Senior Technical Program Manager - ASIC, Amazon Leo

Amazon LEO is an initiative to increase global broadband access through a constellation of 3,236 satellites in low Earth orbit (LEO). Its mission is to bring fast, affordable broadband to unserved and underserved communities around the world. Amazon LEO will help close the digital divide by delivering fast, affordable broadband to a wide range of customers, including consumers, businesses, government agencies, and other organizations operating in places without reliable connectivity.

The Amazon LEO team is looking for a Sr. Technical Program Manager with experience in complex ASIC/SOC development of managing various phases of pre-silicon such as architecture, front end design, pre-silicon verification, FPGA prototyping, Emulation, Physical design, BROM, FW, substrate and package design, Tapeout; and post-silicon phases such as silicon manufacturing with foundry and OSAT, silicon bring-up, functional and system validation, embedded FW/SW, ATE, Reliability, Qual, and NPI. The role will interface with cross-functional engineering and program/product management teams to develop ASIC/SOCs solutions that will go into Satellites and Ground equipment/terminals. Join us and make a difference in the lives of people around the world.

Export Control Requirement:

Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Key job responsibilities

• Collaborate with engineering leaders (ASIC/SOC leads) to create project execution plans for ASIC/SOC development considering all criteria to design products the meet the power/performance and functional specs for all use conditions.
• Work with ASIC, communication system, EE, and software teams to define ASIC bring-up readiness and test plans.
• Work with product/program management lead to ensure that ASIC/SOC development meets schedule, cost, and quality requirements.
• Drive engineering project execution, make technical trade-off recommendations, understand the technical challenges, enable solutions, track and report on status, and resolve blocking issues.
• Collaborate with Architecture, hardware, software, firmware, packaging and PCB teams on ensuring cross-functional deliverables are identified and tracked.
• Work with external IP, Fabs, OSAT silicon services and partners to complete the execution of projects in time.

A day in the life

You must be fully competent in a variety of project management tools, SOC/IP design methodologies and techniques for all phases of the project life-cycle and exhibit demonstrated proficiency in core project management disciplines including scope, schedule, budget, resources, quality and risk management, reporting and metric development/tracking. In addition, the candidate needs to drive ASIC bring-up readiness (HW/SW) and ASIC bring-up plan. Lastly, the candidate should have the experience of working through the various design phases of Silicon development from architecture definition, RTL design, Verification, IP design, Physical design, silicon bring up, test, characterization, quality, reliability and post silicon management.