Software Engineer 5 - Ads Pricing & Packaging Netflix IncSoftware Engineer 5 - Ads Pricing & PackagingLos Gatos, CA$388,000–$619,000 / yearThe Ads Pricing and Packaging team is responsible for developing cutting-edge inventory management systems which support various monetization strategies, including dynamic pricing, rate card management, product packaging, inventory segmentation, and yield optimization. Skills & experience we're seeking: Professional experience in building inventory management solutions that support monetization strategies such as dynamic pricing, rate card management, product packaging, inventory split and yield management.
Lab Packaging Test Engineer I Engineer In Training (Swing Shift) Ryzen SolutionsLab Packaging Test Engineer I Engineer In Training (Swing Shift)San Jose, CA$66,560Perform testing duties within the designated workday hours according to requirements to ensure customer objectives are met through proactive communication, documentation, and customer service. Maintain responsive customer communication in email and in person regarding testing services provided, test status, updates, and results.
Lab Packaging Test Engineer I Engineer In Training (Swing Shift) Artech LLCLab Packaging Test Engineer I Engineer In Training (Swing Shift)San Jose, CA$66,560–$70,720 / yearPerform testing duties within the designated workday hours according to requirements to ensure customer objectives are met through proactive communication, documentation, and customer service. Maintain responsive customer communication in email and in person regarding testing services provided, test status, updates, and results.
Packaging Design Engineer GooglePackaging Design EngineerSunnyvale, CAFrom software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Utilize advanced Three-Dimensional/Two-Dimensional Computer-Aided Design software (SolidWorks, Artios CAD, Creo, etc.) to architect complex structural packaging solutions and generate precise technical drawings, assembly instructions, and cushion layouts.
Advanced Packaging Engineer — Fiber Array Integration CspeedAdvanced Packaging Engineer — Fiber Array IntegrationPalo Alto, CaliforniaA permanently bonded fiber array constrains the downstream flow in three respects: the engine cannot be optically qualified before fiber attach, a single failed channel scraps an assembly containing multiple high-value die, and manual fiber handling limits automation. This position owns the detachable optical interface for CspeedIO optical engines: the on-package element, the coupling optics, the alignment features, and the high-volume assembly process that joins fiber to engine without per-unit active alignment.
Packaging Process Development Engineer Amphenol SensorsPackaging Process Development EngineerFremont, CACreate and execute DOE (design of experiments) to optimize process windows and yield; analyze results using statistical tools (e.g., Minitab/JMP).Author and maintain process documentation: process sheets, work instructions, SPC/CPK reports, FMEA, PPAP/APQP packages (for automotive customers).Partner with suppliers and contract manufacturers to qualify equipment, processes, materials (epoxies, solders, plating chemistries), and subcontractor processes; perform supplier audits as needed. Software: Minitab/JMP, Excel, Word, PowerpointLab/process tools: wire bonders, flip-chip bonders, die bonders, reflow ovens, mold presses, plasma cleaning tools,, pick-and-place, X-ray/CT, SEM, C-SAM, environmental chambers for thermal/humidity testing.
Integrated Circuit Packaging Architect Engineer Advanced Micro Devices IncIntegrated Circuit Packaging Architect EngineerSan Jose, CASuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The Role: Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerSan Jose, CaliforniaSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Responsibilities: The Role : Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Senior Staff Software Engineer - Pricing and Packaging GustoSenior Staff Software Engineer - Pricing and PackagingSan Francisco, CA$189,000–$236,000 / yearThe Pricing & Packaging team sits at the heart of Gusto’s Commerce infrastructure, serving as the single source of truth for all products, bundles, add-ons, subscriptions, pricing, promotions, and discounts across Gusto’s first-party customer experience. The team owns and operates Gusto’s internal Commerce Platform including the product catalog, promotion engine, subscription, pricing experimentation platform, and entitlement services that enable Growth and other teams to bring Gusto’s offerings to market effectively.
NewSr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging Amazon.com IncSr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon PackagingCupertino, CAWe pioneered cloud computing and never stopped innovating - that's why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses. Signal & Power Integrity Engineer to join our hardware team and drive the SI/PI analysis and optimization of advanced packaging solutions for next-generation machine learning and data center ASICs.
Packaging Product Design Engineer Apple IncPackaging Product Design EngineerCupertino, CAThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products - from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerSan Jose, CAWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
Senior Staff Software Engineer - Pricing and Packaging Gusto IncSenior Staff Software Engineer - Pricing and PackagingSan Francisco, CA$189,000–$236,000 / yearAbout the Team: The Pricing & Packaging team sits at the heart of Gusto's Commerce infrastructure, serving as the single source of truth for all products, bundles, add-ons, subscriptions, pricing, promotions, and discounts across Gusto's first-party customer experience. The team owns and operates Gusto's internal Commerce Platform including the product catalog, promotion engine, subscription, pricing experimentation platform, and entitlement services that enable Growth and other teams to bring Gusto's offerings to market effectively.
Advanced Packaging Integration Engineer Applied MaterialsAdvanced Packaging Integration EngineerSanta Clara, CA$161,000–$221,000 / yearJoin the Photonics Platform Business Group at Applied Materials located in Santa Clara headquarters, work with a high caliber cross-functional research team to develop advanced packaging solutions for next-generation smart glasses and high‑performance optical interconnects. In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
Signal Integrity & Interconnect Engineer - High‑Speed Channels & mmWave Packaging POINT2 TECHNOLOGY INCSignal Integrity & Interconnect Engineer - High‑Speed Channels & mmWave PackagingSan Jose, CADesign and optimize the high‑speed interconnect "highways" that enable Point2's next‑generation ultra‑high‑speed data‑center links. Work across die, package, PCB, and complex mechanical connectors to ensure flawless signal transmission at mmWave and sub‑THz frequencies.
Principal/ Staff Engineer, Advanced Packaging Process Integration Applied Materials IncPrincipal/ Staff Engineer, Advanced Packaging Process IntegrationSanta Clara, CAThe SMTS will operate at the intersection of technology innovation, customer roadmaps, and ecosystem collaboration, translating emerging concepts into scalable, differentiated capabilities aligned with Applied Materials' long-term strategy. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
Global Product Support (GPS) Engineer - Advanced Packaging Applied Materials IncGlobal Product Support (GPS) Engineer - Advanced PackagingSanta Clara, CA$124,000–$171,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.
Global Product Support (Gps) Engineer - Advanced Packaging Applied MaterialsGlobal Product Support (Gps) Engineer - Advanced PackagingSanta Clara, CA$124,000–$171,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.
Intern, Optical Packaging and Characterization Engineer PsiQuantum CorpIntern, Optical Packaging and Characterization EngineerMilpitas, CAOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Support image processing workflows (e.g., contrast, alignment, feature extraction) using Python or similar tools and help turn results into clear tables or simple plots.
Staff Electro-Mechanical Engineer - Battery Packaging E-SpaceStaff Electro-Mechanical Engineer - Battery PackagingSaratoga, CA$120,000–$200,000 / yearWe’re intentional, we’re unapologetically curious and we’re 100% committed to innovate space-based communications and deliver actionable intelligence that will expand global economies, protect space and our planet and enhance our overall quality of life. Our team members have a strong sense of dedication and responsibility; this includes a strong commitment to our mission to create an entirely new suite of global capabilities to improve lives, business efficiencies and build a smarter planet.
Intern, Optical Packaging And Characterization Engineer PsiQuantumIntern, Optical Packaging And Characterization EngineerMilpitas, CAOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Support image processing workflows (e.g., contrast, alignment, feature extraction) using Python or similar tools and help turn results into clear tables or simple plots.
Senior Power Integrity Engineer - LPU Packaging NVIDIA CorpSenior Power Integrity Engineer - LPU PackagingSanta Clara, CA$196,000–$310,500 / yearWe have some of the most forward-thinking and hardworking people in the world working with us and our product lines are growing fast in some of the hottest state-of-the-art fields such as Artificial Intelligence, Deep Learning, Autonomous Vehicles, and Robotics. A deep understanding of board-level PDN design, including stack-up definition, plane partitioning, and VRM placement on high-layer-count accelerator boards.
Advanced Packaging Reliability Engineer OpenAI LLCAdvanced Packaging Reliability EngineerSan Francisco, CAFor unincorporated Los Angeles County workers: we reasonably believe that criminal history may have a direct, adverse and negative relationship with the following job duties, potentially resulting in the withdrawal of a conditional offer of employment: protect computer hardware entrusted to you from theft, loss or damage; return all computer hardware in your possession (including the data contained therein) upon termination of employment or end of assignment; and maintain the confidentiality of proprietary, confidential, and non-public information. In-depth knowledge of advanced packaging architectures, including 2.5D and 3.5D integration, interposers, embedded bridges, chiplets, large package substrates, HBM integration, redistribution layers, and package-level power delivery.
Senior Signal Integrity Engineer - LPU Packaging NVIDIA CorpSenior Signal Integrity Engineer - LPU PackagingSanta Clara, CADevelop and execute simulation flows for advanced packaging technologies, including 2.5D, 3D, and multi-die integration, with strong focus on channel loss, discontinuities, return path behavior, and crosstalk. We have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our world-class engineering teams are growing fast.
Senior Mechanical Engineer (Packaging And Integration) KLA CorporationSenior Mechanical Engineer (Packaging And Integration)Milpitas, CA$117,800–$200,300 / yearEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world's leading technology providers to accelerate the delivery of tomorrow's electronic devices.
Manufacturing Design Engineer (MDE) - Packaging Apple IncManufacturing Design Engineer (MDE) - PackagingCupertino, CADevelop innovative solutions that enable Apple's Product and Environmental goals, including but not limited to manufacturability of fiber-based designs, lowering Apple's environmental footprint, and developing world class manufacturing solutions. (domestic and international up to 30%) A team player who is self-motived, defining and closing all engineering tasks to meet project objective, detailed oriented to cut to the root of problems, and ability to learn quickly with limited information or support.
Senior, Packaging Design Engineer Intuitive Surgical IncSenior, Packaging Design EngineerSunnyvale, CAThis individual will use sound engineering judgement and independently drive new product development (NPD) and sustaining engineering efforts through cross functional collaboration, ensuring designs meet stringent clinical, functional, global regulatory (FDA, ISO 11607, EU), and quality requirements. The Medical Device Packaging Design Engineer is a critical engineering role responsible for the design, development, verification, and launch of next-generation mechanical packaging systems for sterile and non-sterile medical devices such as surgical instruments, disposables, and electromechanical capital equipment.
Sr. Packaging Engineer Tesla IncSr. Packaging EngineerFremont, CA$96,000–$162,000 / yearThe successful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define tradition. Tesla is seeking a highly motivated Packaging Engineer to join our Packaging team in developing world-class designs for automation equipment.
Packaging Mechanical Engineer DensityAIPackaging Mechanical EngineerMountain View, CA$200,000–$275,000 / yearYou'll model warpage and stress through reflow and assembly, design the lid, stiffener, underfill and TIM stack that controls them, set the mechanical rules our OSATs build to, and own the socket and load mechanics where the package meets the cooling solution. Exceptional abilities in thermo-mechanical analysis of semiconductor packages: warpage prediction and control, die and solder-joint stress, delamination and interfacial fracture risk, and material and structural tradeoffs.
Process Engineer, Advanced Packaging Applied Materials IncProcess Engineer, Advanced PackagingSanta Clara, CA$124,000–$171,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Senior Automation Software Engineer, Optical Packaging PsiQuantum CorpSenior Automation Software Engineer, Optical PackagingMilpitas, CA$130,000–$170,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
Process Engineer - Advanced Packaging Applied Materials IncProcess Engineer - Advanced PackagingSanta Clara, CA$147,000–$202,500 / yearRole Responsibilities: Design, collect data, analyze, and compile results for complex process engineering experiments across multiple process modules; apply findings to establish process baseline, monitor performance and stability. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor.
Senior Mechanical Simulation Engineer – Avionics & Electronics Packaging ZiplineSenior Mechanical Simulation Engineer – Avionics & Electronics PackagingSan Francisco, CA$130,000–$180,000 / yearOur customers include the world's largest and most prominent healthcare systems, governments, retailers, restaurants and global businesses who rely on us to save lives, reduce emissions, increase economic opportunity, and provide delivery from point A to point B as fast as possible. Develop structural finite element models for electronics housings, PCB assemblies, brackets, connectors, flex circuits, fasteners, heat sinks, shields, and integrated avionics modules.
ASIC Packaging Signal/Power Integrity Engineer (Hybrid) Cisco Systems IncASIC Packaging Signal/Power Integrity Engineer (Hybrid)San Jose, CA$152,500–$219,200 / yearBachelor''s degree in Electrical Engineering and 4+ years of relevant signal and power integrity experience, or Master''s degree in Electrical Engineering and 2+ years of relevant signal and power integrity experience, or PhD in Electrical Engineering and 0+ years of related experience, or equivalent related work experience. Cisco Silicon One is the only unifying silicon architecture in the market that enables customers to deploy the best-of-breed silicon from Top of Rack (TOR) switches all the way through web scale data centers and across service provider, enterprise networks, and data centers with a fully unified routing and switching portfolio.
Optical-Electronic Packaging Engineer Lumentum Inc.Optical-Electronic Packaging EngineerSan Jose, CAWith our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits. This role focuses on advanced mechanical and thermal packaging solutions for high-density, high-power optical modules, including pluggable form factors and emerging advanced packaging architectures.
Advanced Packaging Reliability Engineer OpenAIAdvanced Packaging Reliability EngineerSan Francisco, CaliforniaFor unincorporated Los Angeles County workers: we reasonably believe that criminal history may have a direct, adverse and negative relationship with the following job duties, potentially resulting in the withdrawal of a conditional offer of employment: protect computer hardware entrusted to you from theft, loss or damage; return all computer hardware in your possession (including the data contained therein) upon termination of employment or end of assignment; and maintain the confidentiality of proprietary, confidential, and non-public information. In-depth knowledge of advanced packaging architectures, including 2.5D and 3.5D integration, interposers, embedded bridges, chiplets, large package substrates, HBM integration, redistribution layers, and package-level power delivery.
Mechanical Engineer, Packaging Engineering Tesla IncMechanical Engineer, Packaging EngineeringFremont, CA$109,600–$195,600 / yearYou will serve as a highly technical contributor on the team responsible for design, optimization, prototyping and validation of new ways to deliver components safely and efficiently throughout our supply chain and manufacturing processes. Tesla is seeking a highly motivated Mechanical Design Engineer to join our Vehicle Packaging team in developing world-class designs for use in high volume automation equipment.
Senior Engineer, Semi Packaging Engineering Analog Devices IncSenior Engineer, Semi Packaging EngineeringSan Jose, CA$109,940–$151,168 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. This role will work closely with Business Units, global operations, and external partners to deliver robust, scalable NPI packaging solutions while enabling supply chain resilience and continuous improvement in our development systems.
Sr. Industrial Designer (Packaging) SanDisk CorpSr. Industrial Designer (Packaging)Milpitas, CAAn employee's pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs. Sandisk is looking for a Senior Packaging Industrial Designer to join global industrial design team to design 3D structural packaging solutions for world‑class consumer storage products.
Sr. Technical Program Manager, Packaging Tesla IncSr. Technical Program Manager, PackagingFremont, CA$112,000–$217,200 / yearFremont s packaging engineering team is seeking a Packaging Technical Program Manager to lead the scheduling, risk management, and status communication for innovative packaging programs, collaborating closely with packaging engineers to develop and implement cutting-edge solutions. In this role, you will partner with a broad cross-functional team-including supply chain, design, planning, manufacturing, and material flow stakeholders-to identify, prioritize, and execute packaging projects that support production ramp-up and drive overall cost reductions.
NewPackaging Compliance Analyst Ursus, Inc.Packaging Compliance AnalystFoster City, CA$47–$57.93 / hourAssist in documenting the success or failure of trial packaging, capturing its condition upon reception at the warehouse, and its feasibility for use at the production line with Packaging Engineers, MFEs, MFG, Logistics, suppliers, SSMs, and SQEs. Become fully acquainted with all information systems regarding inventory management and logistics to support reporting, including but not limited to: PFEP, Shipping Label Tracker, Packaging Compliance Tracker, and Logistics KPIs.
Director, Product Line Manager - Advanced Packaging & Metrology (E) KLA CorporationDirector, Product Line Manager - Advanced Packaging & Metrology (E)Milpitas, CA$210,900–$369,100 / yearThis hybrid role blends technical depth with market insight, requiring leadership in both product management and strategic marketing and will be responsible for defining product strategy, driving customer adoption, and managing the full lifecycle of Advanced Packaging products. The ideal candidate will have extensive experience in advanced packaging, metrology, or inspection technologies, and a proven ability to lead and build cross-functional teams to deliver innovative solutions that meet evolving customer needs.
Sr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E) KLA CorporationSr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E)Milpitas, CA$138,500–$235,500 / yearMinimum 10+ years of experience in semiconductor manufacturing, product marketing, product management, applications engineering, yield engineering, process control, or related technical commercial roles. Doctorate (Academic) Degree and related work experience of 3 years; Master's Level Degree and related work experience of 6 years; Bachelor's Level Degree and related work experience of 8 years.
Director of Advanced IC Packaging Development Renesas Electronics CorpDirector of Advanced IC Packaging DevelopmentSan Jose, CAWith a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions.
NewCloud Hardware Development, Packaging, Network Product Development - Optics Amazon.com IncCloud Hardware Development, Packaging, Network Product Development - OpticsCupertino, CAYou will perform high-quality design, development, validation, and sustaining engineering of IC and SOC packages for high-speed applications, working closely with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust solutions at scale. Within AWS Networking the NPD (Network Product Development) organization is responsible for, designing the hardware, building the software, and owning the interconnects for the routers that power the global AWS network.
Technologist, Packaging Engineering SanDisk CorpTechnologist, Packaging EngineeringMilpitas, CAProvide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level. ESSENTIAL DUTIES AND RESPONSIBILITIES: Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
Executive Director of R&D Engineering for 3DIC-Advance Packaging Synopsys IncExecutive Director of R&D Engineering for 3DIC-Advance PackagingSunnyvale, CALead the global engineering organization responsible for 3DIC silicon IP and advanced packaging design, covering layout, physical design, signal integrity, power integrity, thermal modeling, and mechanical stress analysis for AI infrastructure and HPC products. Experience working effectively in highly matrixed, global organizations, influencing across EDA development, product management, go-to-market, manufacturing, and customer success teams without direct reporting authority.
Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging NVIDIA CorpSenior System and Manufacturing CoDesign Architect - Power, Thermal and PackagingSanta Clara, CAWhat you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.
Senior Member Of Technical Staff (Advanced Packaging Pathfinding) Applied MaterialsSenior Member Of Technical Staff (Advanced Packaging Pathfinding)Santa Clara, CAThe SMTS will operate at the intersection of technology innovation, customer roadmaps, and ecosystem collaboration, translating emerging concepts into scalable, differentiated capabilities aligned with Applied Materials' long-term strategy. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
Senior System And Manufacturing Codesign Architect - Power, Thermal And Packaging NvidiaSenior System And Manufacturing Codesign Architect - Power, Thermal And PackagingSanta Clara, CAWhat you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.