Hardware Engineer VersaLogic CorporationHardware EngineerTualatin, ORFull timeTasks include performing feasibility studies, selecting components, writing technical documentation, creating schematics, defining layout guidelines, participating in design reviews, debugging boards and systems, executing tests, and guiding technical resources. VersaLogic's team of high-tech folk design and manufacture high-reliability embedded computer boards for mission-critical applications across aeronautic, defense and medical industries.
Component Engineer VersaLogic CorporationComponent EngineerTualatin, ORFull timeWorking closely with Supply Chain and Operations teams, the Component Engineer plays a critical role in maintaining product continuity, managing component obsolescence, and driving value through engineering analysis. The Component Engineer is responsible for the selection, qualification, lifecycle management, and cost optimization of electronic and mechanical components used in embedded hardware products.
IT Systems Engineer (On-Site - Washington/Oregon State) Heritage BankIT Systems Engineer (On-Site - Washington/Oregon State)Hillsboro, OR$91,707–$114,639 / yearKnowledge of and experience administering, designing, or deploying operating systems such as Microsoft Exchange, Microsoft 365, Active Directory, AD Federation Services, SQL Server Always On Availability Groups, Microsoft Entra, IAM / PAM software, Load Balancers, and other current technology is highly desired. Travel Time: 10 – 20% with willingness and availability to travel to other bank locations as needed to support bank infrastructure systems; valid driver’s license, proof of insurance, and access to reliable transportation; or the ability to access and utilize an alternative method of transportation, when needed, to carry out job-related essential functions.
NewApplication Engineer - Mobile Controls JobotApplication Engineer - Mobile ControlsPortland, ORRemote$110,000–$130,000 / yearWe're seeking an Applications Engineer – Mobile Controls to support OEM customers throughout the Western United States by providing technical expertise on electronic controls, displays, sensors, and electrohydraulic solutions. Information collected and processed as part of your Jobot candidate profile, and any job applications, resumes, or other information you choose to submit is subject to Jobot's Privacy Policy, as well as the Jobot California Worker Privacy Notice and Jobot Notice Regarding Automated Employment Decision Tools which are available at jobot.com/legal.
NewITOT Infrastructure Engineer - Contract TalentBurst, Inc.ITOT Infrastructure Engineer - ContractHillsboro, OR$50–$50.72 / hourLead and/or provide support for the evaluation, installation, and maintenance of Manufacturing infrastructure including installation and upgrade of control systems hardware, software, control networks, user administration, database administration, security, system monitoring, backup and recovery of Microsoft Windows Server Operating Systems and SQL Databases. Certifications: Microsoft Certified System Engineer (MCSE, Cisco Certified Network Associate (CCNA), VMware Certified Advanced Professional (VCAP), Certified Information System Security Professional (CISSP), ISA/IEC 62443 Cybersecurity Specialist certification, Global Industrial Cyber Security Professional (GICSP) is a plus.
Senior PCIe Bridge Design Verification Engineer MicrosoftSenior PCIe Bridge Design Verification EngineerHillsboro, OR$119,800–$234,700 / yearDoctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience. 7+ years of related technical engineering experience OR Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience or internship experience.
NewSenior IC Packaging Engineer MicrosoftSenior IC Packaging EngineerHillsboro, OR$119,800–$234,700 / yearDoctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 3+ years technical engineering experience OR Masters Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 8+ years technical engineering experience OR equivalent experience. Doctorate in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 5+ years technical engineering experience OR equivalent experience.
NewSenior Test Engineer MicrosoftSenior Test EngineerHillsboro, OR$119,800–$234,700 / yearDoctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience. To achieve this goal, the Silicon Manufacturing and Product Engineering team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware.
NewIntel Foundry Module Development Engineer INTELIntel Foundry Module Development EngineerPortland, OR$127,400–$179,900 / yearLithography engineers work with industry partners and equipment suppliers to develop and implement equipment, identify equipment capability shortcomings, propose and evaluate hardware modification to mitigate issues, and implement preventative maintenance needed for stable process lines. You must possess a PhD degree in Chemistry, Physics, Material Science, Chemical Engineering, Nuclear Engineering, Electrical Engineering, Mechanical Engineering, or other science or engineering fields of study that include relevant experimental work.
NewDry Etch module development engineer INTELDry Etch module development engineerVernonia, OR$148,100–$209,100 / yearExperience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration. You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance.
NewYield Engineer INTELYield EngineerVernonia, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
NewSeniconductor Process Engineer INTELSeniconductor Process EngineerHillsboro, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
NewPackaging Engineer INTELPackaging EngineerVernonia, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
NewProcess Integration Engineer INTELProcess Integration EngineerHillsboro, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestLafayette, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
NewModule Development Engineer, Defect Inspection INTELModule Development Engineer, Defect InspectionPortland, OR$127,400–$179,900 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. Minimum Qualifications and Experience : Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related field + 4 years of experience.
NewModule Development Engineer INTELModule Development EngineerLafayette, OR$127,400–$179,900 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field with at least 6+ months relevant experience.
NewAdvanced Packaging Engineer INTELAdvanced Packaging EngineerLafayette, OR$148,100–$209,100 / yearWhat you will be considered for: LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: Lead scientific research enabling the manufacture of innovative device architectures coupled with the realization of these architectures. We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work.
NewProcess Engineer INTELProcess EngineerPortland, OR$148,100–$209,100 / yearWhat you will be considered for: LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: Lead scientific research enabling the manufacture of innovative device architectures coupled with the realization of these architectures. We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work.
NewProcess Development Engineer INTELProcess Development EngineerVernonia, OR$148,100–$209,100 / yearWhat you will be considered for: LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: Lead scientific research enabling the manufacture of innovative device architectures coupled with the realization of these architectures. We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work.
NewInfrastructure Engineer CFSInfrastructure EngineerPortland, OR$40–$50 / hourThis role is ideal for a hands-on IT professional who enjoys troubleshooting complex issues, supporting end users, managing system migrations, and ensuring the stability of critical business applications and infrastructure. The ideal candidate will have strong experience with Office 365, Active Directory, user support, system administration, and IT operations , along with the ability to effectively manage escalated tickets and support ongoing technology initiatives.
Hardware Design Engineer RambusHardware Design EngineerHillsboro, Oregon$106,900–$198,500 / yearRambus is a global company that makes industry-leading memory interface chips and Silicon IP to advance data center connectivity and solve the bottleneck between memory and processing. Overview: Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional HW Design Engineer to join our MCG team in Hillsboro.
Structural Civil Engineer 2 Automation and Control Strategies Group, INC. dba ACS Professional StaffingStructural Civil Engineer 2Vancouver, WAFull timeThe role includes evaluating existing structures for increased loads or updated criteria, designing new structures, producing engineering drawings, and developing retrofit solutions. These structure types include lattice steel (or aluminum) towers, single or multiple steel pole structures, single or multiple wood pole structures, concrete structures, and others.
Electrical Engineer Technician 2 Automation and Control Strategies Group, INC. dba ACS Professional StaffingElectrical Engineer Technician 2Vancouver, WAFull timeProvide technician support to design engineers and technicians within the group in the form of reports, consolidation papers, printing design packages, preparing drawing lists, coordinating release of work-in-process (WIP) designs, and other CAD or technician needs. * Perform review of CAD and manually drafted drawings and other documents for drafting accuracy and completeness; provide feedback and/or make necessary corrections before review by engineers and technicians.
NewSr. Electrical Engineer, Digital Hardware (US Citizenship Required) Teledyne TechnologiesSr. Electrical Engineer, Digital Hardware (US Citizenship Required)Wilsonville, OregonOur products include advanced surveillance sensors, unmanned air and ground vehicles, sensing devices used to detect chemicals, biological agents, radiation and explosives, and a host of other solutions that help warfighters, first responders, and search-and-rescue teams do their jobs better. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research..
Hardware Engineer V ZincFive IncHardware Engineer VTualatin, ORThe qualified individual will be responsible for documentation of the design changes, supporting the transition of new designs into manufacturing, as well as solving complex engineering problems associated with new product introduction. The Hardware Engineer V will participate in the development of electrical architecture and design, integration and debugging of new electrical hardware and validation of the design in a structured engineering environment.
Senior Electrical Engineer - Digital Hardware & FPGA Design Teledyne Technologies IncSenior Electrical Engineer - Digital Hardware & FPGA DesignWilsonville, OROur products include advanced surveillance sensors, unmanned air and ground vehicles, sensing devices used to detect chemicals, biological agents, radiation and explosives, and a host of other solutions that help warfighters, first responders, and search-and-rescue teams do their jobs better. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
Senior Electrical Engineer – Digital Hardware & FPGA Design (US CITIZENSHIP REQUIRED) Teledyne TechnologiesSenior Electrical Engineer – Digital Hardware & FPGA Design (US CITIZENSHIP REQUIRED)Wilsonville, OregonOur products include advanced surveillance sensors, unmanned air and ground vehicles, sensing devices used to detect chemicals, biological agents, radiation and explosives, and a host of other solutions that help warfighters, first responders, and search-and-rescue teams do their jobs better. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research..
Senior Electrical Engineer - Digital Hardware & Fpga Design (US Citizenship Required) Teledyne TechnologiesSenior Electrical Engineer - Digital Hardware & Fpga Design (US Citizenship Required)Wilsonville, OROur products include advanced surveillance sensors, unmanned air and ground vehicles, sensing devices used to detect chemicals, biological agents, radiation and explosives, and a host of other solutions that help warfighters, first responders, and search-and-rescue teams do their jobs better. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
Hardware Engineer II ApconHardware Engineer IIWilsonville, OregonThis role focuses on designing the physical electronics that power our network visibility and switching products, including embedded processors, switch ASICs, DDR4 or DDR5 memory subsystems, and the surrounding high speed digital circuitry. APCON designs and assembles industry-leading network visibility and security technologies in the United States, supporting some of the world’s largest and fastest networks.
Sr. Hardware Engineer (Teradyne, Oregon) Teradyne IncSr. Hardware Engineer (Teradyne, Oregon)Tualatin, OR$141,400–$226,200 / yearThis role focuses on power delivery architecture, fast transient response, load regulation, protection systems, thermal management, and system‑level integration to support advanced SoCs, FPGAs, high‑power devices, and complex test conditions. The Senior Hardware Engineer in the hardware group is responsible for designing, developing, and validating high‑current, high‑power sourcing and switching hardware used in semiconductor automated test equipment.
Principal Hardware Engineer (Teradyne, Oregon) Teradyne IncPrincipal Hardware Engineer (Teradyne, Oregon)Tualatin, OR$175,300–$280,600 / yearThis role focuses on power delivery architecture, fast transient response, load regulation, protection systems, thermal management, and system‑level integration to support advanced SoCs, FPGAs, high‑power devices, and complex test conditions. The Senior Hardware Engineer in the hardware group is responsible for designing, developing, and validating high‑current, high‑power sourcing and switching hardware used in semiconductor automated test equipment.
Principal Hardware Engineer, DC/DC Power Microsoft CorpPrincipal Hardware Engineer, DC/DC PowerHillsboro, OR$142,800–$274,800 / yearTo achieve this goal, the CHSE (Cloud Hardware Systems Engineering) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.
EDA Tools Hardware Engineer Intel CorpEDA Tools Hardware EngineerHillsboro, OR$141,910–$269,100 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Senior Hardware Design Engineer (Teradyne, Tualatin, OR) Teradyne IncSenior Hardware Design Engineer (Teradyne, Tualatin, OR)Tualatin, OR$141,400–$226,200 / yearThe engineer will perform a variety of complex activities covering the design of new products, investigating customer-reported problems for root cause analysis, and implementing improvements in design, test, and/or operations. Benefits: Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more.
Contract Hardware Test Engineer BiampContract Hardware Test EngineerTigard, OregonResponsibilities include designing production tests, developing test fixtures, and working with flying• probe technology to ensure quality and performance in digital signal processing products.• 5 Plus Years of experience in a Test engineering position role, ideally with a strong background in designing and implementing production tests for advanced electronics.
Hardware Platform Applications Engineer - Military & Aerospace Intel CorpHardware Platform Applications Engineer - Military & AerospaceHillsboro, OR$122,440–$232,190 / yearHarnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. In the Hardware Platform Applications Engineer role, your responsibilities would include but not be limited to: Directly engaging customers to provide support for customer developed systems including providing on-site power on support.
Systems and Hardware Enabling Engineer Intel CorpSystems and Hardware Enabling EngineerHillsboro, OR$141,910–$200,340 / yearAdditional Locations: Business group: The Central Engineering Group (CEG) is Intel''s data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). Intel brings decades of leadership in networking, virtualization, packet processing, storage, and security to a new class of IPU products that accelerate host networking functions and support emerging use cases such as security, virtualization, storage, load balancing, and data path optimization.
Senior Hardware Test Engineer BiampSenior Hardware Test EngineerTigard, OregonResponsibilities include designing production tests, developing test fixtures, and working with flying probe technology to ensure quality and performance in digital signal processing products. 5 Plus Years of experience in a Test engineering position role, ideally with a strong background in designing and implementing production tests for advanced electronics.
Systems And Hardware Enabling Engineer Intel Corp.Systems And Hardware Enabling EngineerHillsboro, OR$141,910–$200,340 / yearIntel brings decades of leadership in networking, virtualization, packet processing, storage, and security to a new class of IPU products that accelerate host networking functions and support emerging use cases such as security, virtualization, storage, load balancing, and data path optimization. Job Details: Job Description: Join a passionate team of engineers in Intel's Networking Solutions Group (NSG) focused on enabling next generation programmable Infrastructure Processing Units (IPUs) with our lead customers as part of the Customer Experience Support (CES) organization.
Mechanical Engineer, Space Hardware (Mid-Level) IRPIMechanical Engineer, Space Hardware (Mid-Level)Wilsonville, OregonOur portfolio spans CO removal and air revitalization, hydroponics, biological sample processing, waste management, and fire safety, as well as condensing heat exchangers, propellant management devices, lunar lander components, and advanced suit subsystems. Professional Growth: Hands-on flight-hardware experience, mentorship from senior and principal engineers, and the chance to contribute to cutting-edge space programs from day one.
Principal Signal & Power Engineer (Die to Die and Chiplet Design) Microsoft CorpPrincipal Signal & Power Engineer (Die to Die and Chiplet Design)Hillsboro, OR$142,800–$274,800 / yearDrives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines. IP design, voltage regulator, motherboard, CPU package, silicon, decoupling capacitor solutions, dielectric and copper loss, high-frequency discontinuities, timing budgets, power supply induced jitter, etc.) for data center processors and corresponding platforms to ensure optimized performance.
Engineering Support Specialist 3 Automation and Control Strategies Group, INC. dba ACS Professional StaffingEngineering Support Specialist 3Vancouver, WAFull timeCoordinate with engineers and technicians to verify that reports are accurate via engineer and technician review and produce final reports in PDF and / or RTF format for distribution to warehouse personnel, Transmission Line Maintenance (TLM) crews, and contractor construction crews. This role requires 5+ years of supply chain or logistics experience, proficiency with database systems such as MS Access and enterprise asset systems, and familiarity with engineering materials, procurement processes, and tools like ProjectWise or similar platforms.
Electrical Hardware Lead DZYNE TechnologiesElectrical Hardware LeadPortland, OR$130,000–$170,000 / yearPhysical Demands: The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job: Must have the ability to stop, stand, climb, occasionally lift a minimum of 25 lbs. Guide integration and testing of electrical subsystems, including bench‑level validation, hardware‑in‑the‑loop testing, and flight‑ready qualification.
Principal Hardware Engineering Manager Microsoft CorpPrincipal Hardware Engineering ManagerHillsboro, OR$142,800–$274,800 / yearExperienced understanding of debug systems and methodologies used in datacenters, modern computer architectures or System on Chip features like virtualization technologies or major architectural blocks like Memory Controllers or Central Processing Units or Storage or Networking solutions for Cloud or Datacenter infrastructures. Preferred Qualifications: 10+ years of experience of technical or management leadership as a Datacenter platform manager or software engineering manager or validation/debug organization manager or equivalent industry datacenter debug leadership positions.
Hardware Engineering Manager Lam Research CorpHardware Engineering ManagerTualatin, ORYou will lead a team responsible for designing and integrating complex opto‑mechanical and electro‑mechanical assemblies, working in close partnership with Electrical Engineering, Firmware Engineering, and other functional teams to ensure cohesive system architectures to build sensor sub-systems that are robust, manufacturable, and seamlessly integrated at the system level. Our teams operate at the intersection of mechanical systems, optics, electronics, controls, software, and data science-partnering globally to deliver robust, high‑performance solutions that accelerate innovation, improve tool intelligence, and enable next‑generation capabilities across all Lam product lines.
Principal Hardware Technical Program Manager Microsoft CorpPrincipal Hardware Technical Program ManagerPortland, OR$142,800–$274,800 / yearLead a virtual team of functional leads including members from hardware and software engineering, sourcing, supply chain, networking and datacenter operations for documenting a clear Plan-of-Record (POR) for the new product development and leading the project team to meet stated milestones. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
NewSoftware & Hardware Testing Architect I Daimler Truck North AmericaSoftware & Hardware Testing Architect IPortland, OregonAs a Software Release Management Engineer I, you will help support and improve the release management processes that enable software delivery across Daimler Truck's growing Software-Defined Vehicle (SDV) portfolio. Working alongside experienced release management professionals, you will gain exposure to enterprise process management, software development lifecycles, Agile methodologies, and Software-Defined Vehicle delivery strategies.
NewComputer Hardware and Software Support 1 AZAD Technology PartnersComputer Hardware and Software Support 1Portland, OROne or more of the following Certifications: Microsoft Certified Desktop Support Technician (MCDST) Certified Software Asset Manager (CSAM) Certified Hardware Asset Management Professional (CHAMP) Certified IT Asset Manager (CITAM). AZAD is looking for bright, talented, flexible, and customer centric problem solvers who enjoy the challenges associated with solving the most complex problems by utilizing the most sophisticated technologies and strong people skills.
NewSoftware & Hardware Testing Architect I Daimler Trucks North America LLCSoftware & Hardware Testing Architect IPortland, OR$78,000–$100,000 / yearAs a Software Release Management Engineer I, you will help support and improve the release management processes that enable software delivery across Daimler Truck''s growing Software-Defined Vehicle (SDV) portfolio. Working alongside experienced release management professionals, you will gain exposure to enterprise process management, software development lifecycles, Agile methodologies, and Software-Defined Vehicle delivery strategies.