NVH Attribute Engineer ICONMA, LLCNVH Attribute EngineerFoster City, CA$74.51–$79.51 / hourDefining and assuring NVH content is developed to meet requirements, Creating and collaborating on CAE and hardware plans, Reporting out status during gate reviews and engineering meetings, as required. Represent NVH in packaging meeting and design gates to execute the NVH content strategy in CAD, and provide an NVH input for packaging studies.
NewSenior Physical Design Engineer/Lead Altera SemiconductorSenior Physical Design Engineer/LeadSan Jose, California$149,100–$215,000 / yearBachelor's degree in Electrical Engineering, Computer Engineering, or a related technical discipline with 10+ years of industry experience in physical design, physical implementation, or SoC backend design, including the following: 10+ years of hands-on experience in digital ASIC and/or SoC physical design, including synthesis, floorplanning, place-and-route, clock tree synthesis (CTS), routing, engineering change order (ECO) implementation, and signoff. You will interface with architecture, logic design, DFT, CAD/EDA, and manufacturing teams to achieve our performance/power/area (PPA) goals, with particular emphasis on programmable logic structures, block and full-chip integration, and the unique demands of FPGA technologies (e.g., configurable logic blocks, routing fabrics, I/O rings, on-chip power domains).
NewSenior Engineer RTL Power Macro Modeling Samsung SemiconductorSenior Engineer RTL Power Macro ModelingSan Jose, CA$138,000–$206,000 / yearThe role builds these models from S-parameter models of the interconnect, calibrates them against circuit-level references, and makes them fast enough to run over long workload traces. Proven self-discipline and professional maturity to execute independent research and meet rigorous milestones with a strong sense of accountability for both personal and collective goals in a fast-paced, on-site environment.
NewReliability Engineer (Hardware) LightmatterReliability Engineer (Hardware)Mountain View, CA$142,000–$200,000 / yearYou will enable our products to meet or exceed reliability requirements throughout their lifecycle by developing robust test protocols, analyzing failures, and working with cross-functional teams to drive improvements in design and manufacturing processes. Perform detailed root cause analysis of device failures, and collaborate with cross-functional teams to resolve reliability issues, refine product designs, and improve process robustness.
Forward Deployed Engineer MaxinsightsForward Deployed EngineerSanta Clara, CaliforniaYour core mission is to deeply understand clients' academic and commercial requirements, acquire and align dataset specifications (Specs), design and produce high-quality multimodal motion and scene simulation data, execute rigorous data governance, and conduct agile, high-frequency iterative validations both within and outside the team. Communicate directly with Embodied AI and World Model researchers to thoroughly analyze their large models' architectural requirements for input data (e.g., perception camera FOV, LiDAR precision, robotic arm dynamic constraints, and specific action trajectory formats).
NewStaff Photonics Design Engineer LightmatterStaff Photonics Design EngineerMountain View, CA$200,000–$225,000 / yearThe company invented the world's first 3D-stacked photonics engine, Passage, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads. You will collaborate closely with cross-functional teams including photonics, packaging, systems, and software to define and refine specifications, ensuring that all designs meet or exceed performance targets and align with product requirements.
NewStaff/Sr Staff Electrical Design Engineer LightmatterStaff/Sr Staff Electrical Design EngineerMountain View, CA$186,000–$250,000 / yearYou will lead and own HW systems efforts, collaborate closely with teams across hardware and software, including mechanical, packaging, and IC engineering, to design, integrate, troubleshoot and release system-level products at the leading edge of innovation. The company invented the world's first 3D-stacked photonics engine, Passage, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.
Formal Design Verification Engineer MicrosoftFormal Design Verification EngineerMountain View, CA$119,800–$234,700 / yearDoctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR equivalent experience. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200 - $261,000 per year.
NewSr. Staff Thermal Engineer LightmatterSr. Staff Thermal EngineerMountain View, CA$166,000–$262,000 / yearExperience in designing, modeling, testing, sourcing, and deploying advanced thermal management technologies such as TECs, heat pipes, vapor chambers, thermal interface materials, phase change materials, as well as liquid and air cooling systems. Your work will contribute to advanced package and system designs that meet power dissipation, assembly, and reliability requirements while delivering system-level solutions for leading-edge products in data centers and high-end compute segments.
Hardware Test Engineer DensityAIHardware Test EngineerMountain View, CA$230,000–$290,000 / yearDevelop and run package-level test — socket-based bring-up and validation of packaged units: power-up, interface/interconnect continuity, and functional/parametric checks against spec (boardpackage interface, not ATE silicon device test). Package and board test hardware experience (sockets, connectors, load boards, fixtures) and the signal/power integrity that comes with high-speed, high-current test.
Build and OS Packaging Technical Lead, Production Engineering Everpure, IncBuild and OS Packaging Technical Lead, Production EngineeringSanta Clara, CAIn this role, you will drive technical direction, raise engineering execution, and work closely with product, infrastructure, and release teams to improve build performance, reliability, and developer productivity. We have been named Fortune''s Best Workplaces in Technology, Fortune''s Best Workplaces in the Bay Area, and certified as a Great Place to Work!
Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging NVIDIA CorpSenior System and Manufacturing CoDesign Architect - Power, Thermal and PackagingSanta Clara, CAWhat you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.
Package Engineer Delos DataPackage EngineerPalo Alto, CaliforniaSelect and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.
Principal Package Design Engineer Renesas Electronics CorpPrincipal Package Design EngineerSan Jose, CA$195,000–$240,000 / yearAt Renesas Electronics, we are a global leader in microcontrollers, analog, power, and SoC products, delivering trusted embedded design innovation that shapes the way we live, work, and connect. As the industry pivots toward AI/ML hardware, high-performance computing, automotive innovation, and advanced power architectures (including SiC and GaN), semiconductor packaging has evolved from a protective enclosure into a primary driver of system performance.
Senior Principal Engineer, Hardware Application Engineering Board & System Design Veracity Software IncSenior Principal Engineer, Hardware Application Engineering Board & System DesignSanta Clara, CAMotivation / Reason for Relocation (if not local): Motivation / Reason for Interest in this Position: Contact Number: Email ID: LinkedIn Profile URL: Current Location (City, State): Full Address (Street, City, State, ZIP Code): Current Work Authorization Status: Expected Salary: Notice Period: Are you willing to relocate on your own expense and work onsite in Santa Clara, California? Full Name: Highest Education (Institution, Degree & Graduation Year): Total Years of Hardware Design Experience: Total Years of Board & System Design Experience: Do you have at least 15 years of experience in hardware design, development, and validation of high-speed networking or compute systems?
Physical Design Engineer Broadcom IncPhysical Design EngineerSan Jose, CABachelor's degree in Electrical Engineering or Computer Science and 12+ years related work experience; or a Master's degree in Electrical Engineering or Computer Science and 10+ years related work experience. As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth.
DMTS Design Engineer Micron Technology IncDMTS Design EngineerSan Jose, CA$237,000–$416,000 / yearDepartment Overview: DRAM Engineering (DRAM Memory) focuses on designing and developing Micron's industry leading dynamic random access memory products. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Senior Linux Platform Engineer - Santa Clara Perficient IncSenior Linux Platform Engineer - Santa ClaraSanta Clara, CA$64,974–$149,880 / yearProudly serving clients that represent the world's most innovative brands, and in collaboration with our powerful technology partner ecosystem, we bring deep industry expertise and data-driven design to redefine how businesses run and succeed. The salary range for this position takes into consideration a variety of factors, including but not limited to skill sets, level of experience, applicable office location, training, licensure and certifications, and other business and organizational needs.
NewSr Avionics Engineer LongshotSr Avionics EngineerAlameda, CaliforniaTo comply with U.S. Government export regulations, applicants must be a (i) U.S. citizen or national, (ii) U.S. lawful permanent resident (green card holder), (iii) refugee under 8 U.S.C. § 1157, or (iv) asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. With full end-to-end ownership, you'll design electronics that withstand 250g and function through hypersonic flight, build and test them yourself, and move at a pace no large aerospace company can match.
Physical Design Engineer DensityAIPhysical Design EngineerMountain View, California$230,000–$400,000 / yearDemonstrated ability to work closely with architects, RTL designers, EDA vendors, and foundries to design and sign off complex chips. (Optional) Multi-die packaging (CoWoS, 2.5D / 3D), thermal / IR / EM signoff, signal integrity, or DFT-aware physical design.
Physical Design Timing Engineer DensityAIPhysical Design Timing EngineerMountain View, CA$220,000–$350,000 / yearDemonstrated ability to work closely with architects, RTL designers, EDA vendors, and foundries to design and sign off complex chips. Exceptional abilities across the full physical design flow (synthesis, place & route, CTS, signoff) with emphasis on timing flows and methodologies.
Sr. RF Front-End Module Design Engineer RFIC Engineering Space Exploration Technologies CorpSr. RF Front-End Module Design Engineer RFIC EngineeringSunnyvale, CA$170,000–$235,000 / yearIntegrate RFICs (PAs, LNAs, switches), power management ICs, BAW/SAW filters, printed passives, and SMDs into compact MCMs. ITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
Electrical Engineer, Hardware Systems DensityAIElectrical Engineer, Hardware SystemsMountain View, CA$200,000–$320,000 / yearOptional) High-current PDN for accelerators/GPUs; server/board design at hyperscale; FPGA-based systems; firmware / low-level bring-up; thermal co-design; ANSYS HFSS/SIwave or equivalent EM tools. Design and bring up the electrical hardware that turns our AI accelerator silicon into working systems — boards, power delivery, and system-level electrical design from schematic through lab bring-up and validation.
NewPackaging Engineer KLA CorporationPackaging EngineerMilpitas, CA$83,400–$141,800 / yearDemonstrated or detailed knowledge of packaging materials including paperboard, containerboard, plastic films, foam cushions, wood and lumber products, as well as their fabrication, conversion methodologies and application, cushion package design and the various types and characteristics of transportation/conveyance equipment, as well as typical application of equipment for product and packaging material handling and distribution. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world's leading technology providers to accelerate the delivery of tomorrow's electronic devices.
Senior IC Packaging Development Engineer NVIDIA CorpSenior IC Packaging Development EngineerSanta Clara, CAWith competitive salaries and a generous benefits package, we are widely considered to be one of the technology world's most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing. This will include planning & driving related R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn-around-time, reliability, and chip-package interaction.
Senior Fiber Optic Module Packaging Engineer II-VI Optical Systems, Inc.Senior Fiber Optic Module Packaging EngineerSunnyvale, CAWe are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program.
Memory Packaging Engineer MediaTek IncMemory Packaging EngineerSan Jose, CACollaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Roles and Responsibilities: Supports MediaTek's Memory packaging technology development including but not limited to HBM package, cHBM, LPDDR package for mobile applications, In Package Memory (IPM) for Edge AI, etc.
Advanced Packaging Integration Engineer Applied MaterialsAdvanced Packaging Integration EngineerSanta Clara, CA$161,000–$221,000 / yearJoin the Photonics Platform Business Group at Applied Materials located in Santa Clara headquarters, work with a high caliber cross-functional research team to develop advanced packaging solutions for next-generation smart glasses and high‑performance optical interconnects. In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
Signal Integrity & Interconnect Engineer - High‑Speed Channels & mmWave Packaging POINT2 TECHNOLOGY INCSignal Integrity & Interconnect Engineer - High‑Speed Channels & mmWave PackagingSan Jose, CADesign and optimize the high‑speed interconnect "highways" that enable Point2's next‑generation ultra‑high‑speed data‑center links. Work across die, package, PCB, and complex mechanical connectors to ensure flawless signal transmission at mmWave and sub‑THz frequencies.
Global Product Support (Gps) Engineer - Advanced Packaging Applied MaterialsGlobal Product Support (Gps) Engineer - Advanced PackagingSanta Clara, CA$124,000–$171,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.
Senior Signal Integrity Engineer - LPU Packaging NVIDIA CorpSenior Signal Integrity Engineer - LPU PackagingSanta Clara, CADevelop and execute simulation flows for advanced packaging technologies, including 2.5D, 3D, and multi-die integration, with strong focus on channel loss, discontinuities, return path behavior, and crosstalk. We have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our world-class engineering teams are growing fast.
Senior DFT Engineer NVIDIA CorpSenior DFT EngineerSanta Clara, CAWhat you'll be doing: You will be responsible for all aspects of testing including methodology, logic insertion, verification, test pattern generation, test program bring-up, and complex debug/FA to resolve any issues. Experience in doing ATE test program development and bring-up including spec'ing custom test methods needed for data collection.
Senior, Packaging Design Engineer Intuitive Surgical IncSenior, Packaging Design EngineerSunnyvale, CAThis individual will use sound engineering judgement and independently drive new product development (NPD) and sustaining engineering efforts through cross functional collaboration, ensuring designs meet stringent clinical, functional, global regulatory (FDA, ISO 11607, EU), and quality requirements. The Medical Device Packaging Design Engineer is a critical engineering role responsible for the design, development, verification, and launch of next-generation mechanical packaging systems for sterile and non-sterile medical devices such as surgical instruments, disposables, and electromechanical capital equipment.
Lead Mission Systems & Integration Engineer – Special Programs ArcherLead Mission Systems & Integration Engineer – Special ProgramsSan Jose, CA$138,200–$190,100 / yearThe Lead Special Programs Engineer – Mission Systems & Integration brings deep mission systems engineering expertise as their organic core competency — defining and integrating the payloads, sensors, and mission equipment that let prototype vehicles perform their intended mission. Special Programs engineers are chosen for deep discipline expertise and the versatility to support wherever a program needs it — from early opportunity evaluation to hands-on prototype work across disciplines.
Process Engineer, Advanced Packaging Applied Materials IncProcess Engineer, Advanced PackagingSanta Clara, CA$124,000–$171,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Process Engineer - Advanced Packaging Applied Materials IncProcess Engineer - Advanced PackagingSanta Clara, CA$147,000–$202,500 / yearRole Responsibilities: Design, collect data, analyze, and compile results for complex process engineering experiments across multiple process modules; apply findings to establish process baseline, monitor performance and stability. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor.
Senior Engineer, Semi Packaging Engineering Analog Devices IncSenior Engineer, Semi Packaging EngineeringSan Jose, CA$109,940–$151,168 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. This role will work closely with Business Units, global operations, and external partners to deliver robust, scalable NPI packaging solutions while enabling supply chain resilience and continuous improvement in our development systems.
NewPackaging Compliance Analyst Ursus, Inc.Packaging Compliance AnalystFoster City, CA$47–$57.93 / hourAssist in documenting the success or failure of trial packaging, capturing its condition upon reception at the warehouse, and its feasibility for use at the production line with Packaging Engineers, MFEs, MFG, Logistics, suppliers, SSMs, and SQEs. Become fully acquainted with all information systems regarding inventory management and logistics to support reporting, including but not limited to: PFEP, Shipping Label Tracker, Packaging Compliance Tracker, and Logistics KPIs.
Director, Product Line Manager - Advanced Packaging & Metrology (E) KLA CorporationDirector, Product Line Manager - Advanced Packaging & Metrology (E)Milpitas, CA$210,900–$369,100 / yearThis hybrid role blends technical depth with market insight, requiring leadership in both product management and strategic marketing and will be responsible for defining product strategy, driving customer adoption, and managing the full lifecycle of Advanced Packaging products. The ideal candidate will have extensive experience in advanced packaging, metrology, or inspection technologies, and a proven ability to lead and build cross-functional teams to deliver innovative solutions that meet evolving customer needs.
Sr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E) KLA CorporationSr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E)Milpitas, CA$138,500–$235,500 / yearMinimum 10+ years of experience in semiconductor manufacturing, product marketing, product management, applications engineering, yield engineering, process control, or related technical commercial roles. Doctorate (Academic) Degree and related work experience of 3 years; Master's Level Degree and related work experience of 6 years; Bachelor's Level Degree and related work experience of 8 years.
Director of Advanced IC Packaging Development Renesas Electronics CorpDirector of Advanced IC Packaging DevelopmentSan Jose, CAWith a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions.
Senior Member Of Technical Staff (Advanced Packaging Pathfinding) Applied MaterialsSenior Member Of Technical Staff (Advanced Packaging Pathfinding)Santa Clara, CAThe SMTS will operate at the intersection of technology innovation, customer roadmaps, and ecosystem collaboration, translating emerging concepts into scalable, differentiated capabilities aligned with Applied Materials' long-term strategy. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
Senior System And Manufacturing Codesign Architect - Power, Thermal And Packaging NvidiaSenior System And Manufacturing Codesign Architect - Power, Thermal And PackagingSanta Clara, CAWhat you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.
NewPackaging Graphics & Product Label Specialist 3 Intuitive Surgical IncPackaging Graphics & Product Label Specialist 3Sunnyvale, CACollaborates effectively with cross functional teams (Test Engineering, Quality, Regulatory, Project Management, Design and Document Control) and support business needs/solutions to support manufacturing needs for multiple products/BU. R&D, Regulatory, Operations, Quality, Marketing) and represent Labeling function in the core team meetings for developing labeling content, alignment and translating it into functional label layout utilizing labeling software and/or illustrating software.
Senior Packaging Designer icreativesSenior Packaging DesignerRedwood City, CaliforniaRemoteIn this role, you'll lead packaging design efforts from the earliest concept to press-ready files, collaborating with clients and internal teams to deliver packaging that's visually compelling, strategically grounded, and production-ready. They're known for building standout brands through smart strategy, impactful visuals, and packaging that jumps off the shelf (in the best way possible).
Silicon Photonics PIC Design Engineer Broadcom IncSilicon Photonics PIC Design EngineerSan Jose, CA$143,800–$230,000 / yearAs a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. In this role, you will lead the design, simulation, layout, and system-level testing of advanced silicon photonics components that power our high-performance optical interconnect solutions.
Silicon Photonics PIC Design Engineer Broadcom CorporationSilicon Photonics PIC Design EngineerSan Jose, CA$143,800–$230,000 / yearAs a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. In this role, you will lead the design, simulation, layout, and system-level testing of advanced silicon photonics components that power our high-performance optical interconnect solutions.
Senior Integrated Photonics Engineer - Active Devices and Circuits PsiQuantum CorpSenior Integrated Photonics Engineer - Active Devices and CircuitsPalo Alto, CA$150,000–$185,000 / yearDeep expertise in integrated photonic devices-including both passive and active components-with a strong focus on electro-optic phase shifters and modulators (e.g., in thin-film lithium niobate, BTO, doped silicon, or III-V materials such as InP, GaAs, AlGaAs, InGaAsP); experience with high-speed operation (10 GHz bandwidth and beyond) is a strong plus. Our application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact.
Sr. Signal and Power Integrity Engineer - SI/PI, Satellites Starlink Space Exploration Technologies CorpSr. Signal and Power Integrity Engineer - SI/PI, Satellites StarlinkPalo Alto, CAWork alongside RF engineers, antenna engineers, ASIC engineers, packaging engineers, mechanical engineers, thermal engineers, software engineers, supply chain, and production engineers (among others) to architect new products which will employ novel channels, interfaces, and power delivery strategies. As a Signal and Power Integrity Engineer on Starlink's Payload Engineering team, you'll have SI and PI ownership throughout the entire life-cycle of the portfolio of hardware that enables this connectivity, and sits at the intersection of electrical, mechanical, thermal analysis, software, and antenna/RF engineering.
Sr. SI/PI Engineer - Serdes, Satellites Starlink Space Exploration Technologies CorpSr. SI/PI Engineer - Serdes, Satellites StarlinkPalo Alto, CAWork alongside RF engineers, antenna engineers, ASIC engineers, packaging engineers, mechanical engineers, thermal engineers, software engineers, supply chain, and production engineers (among others) to architect new products which will employ novel channels, interfaces, and power delivery strategies. As a Signal and Power Integrity Engineer on Starlink's Payload Engineering team, you'll have SI and PI ownership throughout the entire life-cycle of the portfolio of hardware that enables this connectivity, and sits at the intersection of electrical, mechanical, thermal analysis, software, and antenna/RF engineering.