p>RESPONSIBILITIES: ā¢ Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems ā¢ Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes ā¢ Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines ā¢ Own packaging prototypes, product development, and release to production ā¢ Select equipment and material to meet quality, reliability, cost, yield, and production targets ā¢ Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements ā¢ Cross-functional interface with silicon design, materials, thermal, systems, and production teams ā¢ Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond.
BASIC QUALIFICATIONS:
ā¢ Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline ā¢ 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable).