p>Minimum Qualifications: • Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field • Minimum of 3+ years of experience in backend semiconductor processing • Hands-on experience with lapping/thinning, metallization, and thermal processes • Understanding of InP-based or III-V compound semiconductor wafer fabrication processes • Experience with AOI systems, yield analysis, and data-driven process improvement • Strong understanding of singulation, packaging interfaces, and reliability requirements • Proficiency in SPC, DOE, and statistical analysis • Ability to work across cross-functional manufacturing and engineering teams • Preferred experience with InP or III-V optoelectronic devices • Familiarity with AR/HR optical coating processes • Experience supporting high-mix, low-volume manufacturing environments preferred.
Yield Improvement, Defect Reduction, and AOI Control (25%) :
• Own and maintain AOI processes for backend defect detection and yield monitoring • Drive singulation yield improvement and defect reduction through data analysis and root-cause investigations • Analyze inline and post-process data to identify trends and systematic issues • Implement corrective and preventive actions and verify effectiveness.