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The LSB is part of SC Johnson, a family-owned company and leading manufacturer of household cleaning, home storage, air care, pest control and shoe care products, as well as professional products. In this highly visible role, you'll drive packaging strategy, advance sustainability initiatives, and collaborate across functions to deliver solutions that balance consumer needs, technical performance, and business objectives.

Method

Manager, Packaging Engineer

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Job Summary: The Senior Optical Packaging Engineer is responsible for developing & implementing a high-performance & robust fiber-to-chip package and a scalable packaging process for optical systems comprised of optical fibers attached to a variety of chip-based photonic integrated circuits. Our application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact.

YEAR

PsiQuantum

Senior Optical Packaging Engineer

FULL_TIME

Backed by strong funding and validated by commercial programs with Tier 1 industry leaders, Axiado has earned recognition through numerous industry awards, including the 2026 AI in Cybersecurity Innovation Award from TMCnet, a Diamond award for Zero Trust Solution of the Year at the 2026 Pinnacle Awards, and Gold at the 2026 Cybersecurity Excellence Awards for AI Security Solution, as well as being a finalist for the Start-Up to Watch Award from the Global Semiconductor Alliance. Founded in 2019, we’re a fast-growing, well-funded team of over 180 people worldwide, building the Trusted Control/Compute Unit (TCU), a new class of semiconductor that integrates hardware security, real-time platform management, and AI-driven optimization.

Axiado

Senior IC Packaging Engineer

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Axiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Company's 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliance's 2025 "Start-Up to Watch" award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.

Axiado Corporation

If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.

<p>Applied Materials (Nasdaq: AMAT) is the leader in Materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible the technology shaping the future. To support customers around the world, Applied Materials employs approximately 22,000 people in over 100 locations in 18 countries.</p> 




Applied Materials Inc

Sr Packaging Engineer

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The role spans early routing feasibility through manufacturing release and includes high-speed serial interfaces, clock and control signals, and high-current power delivery within demanding electrical, mechanical, and fabrication constraints. Perform physical layout of organic substrates and interposers, including die, bump-map and netlist alignment, escape routing, signal and power routing, reference planes, via structures, and stack-up implementation.

Eridu

Packaging Engineer

Working under general supervision, this individual will independently execute packaging development activities, support packaging validation efforts, coordinate supplier and laboratory activities, and contribute to the successful commercialization and lifecycle management of products. As a senior professional, this position support the design, development, validation, commercialization, and sustaining of sterile and non-sterile packaging systems for medical device and capital equipment products for Stroke, Vascular, and Robotics business units.

Imperative Care

The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability. Act as the key technical interface with our contract manufacturing partners, coordinating process design, implementation, and characterization to ensure a smooth transition from development to high-volume production.

nEye.ai

Principal Packaging Engineer, Optical Interfaces

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Collaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Roles and Responsibilities: Supports MediaTek's Memory packaging technology development including but not limited to HBM package, cHBM, LPDDR package for mobile applications, In Package Memory (IPM) for Edge AI, etc.

MediaTek Inc

Memory Packaging Engineer

Packaging engineers play an important role at TI which encompasses the following responsibilities: Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products.

Texas Instruments Incorporated

Career Accelerator Program - Packaging Engineer - Phd

Packaging engineers play an important role at TI which encompasses the following responsibilities: Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment.

Texas Instruments Inc

Career Accelerator Program - Packaging Engineer - PhD

The ideal candidate will have extensive experience with high-power package and board designs, robust power delivery networks, and high-speed signaling solutions in advanced packaging. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.

Etched AI

Advanced Packaging Si/Pi Engineer

We are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program.

Coherent Corp

Senior Fiber Optic Module Packaging Engineer

ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. Minimum Qualifications: Master's degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, Mechanical Engineering, or a related field, plus at least five years of relevant industry experience is required.

Analog Devices Inc

Staff Engineer, Semi Packaging Engineering

Qualification plans to characterize and validate packaging solutions for product and it's FRU (Field replaceable unit), subassemblies or components as per industry or internal specifications by working closely with HW design (mechanical, thermal, electrical etc.) Come out with innovative ideas for cost optimization, durability during shipping, environmental impact, and compliance with safety regulations. In this role, you'll combine technical expertise with innovative problem-solving to plan & execute all qualifications activities for cutting-edge packaging designs, ensuring they meet the stringent demands of all global shipping environments.

Nexthop Systems Inc

Packaging Design & Validation Engineer

Reporting to the Logistics Manager, you will own end-to-end packaging across all four material paths: inbound components from our global supply base to our manufacturing site in Brisbane, CA; completed systems outbound from Brisbane to customer sites; components and assemblies moving direct from suppliers to customer sites; and spare parts and service materials cycling to and from customer sites in the field. Own packaging design and development across all four material paths - inbound components from global suppliers to Brisbane; completed systems outbound to customer deployment sites; structural components shipping direct from suppliers to active construction sites; and spare parts and service kits moving to and from customer sites in the field.

Mytra

Senior Packaging Engineer

Owner of RFQ s and contract management - ensure Non-Disclosure Agreements, General Terms & Conditions, Piece Price Agreements, and other related contracts are negotiated, agreed and appropriately documented before business is initiated. Spearhead Root cause analysis and permanent countermeasures with the manufacturer, cross functional team of engineers, GSMs and QE with appropriate mitigation strategies.

Tesla Inc

IC Packaging Engineer, Module Integration

The Meta Infrastructure team designs, builds, brings-up, tests and integrates hardware systems that power Meta's platforms, deployed in data centers worldwide, from silicon to sheet metal. People who choose to build their careers by building with us at Meta help shape a future that will take us beyond what digital connection makes possible today-beyond the constraints of screens, the limits of distance, and even the rules of physics.

Meta Platforms Inc

Silicon Packaging Engineer

Design and develop multi-fiber module packaging for fiber optic devices and modules to create the physical structures, including enclosure, fiber mounting, connection, and sealing. Proficient computer skills, experience with Word, Excel, Outlook, PowerPoint, Email, internet access and the ability to develop tools and/or special applications within these packages.

Packaging Engineer Jobs in Sunnyvale, CA

Manager, Packaging Engineer Method

Senior Optical Packaging Engineer PsiQuantum

Senior IC Packaging Engineer Axiado

Senior IC Packaging Engineer Axiado Corporation

Sr Packaging Engineer Applied Materials Inc

Packaging Engineer Eridu

Sr Packaging Engineer Imperative Care

Principal Packaging Engineer, Optical Interfaces nEye.ai

Memory Packaging Engineer MediaTek Inc

Career Accelerator Program - Packaging Engineer - Phd Texas Instruments Incorporated

Career Accelerator Program - Packaging Engineer - PhD Texas Instruments Inc

Advanced Packaging Si/Pi Engineer Etched AI

Senior Fiber Optic Module Packaging Engineer Coherent Corp

Staff Engineer, Semi Packaging Engineering Analog Devices Inc

Packaging Design & Validation Engineer Nexthop Systems Inc

Senior Packaging Engineer Mytra

IC Packaging Engineer, Module Integration Tesla Inc

Silicon Packaging Engineer Meta Platforms Inc

Senior Fiber Optic Module Packaging Engineer LightWorks Optical Systems

Senior Fiber Optic Module Packaging Engineer II-VI Optical Systems, Inc.

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