UNKNOWN

FEED

SpaceX is leveraging its experience deploying and operating the world's largest satellite constellation to develop Starmind, a new constellation of satellites capturing solar energy in space to power low-cost, high-performance AI compute for Earth. We develop nearly every key piece of technology in house - from the satellites' flight computers and power systems to the fully custom compute electronics, memory, and networking that form the brain of our on-orbit data centers.

Space Exploration Technologies Corp

Sr. Packaging Engineer - Thermal Materials, AI Satellites Starmind

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This role ensures packaging solutions meet product protection, regulatory, quality, operational, and customer requirements while supporting FDA remediation activities, process optimization, product launches, and cost reduction initiatives. • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Industrial Engineering, Manufacturing Engineering, Biomedical Engineering, or related technical field.

TechDigital Corporation

Packaging Engineer

jobdiva

Drive complex cross-functional technical programs involving Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, internal assembly sites, OSATs, material suppliers, and external technology partners. Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, chiplets, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred.

NXP Semiconductor, Inc.

Senior Principal Packaging Engineer

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This role will lead packaging from concept through production, working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-performance, cost-effective, and manufacturable products. You will work alongside experienced leaders, architects, engineers, and operators who have delivered industry-defining products across mobile, cloud, semiconductor, and AI platforms.

YEAR

Velaura

Principal Packaging Engineer

Packaging engineers play an important role at TI which encompasses the following responsibilities: Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment.

Texas Instruments Inc

Career Accelerator Program - Packaging Engineer

You develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions and see those systems all the way through to high volume manufacturing. You'll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience.

At Amazon, we don’t wait for the next big idea to present itself. We envision the shape of impossible things and then we boldly make them reality. So far, this mindset has helped us achieve some incredible things. Let’s build new systems, challenge the status quo, and design the world we want to live in. We believe the work you do here will be the best work of your life. 
Wherever you are in your career exploration, Amazon likely has an opportunity for you. Our research scientists and engineers shape the future of natural language understanding with Alexa. Fulfillment center associates around the globe send customer orders from our warehouses to doorsteps. Product managers set feature requirements, strategy, and marketing messages for brand new customer experiences. And as we grow, we’ll add jobs that haven’t been invented yet. 
It’s Always Day 1 
At Amazon, it’s always “Day 1.” Now, what does this mean and why does it matter? It means that our approach remains the same as it was on Amazon’s very first day – to make smart, fast decisions, stay nimble, invent, and stay focused on delighting our customers. In our 2016 shareholder letter, Amazon CEO Jeff Bezos shared his thoughts on how to keep up a Day 1 company mindset. “Staying in Day 1 requires you to experiment patiently, accept failures, plant seeds, protect saplings, and double down when you see customer delight,” he wrote. “A customer-obsessed culture best creates the conditions where all of that can happen.” You can read the full letter <a href="https://hiring.amazon.com/why-amazon/culture#/">here</a> 
Our Leadership Principles 
Our Leadership Principles help us keep a Day 1 mentality. They aren’t just a pretty inspirational wall hanging. Amazonians use them, every day, whether they’re discussing ideas for new projects, deciding on the best solution for a customer’s problem, or interviewing candidates. To read through our Leadership Principles from Customer Obsession to Bias for Action, visit <a href="https://www.amazon.jobs/principles" target="_blank">https://www.amazon.jobs/principles</a>

Amazon.com Inc

Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs

Manages new product development processes, based on customer needs, design structural packaging basics, utilizing SolidWorks and other computer design programs suitable for the purpose intended. As a Packaging Engineer I, you will be responsible for designing and developing packaging products and solutions that meet customers’ needs and specifications with little supervision.

UFP Industries

The successful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define tradition. Tesla is seeking a highly motivated Packaging Engineer to join our Packaging team in developing world-class designs for automation equipment.

Tesla Inc

Sr. Packaging Engineer

ITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing.

Sr. IC Packaging Test Engineer, Silicon Technology Starlink

https://www.lockheedmartin.com/en-us/who-we-are/business-areas/missiles-and-fire-control.html?utm_campaign=mfc&utm_term=rm&utm_source=MFC-JobDescriptions-MFC-Business-page-2025&utm_medium=website This role offers the chance to impact product protection and logistics across critical programs, working with cross‑functional teams in a dynamic environment.

Headquartered in Bethesda, Maryland, Lockheed Martin is a global security and aerospace company that employs approximately 125,000 people worldwide and is principally engaged in the research, design, development, manufacture, integration and sustainment of advanced technology systems, products and services.
	Our Mission:&nbsp; We solve complex challenges, advance scientific discovery and deliver innovative solutions to help our customers keep people safe and provide them essential services. 
	
	Our Vision:&nbsp;Be the global leader in supporting our customers to strengthen global security, deliver citizen services and advance scientific discovery.
	Our Values:
	
	<li style="margin: 0px 0px 0px 15px;">Do What's Right</li>
	<li style="margin: 0px 0px 0px 15px;">Respect Others</li>
	<li style="margin: 0px 0px 0px 15px;">Perform With Excellence</li>

Lockheed Martin Corporation

Packaging Engineer Sr

Work cross functionally with Program Managers, Product Managers, Design & Industrial Engineering, Marketing, Merchandising, Sourcing, Operations, International team members, packaging and manufacturing suppliers to execute on-time packaging solutions. As a Packaging Engineer, you will support the design and development of premium out-of-box experiences for YETI products while considering performance, sustainability, and cost; ensuring YETI packaging delivers our premium brand aesthetic throughout its full lifecycle.

YETI

The Meta Infrastructure team designs, builds, brings-up, tests and integrates hardware systems that power Meta's platforms, deployed in data centers worldwide, from silicon to sheet metal. People who choose to build their careers by building with us at Meta help shape a future that will take us beyond what digital connection makes possible today-beyond the constraints of screens, the limits of distance, and even the rules of physics.

Meta Platforms Inc

Silicon Packaging Engineer

Continuous Improvement/Operations Support : Identify and lead continuous improvement projects, in collaboration with plant production teams and material suppliers, to enhance packaging performance, reduce quality defects, and improve overall manufacturing efficiency. Supplier Management : Collaborate with packaging material suppliers to improve quality and consistency of their material, assist in root cause analysis, source and test new materials, and ensure alignment with product and company requirements as well as plant operations.

Daisy Brand

Corporate Packaging Engineer

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YETI Coolers

Responsibilities include but are not limited to ensuring management of change regarding new packaging material implementation accounts for PPWR compliance, partnering with Regulatory/Sustainability resources to ensure operations remain in compliance as regulations evolve and ensuring operations is properly accounting/reporting packaging materials. The Packaging Technology Guardian will be responsible for driving & supporting finished product packaging improvement initiatives across all product lines within the Roquette Health & Pharma Solutions (HPS) Business Unit.

Roquette

YETI Coolers, LLC

This position will support engineering efforts related to processing, packaging, and utility systems, managing projects from initial concept to final commissioning. Requirements Key Responsibilities: Oversee capital projects (CAPEX) through all phases including planning, design, budgeting, execution, and completion.

Weekday AI

PERMANENT

SpaceX is leveraging its experience deploying and operating the world’s largest satellite constellation to develop Starmind, a new constellation of satellites capturing solar energy in space to power low-cost, high-performance AI compute for Earth. We develop nearly every key piece of technology in house – from the satellites’ flight computers and power systems to the fully custom compute electronics, memory, and networking that form the brain of our on-orbit data centers.

SpaceX

Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind)

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Space Exploration Technologies

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere.

Packaging Engineer Jobs in Texas

Sr. Packaging Engineer - Thermal Materials, AI Satellites Starmind Space Exploration Technologies Corp

Packaging Engineer TechDigital Corporation

Senior Principal Packaging Engineer NXP Semiconductor, Inc.

Principal Packaging Engineer Velaura

Career Accelerator Program - Packaging Engineer Texas Instruments Inc

Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs Amazon.com Inc

Packaging Engineer UFP Industries

Sr. Packaging Engineer Tesla Inc

Sr. IC Packaging Test Engineer, Silicon Technology Starlink Space Exploration Technologies Corp

Packaging Engineer Sr Lockheed Martin Corporation

Packaging Engineer YETI

Silicon Packaging Engineer Meta Platforms Inc

Corporate Packaging Engineer Daisy Brand

Packaging Engineer YETI Coolers

Packaging Engineer Roquette

Packaging Engineer YETI Coolers, LLC

Packaging Engineer Weekday AI

Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind) SpaceX

Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind) Space Exploration Technologies

Packaging Engineer Texas Instruments Inc

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