Engineer IAustin, TexasWork cross functionally with Program Managers, Product Managers, Design & Industrial Engineering, Marketing, Merchandising, Sourcing, Operations, International team members, packaging and manufacturing suppliers to execute on-time packaging solutions. As a Packaging Engineer, you will support the design and development of premium out-of-box experiences for YETI products while considering performance, sustainability, and cost; ensuring YETI packaging delivers our premium brand aesthetic throughout its full lifecycle.
Packaging Engineer I YETI Coolers, LLCPackaging Engineer IAustin, TXWork cross functionally with Program Managers, Product Managers, Design & Industrial Engineering, Marketing, Merchandising, Sourcing, Operations, International team members, packaging and manufacturing suppliers to execute on-time packaging solutions. As a Packaging Engineer, you will support the design and development of premium out-of-box experiences for YETI products while considering performance, sustainability, and cost; ensuring YETI packaging delivers our premium brand aesthetic throughout its full lifecycle.
Advanced Packaging Process Engineer, Silicon Technology Starlink Space Exploration Technologies CorpAdvanced Packaging Process Engineer, Silicon Technology StarlinkTXRESPONSIBILITIES: • Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems • Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes • Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines • Own packaging prototypes, product development, and release to production • Select equipment and material to meet quality, reliability, cost, yield, and production targets • Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements • Cross-functional interface with silicon design, materials, thermal, systems, and production teams • Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond. BASIC QUALIFICATIONS: • Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline • 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable).
Silicon Packaging Process Engineer, Silicon Technology Starlink Space Exploration Technologies CorpSilicon Packaging Process Engineer, Silicon Technology StarlinkTXRESPONSIBILITIES: • Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems • Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes • Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines • Own packaging prototypes, product development, and release to production • Select equipment and material to meet quality, reliability, cost, yield, and production targets • Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements • Cross-functional interface with silicon design, materials, thermal, systems, and production teams • Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond. BASIC QUALIFICATIONS: • Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline • 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable).
Sr. Silicon Packaging Process Engineer, Silicon Technology Starlink Space Exploration Technologies CorpSr. Silicon Packaging Process Engineer, Silicon Technology StarlinkTXDevelop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach. ITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
Thermal Mechanical Test Engineer, Silicon Packaging Starlink Space Exploration Technologies CorpThermal Mechanical Test Engineer, Silicon Packaging StarlinkBastrop, TXWe provide reliable and fast internet to millions of users worldwide, including populations with little or no connectivity, rural communities, aircraft, watercraft, and places where existing services are unreliable, too expensive, or disconnected by natural disasters. You will support the silicon packaging process engineering organization by characterizing package and board thermal performance, validating mechanical robustness, and correlating simulation results with physical test data to enable high-volume production of reliable Starlink hardware.
Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging Amazon.com IncPackage Layout Design Engineer , Annapurna Labs - AI Silicon PackagingAustin, TXIn this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets. Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
IC Packaging Simulation Engineer Apple IncIC Packaging Simulation EngineerTXIn this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. Numerical modeling of the stress and deformation of component packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
Mechanical Engineer, Packaging Engineering Tesla IncMechanical Engineer, Packaging EngineeringAustin, TXYou will serve as a highly technical contributor on the team responsible for design, optimization, prototyping and validation of new ways to deliver components safely and efficiently throughout our supply chain and manufacturing processes. Tesla is seeking a highly motivated Mechanical Design Engineer to join our Vehicle Packaging team in developing world-class designs for use in high volume automation equipment.
Test Engineer, Packaging Product Design Apple IncTest Engineer, Packaging Product DesignAustin, TXThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products, from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerAustin, TexasSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Education : BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent This role is not eligible for visa sponsorship.
Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging Amazon.com IncSignal & Power Integrity Engineer, Annapurna Labs - AI Silicon PackagingAustin, TXRun high-speed channel simulations (S-parameter extraction, time-domain analysis, eye diagrams) for die-to-die and die-to-board interfaces, or analyze package PDN performance (decoupling effectiveness, plane resonance, IR drop, AC impedance). We pioneered cloud computing and never stopped innovating - thats why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses.
Packaging and Graphic Designer 2 Dell Technologies IncPackaging and Graphic Designer 2Austin, TX$102,000–$132,000 / yearThe Packaging and Graphic Designer 2 will collaborate closely with Industrial Designers, Packaging Engineers, CMF teams, the Brand team, Software team and other partners to interpret design requirements and execute cohesive solutions. Develop high-quality design assets across packaging, product interfaces, marketing, and communications, including graphics, branded elements, wallpapers, and digital content such as short-form videos and animations.
Lead Silicon Packaging Technician, Silicon Assembly Starlink Space Exploration Technologies CorpLead Silicon Packaging Technician, Silicon Assembly StarlinkBastrop, TXOperate and maintain surface mount technology, automated optical inspection, reflow, aqueous deflux, convection and vacuum bake, compression molding, laser marking, ball grid array, tape mount, singulation, physical vapor deposition, vision, and pick/place machines. Operate die attach equipment, including epoxy dispensers, pick-and-place bonders, and reflow stations, to place and secure dies with micron-level accuracy and controlled bond line thickness.
Silicon Packaging Technician, Silicon Assembly Starlink Space Exploration Technologies CorpSilicon Packaging Technician, Silicon Assembly StarlinkBastrop, TXalign, bake, coat, expose, develop), electrochemical plating, die Attach, thermal compression bonding, compression molding/overmold, wafer dicing, scribe & break, stripping/etching, plasma, reactive ion etching (RIE), thin films deposition (CVD/PVD/ALD), dry film lamination & imaging. Operate photolithography tools, such as photoresist coaters, aligners, steppers, scanners, and developers, to apply uniform resist layers, align products, expose patterns, and develop images with precision accuracy.
AI Automation Design Packaging Lead Advanced Micro Devices IncAI Automation Design Packaging LeadAustin, TXTHE PERSON: The successful candidate must be a proven leader and a technical innovator who can bridge the gap between physical design requirements and software automation to generate AI driven workflows. THE ROLE: We are looking for a forward-thinking candidate to drive and lead the team for the development and deployment of next-generation packaging design automation and AI-Driven workflows.
NewAI-Driven Packaging Design Lead for 2.5D/3D AMDAI-Driven Packaging Design Lead for 2.5D/3DAustin, TXYou will drive AI/ML workflows, collaborate with EDA vendors to define roadmaps, and mentor engineers while presenting ROI and tool advancements to executives.#J-18808-Ljbffr. AMD in Austin is seeking a forward‑looking engineer to lead the development and deployment of AI‑driven workflows for next‑generation packaging design automation.
Packaging Designer, Amazon & Whole Foods Market Private Brands, Brand and Sustainability Amazon.com IncPackaging Designer, Amazon & Whole Foods Market Private Brands, Brand and SustainabilityAustin, TXReporting to the Creative Director of Package Design, you"ll own and drive the development and evolution of packaging systems across both Whole Foods Market and Amazon private label brands, helping shape how customers experience our products across stores, digital channels, and multiple retail formats. Based at Whole Foods Market HQ in Austin, TX, this role supports a growing portfolio of Whole Foods Market and Amazon private brands, spanning multiple categories, tiers, and customer experiences.
Sr. Packaging Designer Woodbolt Distribution LLCSr. Packaging DesignerAustin, TXThe company's disruptive and innovative products compete in the Functional Beverage and Active Nutrition segments, under three consumer-loved brands: C4 (one of the fastest-growing energy drink brands in the United States and the #1 selling global pre-workout brand), XTEND (the #1 post-workout recovery brand in the United States), and Cellucor (an award-winning sports nutrition brand created in 2002). This role requires a balance of conceptual creativity, technical packaging expertise, and forward-thinking innovation, including the strategic use of AI-driven design tools to accelerate ideation, visualization, and production workflows.
Senior, Packaging Designer Anheuser-Busch InBev SA/NVSenior, Packaging DesignerTXFrom our longstanding efforts to support American farmers, military, veterans, and first responders, to emergency drinking water donations and responsible drinking programs, we are guided by our commitment to the communities we call home and the 65,000 hardworking Americans who bring our beer to life. COMPANY: We are home to the nation's most iconic beer and beyond beer brands, including Michelob ULTRA - America's #1 top-selling beer - as well as Busch Light, Budweiser, Bud Light, Stella Artois, Cutwater Spirits, and industry-leading craft brands.
Packaging Production Artist Woodbolt Distribution LLCPackaging Production ArtistAustin, TXThe company's disruptive and innovative products compete in the Functional Beverage and Active Nutrition segments, under three consumer-loved brands: C4 (one of the fastest-growing energy drink brands in the United States and the #1 selling global pre-workout brand), XTEND (the #1 post-workout recovery brand in the United States), and Cellucor (an award-winning sports nutrition brand created in 2002). This role is highly technical and detail-driven, requiring deep expertise in packaging prepress, mechanical file setup, and printing processes-especially for beverage applications and aluminum can production.
NewForward Deployed Engineer III, Google Cloud, Applied AI Google LLCForward Deployed Engineer III, Google Cloud, Applied AIAustin, TXBuild high-performance evaluation (Eval) pipelines and observability frameworks to optimize agentic workloads, focusing on reasoning loops, tool selection, and reducing latency while maintaining production-grade security and networking. Architect and code conversational flows that are not just functional, but optimized for the "connective tissue" between Google's Conversational AI products and customers' live infrastructure, including APIs, legacy data silos, and security perimeters.
Staff Wireless Network Engineer Google LLCStaff Wireless Network EngineerAustin, TXYou also ensure that network operations are safe and efficient by monitoring network performance, coordinating planned maintenance, adjusting hardware components and responding to network connectivity issues. Cross-Functional Leadership: Collaborate with Workplace, Voice/Video, and Hardware teams while mentoring and leveling up junior network engineers.
Principal Signal and Power Integrity Engineer Microsoft CorpPrincipal Signal and Power Integrity EngineerAustin, TX$142,800–$274,800 / yearRequired Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. Drives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry practices, and lessons learned from teams working across multiple product lines.
Senior Security Engineer, Uppercase Research Google LLCSenior Security Engineer, Uppercase ResearchAustin, TXPreferred qualifications: Experience designing, building, or implementing LLMs and autonomous agent frameworks to accelerate threat detection lifecycles, automate security operations triage, or orchestrate self-healing detection pipelines. Experience designing, building, or implementing LLMs and autonomous agent frameworks to accelerate threat detection lifecycles, automate security operations triage, or orchestrate self-healing detection pipelines.
Workspace Customer Engineer II, Platform, New Business, Google Cloud Google LLCWorkspace Customer Engineer II, Platform, New Business, Google CloudAustin, TXRecommend integration strategies, enterprise architectures, platforms, and application infrastructure needed to successfully implement a complete solution using best practices on Google Workspace. Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Sunnyvale, CA, USA; Austin, TX, USA; Chicago, IL, USA; New York, NY, USA; Washington D.C., DC, USA.
Customer Engineer, Data Management, Retail, Google Cloud Google LLCCustomer Engineer, Data Management, Retail, Google CloudAustin, TXExperience with Oracle or DB2 to PostgreSQL data migrations, including Schema/Code conversion tools, zero downtime migration strategies or technologies, or regression testing strategies and automation tools. Inspire customers and peers to solve difficult problems with ambitious and novel solutions, including product and solution briefings, proof-of-concept work, and coordinating technical resources.
Network Operations Engineer, University Graduate Google LLCNetwork Operations Engineer, University GraduateAustin, TXImplement routine network changes, such as port configurations, virtual local area network (VLAN) assignments, and software updates, following approved change requests (CRs) and performing pre- and post-change verifications. You will work with Technical Program Managers, Network Engineers, Design and Infrastructure Engineers, Field Engineers within Google, as well as construction and telecommunications vendors and contractors, all to position your team and organization for success.
Customer Engineer II, Platform, SAISV, Google Cloud Google LLCCustomer Engineer II, Platform, SAISV, Google CloudAustin, TXAs part of an entrepreneurial team in this rapidly growing business, you will play a key role in understanding the needs of our customers and help shape the future of businesses of all sizes use technology to connect with customers, employees and partners. Preferred qualifications: Experience selling technical solutions in one or more of the following: Infrastructure Modernization, Application Modernization, Data Management, Data Analytics, Cloud AI, Networking, Migrations, Security.
Network Engineer, Google Global Infrastructure Google LLCNetwork Engineer, Google Global InfrastructureAustin, TXYou also ensure that network operations are safe and efficient by monitoring network performance, coordinating planned maintenance, adjusting hardware components and responding to network connectivity issues. Experience driving progress, solving problems, and mentoring more junior team members; deeper expertise and applied knowledge within relevant area.
Staff Network Security Engineer, Google Enterprise Network Google LLCStaff Network Security Engineer, Google Enterprise NetworkAustin, TXAs a Google Enterprise Network Security Engineer, you will be responsible for the managing risks to GEN network hardware and software systems, developing automation and tools to enforce security policies, and partnering closely with customers, vendors team, network operations, and deployment teams to ensure the designs and solutions are safe, secure, efficient and address our user"s requirements. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.
Senior Control Systems Networking Engineer, Data Center Google LLCSenior Control Systems Networking Engineer, Data CenterAustin, TXIdentify opportunities for continuous improvement and maturation of the OT environment to drive risk reduction, and serve as a technical liaison and collaborate between cross-functional teams to resolve complex design, integration, and deployment issues in mission-critical environments. Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Kirkland, WA, USA; Sunnyvale, CA, USA; Addison, TX, USA; New York, NY, USA; Reston, VA, USA; San Francisco, CA, USA; Austin, TX, USA; Atlanta, GA, USA.
Mechanical Engineer, Staff to Principal level Enphase Energy IncMechanical Engineer, Staff to Principal levelAustin, TX$110,000–$183,000 / yearWe are looking for a Mechanical Design Engineer with a strong background in the mechanical design and integration of electrical equipment - including busbars, wire harnesses, electronic board packaging, and connectors - who will own the integration of the support and control system for Enphase's first-generation Solid State Transformer product. Perform electrical insulation coordination for internal mechanical components, including creepage and clearance analysis, material selection for dielectric performance, and compliance with relevant voltage class requirements.
SerDes Circuit Design Engineer Apple IncSerDes Circuit Design EngineerTXYou will work on the development of high-performance and high-speed AMS circuits used in SerDes PHY, including evaluation of different circuit topologies for specific product requirements (e.g., Rx, CDR, Tx, bias generator, high-speed clock generation and low-jitter distribution, high-speed analog signal chain, mixed-signal calibration and algorithms) with best in class power, performance, and area (PPA). Understanding and experience of designing analog mixed signal circuit blocks including Bandgap, biasing circuits, LDO regulators, amplifiers, comparators, switched-cap circuits, ADCs, DACs, Oscillators, Filters.
Software Engineer II: AI Compiler Engineer Cadence Design Systems IncSoftware Engineer II: AI Compiler EngineerAustin, TXJob Description: Developing a deep learning compiler stack that takes neural network descriptions (CNNs/RNNs) created in frameworks such as Caffe, PyTorch, TensorFlow, etc. and converts them into code suitable for execution on special-purpose and embedded platforms. Be a part of a team that develops an AI graph compiler that takes as input Neural Networks (NNs) created in frameworks such as PyTorch or TensorFlow and converts them into optimized code suitable for execution on special-purpose and embedded platforms.
Network Implementation Engineer, Edge Metro Capacity Delivery Google LLCNetwork Implementation Engineer, Edge Metro Capacity DeliveryAustin, TXYou also ensure that network operations are safe and efficient by monitoring network performance, coordinating planned maintenance, adjusting hardware components and responding to network connectivity issues. Execute and troubleshoot capacity workflows for edge network devices in new and existing network nodes across Google"s global network.
Electrical Engineer II Launchpoint Electric Propulsion Solutions, Inc.Electrical Engineer IICedar Park, TXUnderstanding and working knowledge and characteristics of magnetics (including inductor/transformer modeling), magnetization inductance, magnetization current, leakage inductance, intra-winding and inter-winding capacitance, self-resonant frequency, characteristics and limitations of magnetic cores, core saturation, core loss, high frequency losses, and winding techniques for optimization of desired magnetics. LaunchPoint designs and manufactures lightweight, high-specific-power motors, starter/generators and alternators for combat aircraft, uncrewed aircraft systems, drones and airborne pods.
Failure Analysis Engineer, Microelectronics Starlink Space Exploration Technologies CorpFailure Analysis Engineer, Microelectronics StarlinkTXStarlink is SpaceX's ambitious goal to bring high-quality internet to the globe by building a constellation of thousands of satellites in low Earth orbit (LEO) using our Falcon 9 and Starship reusable rockets. ITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
Senior Engineer II-Test Microchip Technology IncSenior Engineer II-TestAustin, TXOur company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. This role is critical in leading pre- and post-silicon test engineering activities to support the development and high-volume manufacturing of advanced integrated circuit (IC) products.
Senior Technical Staff Engineer-Test Microchip Technology IncSenior Technical Staff Engineer-TestAustin, TXRequirements/Qualifications: Bachelor's/Master's degree in Computer Engineering, Electrical Engineering, or Computer Science with minimum of 15+ years' experience developing ATE test programs for integrated circuits. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation.
Senior/Principal RF Test Engineer, Texas Institute for Electronics The University of Texas at AustinSenior/Principal RF Test Engineer, Texas Institute for ElectronicsAustin, TXA key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices. However, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation, proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor's legal duty to furnish information.
Senior or Principal Test Engineer, Texas Institute for Electronics The University of Texas at AustinSenior or Principal Test Engineer, Texas Institute for ElectronicsTXA key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices. However, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation, proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor's legal duty to furnish information.