April 16, 2026For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above. If you received an email purporting to be from Leidos that asks for payment-related information or any other personal information (e.g., about you or your previous employer), and you are concerned about its legitimacy, please make us aware immediately by emailing us at LeidosCareersFraud@leidos.com.
April 16, 2026For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above. If you received an email purporting to be from Leidos that asks for payment-related information or any other personal information (e.g., about you or your previous employer), and you are concerned about its legitimacy, please make us aware immediately by emailing us at LeidosCareersFraud@leidos.com.
li>DFX: ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense / Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly / Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assembly (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding), Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills /Edge bonding / Potting, Pack and Ship, Chassis Assembly (fluidics, electrical enclosure, cable routing), Sheet Metal ,Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe). PCBA ASSEMBLY : ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI),Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes.