Automation, Communication Skills, Corrective Action, Customer Relations, Diversity, Electrical Engineering, Interviewing Skills, Manufacturing, Manufacturing Process Engineering, Manufacturing/Industrial Processes, Material Science, Mechanical Engineering, Operational Support, Presentation/Verbal Skills, Problem Solving Skills, Process Control Engineering, Process Development, Process Engineering, Productivity Management, Python Programming/Scripting Language, Risk, Root Cause Analysis, SQL (Structured Query Language), Semiconductor Manufacturing, Statistics, Technical Writing, United States Department of Energy (DOE), Wafer Manufacturing, Writing Skills
LOCATION
Greensboro, NC
POSTED
14 days ago
It''s fun to work in a company where people truly BELIEVE in what they''re doing!
We''re committed to bringing passion and customer focus to the business.
If you like wild growth and working with happy, enthusiastic over-achievers, you''ll enjoy your career with us!
Role Overview:
We are seeking a experienced Process Engineer to lead processing of singulation and facet preparation on edge emitting laser components through the back end of line. This role will both sustain existing processes and develop processes for new technologies.
Key Responsibilities
Wafer singulation
Process development for wafer cleaving operation
Own and sustain processing of thinned wafers through the singulation and facet coating preparation
Establish and maintain processes, specifications, SPC controls, FMEAs and OCAPs
Facet Processing
Develop and sustain pick and place processes and equipment
Develop and sustain bar stacking/unstacking to and from fixtures for facet processing
Manufacturing Support & Yield Improvement
Provide real‑time engineering support for thinning operations in high‑volume manufacturing
Lead response to process excursions, tool issues, and product at‑risk situations using structured problem‑solving methods
Investigate yield losses, defects, and reliability issues and implement corrective and preventative actions
Utilize SPC, DOE, and statistical analysis tools to identify root causes and improvement opportunities
Required Qualifications
B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering or related discipline
5+ years of industrial experience supporting semiconductor or advanced manufacturing processes
Preferred Experience & Skills
Experience in semiconductor wafer fabrication
Experience with wafer die singulation
Experience with pick and place equipment and die handling practices
Familiarity with automation and advanced process control
Proficiency with JMP, Excel, SQL, Python, or similar data tools
Excellent written and verbal communication skills, including technical documentation
We are an equal opportunity employer and value diversity at our company.
We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.
We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.