NewPrincipal Quality Engineer SelmetPrincipal Quality EngineerAlbany, ORWe have multiple facilities (Selmet, Inc. and Pacific Cast Technologies, Inc. (PCT)) in Albany, OR and are a world class supplier of titanium components and castings for the aerospace industry. components and sub-assemblies, supplying the commercial aerospace, military and industrial markets with small-to-large “function critical” products.
NewLead EPC Substation Project Engineer LeidosLead EPC Substation Project EngineerBend, OR$107,900–$195,050These consulting services provide clients with overall project management tasks in the areas of comprehensive engineering design of electrical transmission and distribution, substation and transmission line projects nationwide. March 31, 2026 For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.
Sr Engineer Software Validation MedlineSr Engineer Software ValidationRedmond, OR$101,000–$152,000 / yearExperience with the following: - QMS – ISO13485:2016 - 21 CFR 820 QSR, 21 CFR Part 11 Electronic Signature, 21 CFR 801 Labeling - GAMP Good Practice Guide: IT Infrastructure Control and Compliance (GAMP 5) - ISO / Customer / Regulator Audits - FDA Product and Establishment Registration - GS1 / GUDID Management - Quality Management System / Medical device environment experience. Direct experience operating in a medical device QMS environment, including FDA 21 CFR Part 820, ISO 13485, ISO 14971, General Principals of Software Validation, Electronic Records/Signatures.
Principal Engineer, Module Development – CMP IntelPrincipal Engineer, Module Development – CMPHillsboro, OregonThe MDCE organization is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, and partnering closely with technology development, factory, and customer teams to ensure predictable, high-quality silicon delivery. Intel is seeking an experienced and highly influential Principal Engineer, Module Development with deep expertise in Chemical Mechanical Planarization (CMP) to provide module ownership, technical leadership, and development direction across Intel's advanced logic technologies.
Principal Engineer, Module Development - CMP Intel Corp.Principal Engineer, Module Development - CMPHillsboro, OR$211,400–$298,440 / yearThe MDCE organization is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, and partnering closely with technology development, factory, and customer teams to ensure predictable, high-quality silicon delivery. Job Details: Job Description: Manufacturing Development and Customer Engineering (MDCE) is a strategic organization within Intel Foundry Technology Manufacturing focused on improving process capability across Intel's technology portfolio-from initial product qualification through high-volume manufacturing.
Principal Engineer, AMS IP Architecture IntelPrincipal Engineer, AMS IP ArchitectureHillsboro, CaliforniaD. in Electrical Engineering, Computer Engineering, or a related field with focus on high-speed communications, analog circuits, or signal processing • Deep expertise in one or more of the following: SerDes modeling in MATLAB or Simulink, high-speed analog CMOS design, DSP techniques for SerDes equalization and timing recovery, or communications theory including equalization, coding, and noise filtering • Experience analyzing and closing link budgets for NRZ or PAM4 signaling at 100Gbps or higher, accounting for transmitter impairments, channel loss, reflection, crosstalk, and receiver noise • Hands-on work with SerDes transmitter and receiver architectures, equalization techniques such as FFE, DFE, and CTLE, or CDR loop dynamics and jitter tolerance • Ability to correlate models with silicon measurements, debug discrepancies systematically, and update models to reflect real-world behavior • Familiarity with C, Verilog-A, or SystemVerilog for co-simulation or algorithm prototyping is a plus . By combining technical innovation with cross-functional collaboration, the group plays a critical role in delivering scalable, high-performance designs that support Intel's broad portfolio of market-leading technologies.
Principal Engineer, Hybrid Bonding Module Intel CorpPrincipal Engineer, Hybrid Bonding ModuleHillsboro, OR$211,400–$298,440 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Your work will directly impact Intel's ability to execute advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading performance, reliability, and cost efficiency, while shaping both internal strategy and the external ecosystem.
Principal Engineer - Standard Cell Design IntelPrincipal Engineer - Standard Cell DesignHillsboro, California$220,920–$311,890 / yearJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, California, Santa Clara Additional Locations: US, Arizona, Phoenix, US, California, Folsom, US, Oregon, Hillsboro, US, Texas, Austin Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Principal Firmware Architect Microsoft CorpPrincipal Firmware ArchitectHillsboro, OR$142,800–$274,800 / yearRequired Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
New(Remote)MBE Principal Engineer Belcan(Remote)MBE Principal EngineerRemote, RERemote$150,000–$190,000 / yearWorking knowledge of Siemens digital engineering tools, including NX advanced modules and licensing packages such as Fibersim, Mechanical Routing, Electrical Routing, PMI Advisor, Check-Mate, and Tolerance Analysis, as well as familiarity with Siemens Teamcenter applications supporting the digital thread, such as Teamcenter Quality, Teamcenter Manufacturing Process Planner, and related product lifecycle management (PLM) capabilities for managing product definition, manufacturing planning, and quality processes. * Own and drive supplier enablement and digital transformation programs, including leading supplier capability assessments, defining and executing digital transformation roadmaps, selecting pilot parts and operations, and guiding suppliers toward NSE MBE Maturity Index Level 4+ adoption.
Principal Embedded Software Engineer PanthalassaPrincipal Embedded Software EngineerPortland, OR$210,000–$290,000 / yearThe embedded software – device drivers, baremetal firmware, and embedded Linux – is what bridges the gap between hardware and the systems above it: giving the Node the ability to sense, actuate, follow commands from shore, and operate autonomously. We are a renewable energy and ocean technology company committed to rapidly developing and deploying technologies that will ensure a sustainable future for Earth by unlocking the vast energy potential of its oceans.
Principal Engineer, Digital IC Design and Architecture Analog Devices IncPrincipal Engineer, Digital IC Design and ArchitectureBeaverton, OR$157,080–$227,460 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. Responsibilities: Digital Architecture and Design: Architect and design digital blocks and subsystems of complex high-speed SerDes ICs, including Gigabit‑speed serial interfaces and video and data routing solutions.
Principal Engineer - Analog and Mixed-Signal Physical Design Microsoft CorpPrincipal Engineer - Analog and Mixed-Signal Physical DesignHillsboro, OR$142,800–$274,800 / yearDoctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. The ideal candidate brings deep Fusion Compiler-based physical implementation expertise, strong timing closure and physical verification experience, and sufficient custom layout understanding to partner effectively with analog design and layout teams while directly executing critical implementation and debug work.
["Senior Principal Engineer - AI/ML Architect","Senior Principal Engineer - AI/ML Architect"] Celestica["Senior Principal Engineer - AI/ML Architect","Senior Principal Engineer - AI/ML Architect"]PortlandRemoteAs a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development - from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud. Assystem architect,one will define the architecture of leading and competitive AI systems, lead new technologyresearch, study market trend, customers interface and lead Celestica's design team in the AI/ML infrastructure space.
Principal Systems Engineer Onto Innovation IncPrincipal Systems EngineerHillsboro, OROnto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. We are seeking a highly experienced Principal Systems Engineer to lead the architecture, integration, and validation of complex systems for advanced semiconductor Films and OCD metrology equipment.
NewPrincipal AI Network Hardware Systems Engineer Microsoft CorpPrincipal AI Network Hardware Systems EngineerHillsboro, OR$142,800–$274,800 / yearThe Platform Systems Engineering (PSE) team is seeking a Principal AI Network Hardware Systems Engineer to lead the architecture, bring-up, validation, optimization, and deployment of networking infrastructure for Microsofts MAIA AI platform. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
Staff - Principal Engineer - Oak Grove Plant VistraStaff - Principal Engineer - Oak Grove PlantOak Grove, OregonCollect and analyze plant operational and cost data to identify gaps in performance, develop potential solutions and gain consensus on path forward. We are a company of people committed to: Exceeding Customer Expectations, Great People, Teamwork, Competitive Spirit and Effective Communication.
Principal Applications Engineer (SiPh) FormFactorPrincipal Applications Engineer (SiPh)Beaverton, OregonThis role serves as a critical link between customers, Product Marketing, Engineering, Manufacturing, and Field Applications teams, ensuring FormFactor products address emerging market and technology needs. FormFactor is seeking a Principal Applications Engineer (Silicon Photonics - SiPh) to serve as a recognized technical expert in advanced semiconductor test and measurement solutions, with a primary focus on Silicon Photonics (SiPh) applications.
Substation Principal Engineer - Remote WSP Global IncSubstation Principal Engineer - RemoteLake Oswego, ORRemoteWell-developed critical thinking and problem-solving skills required to apply technical knowledge to reach conclusions from testing results, data collation, computations, statistical analysis and arriving at the most effective, economical, and logical solution. This position is responsible for SME innovation and administration, ensuring corporate compliance with all Local, State, and Federal engineering, construction, and safety regulations, and providing pragmatic directions to address current and future challenges in a rapidly changing and complex business climate.
Principal Analog Circuit Design Engineer - SerDes Intel CorpPrincipal Analog Circuit Design Engineer - SerDesHillsboro, OR$220,920–$311,890 / yearBusiness group: The Central Engineering Group (CEG) is Intel''s data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). Job Details: Job Description: We are seeking a highly experienced and motivated Principal Analog Design Engineer to lead the design and validation of cutting-edge analog circuits for high-speed (112G and 224G) SerDes applications.
Principal Collateral Device Engineer Intel Corp.Principal Collateral Device EngineerHillsboro, OR$224,970–$317,600 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Sr Principal RF Engineer FormFactor IncSr Principal RF EngineerBeaverton, OR$115,800–$151,935 / yearFormFactor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle - from characterization, modeling, reliability, and design de-bug, to qualification and production test. Our technologies directly enable next‑generation wireless and high‑speed communication systems-including 5G and mmWave modems, ultra‑high‑speed I/O interfaces, and RF solutions exceeding 100 GHz.
Senior Principal Software Engineer NikeSenior Principal Software EngineerBeaverton, OregonYou will collaborate regularly with software and machine learning engineers in Reporting & Intelligence, principal engineers in partner domains, product managers, and engineering directors to activate technical designs and plans. Driving adoption of modern engineering methodologies, including automation, continuous integration and delivery (CI/CD), MLOps/DevOps practices, test-driven development, and agile frameworks to accelerate innovation and delivery.
Senior/Principal Manufacturing Asset Engineer, HTO GenentechSenior/Principal Manufacturing Asset Engineer, HTOHillsboro, OregonYou will play a key role in day-to-day operations, as well as design and delivery of local and major capital projects, and interacts with a cross-functional team to deliver on business objectives. The Hillsboro Technical Operations (HTO) is a drug product & finished goods manufacturing organization responsible for the reliable delivery of Roche’s commercial portfolio & pipeline products.
Principal/Senior Principal Process Engineer, Aseptic Operations/Filling GenentechPrincipal/Senior Principal Process Engineer, Aseptic Operations/FillingHillsboro, OregonGenentech's Hillsboro Technical Operations (HTO), located in Hillsboro Oregon, is Drug Product manufacturing (Component Prep & Compounding, Liquid/Lyophilized Filling, Automated/Manual Inspection, Packaging/Finished Products and Distribution). You hold a BS/MS in Engineering, Pharmaceutical Sciences, or a related eld, and have the minimum years of relevant experience (Principal Engineer = minimum 8, Senior Principal Engineer = minimum 12).
Sr. Principal Engineer, Systems (Plasma & Multi-Scale Simulation Scientist) ASM International NVSr. Principal Engineer, Systems (Plasma & Multi-Scale Simulation Scientist)Hillsboro, ORThis role focuses on bridging plasma physics, surface chemistry, and feature-scale behavior to enable predictive, physics-based simulation workflows supporting advanced semiconductor process development (PEALD, PECVD, ALE, RIE). With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.
Principal Fire Protection Engineer SOLV Energy LLCPrincipal Fire Protection EngineerOR$144,963–$173,956 / yearIn addition, candidate introductions or resumes can only be submitted to our internal talent acquisition recruiting team if a signed vendor agreement is already on file and the third-party recruiter or agency has received formal instructions from our internal talent acquisition team to submit candidates for a particular job posting. Proven experience working with Authorities Having Jurisdiction (AHJs), including fire marshals and code officials, to secure approvals, ensure regulatory compliance, and successfully navigate permitting, design review, and inspection processes for complex fire protection systems.
Principal Engineer - Analog IP Tech Lead Microchip Technology IncPrincipal Engineer - Analog IP Tech LeadGresham, OR$75,000–$232,000 / yearAs a Mixed-Signal IP Technical Lead/Architect in the Mixed-Signal Development Group, you will be responsible for the end-to-end technical leadership of mixed-signal IPs-including IP licensing, integration, and silicon validation support-across a range of advanced SoC projects. Requirements/Qualifications: Qualifications: Bachelor's degree in electrical engineering or related field with strong analog/mixed-signal background and at least 10 years of experience in analog/mixed-signal IP design, integration, and validation for SoC applications, or a Master's degree with at least 7.5 years of such experience.
Principal Data Center MEP Engineer Enercon Services IncPrincipal Data Center MEP EngineerOregon, OR$150,000–$195,000 / yearResponsibilities include: Engineering Leadership: Drive impactful solutions in the power industry through expert design, analysis, and cutting-edge data center systems. Design Precision & Real-World Impact: Develop detailed designs, calculations, and documentation, transforming concepts into executable plans.
Principal, Process Controls Engineer Barry-WehmillerPrincipal, Process Controls EngineerPortland, ORDesign Group is widely known as an industry leader, recognized as a top system integrator, ranking #9 in the 2025 System Integrator Giants; as a Rockwell Platinum Integrator, the highest designation given to Rockwell partners; and as an Ignition Enterprise Premier Integrator. By blending people-centric leadership with disciplined operational strategies and purpose-driven growth, Barry-Wehmiller has become a $3 billion organization with nearly 12,000 team members united by a common belief: to use the power of business to build a better world.
Principal Engineer, Software Verint Systems, Inc.Principal Engineer, SoftwareSalem, ORYou will operate at the intersection of hands-on engineering excellence and strategic technical leadership — contributing directly to complex features while shaping how the entire engineering organization builds, scales, and operates its software. + Cloud and Infrastructure: Deep hands-on experience with AWS or Azure including serverless compute, managed messaging (SQS/SNS/Service Bus), managed databases, and cost optimization.
Principal Silicon Design Verification Engineer Microsoft CorpPrincipal Silicon Design Verification EngineerHillsboro, OR$142,800–$274,800 / yearPreferred Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 12+ years technical engineering experience OR equivalent experience. Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.
Principal Signal & Power Engineer (Die to Die and Chiplet Design) Microsoft CorpPrincipal Signal & Power Engineer (Die to Die and Chiplet Design)Hillsboro, OR$142,800–$274,800 / yearDrives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines. IP design, voltage regulator, motherboard, CPU package, silicon, decoupling capacitor solutions, dielectric and copper loss, high-frequency discontinuities, timing budgets, power supply induced jitter, etc.) for data center processors and corresponding platforms to ensure optimized performance.
Principal Signal and Power Integrity Engineer Microsoft CorpPrincipal Signal and Power Integrity EngineerHillsboro, OR$142,800–$274,800 / yearRequired Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. Drives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry practices, and lessons learned from teams working across multiple product lines.
Principal Systems Engineer Onto InnovationPrincipal Systems EngineerHillsboro, OROnto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. We are seeking a highly experienced Principal Systems Engineer to lead the architecture, integration, and validation of complex systems for advanced semiconductor Films and OCD metrology equipment.
Principal Hardware Engineer (Teradyne, Oregon) Teradyne IncPrincipal Hardware Engineer (Teradyne, Oregon)Tualatin, OR$175,300–$280,600 / yearThis role focuses on power delivery architecture, fast transient response, load regulation, protection systems, thermal management, and system‑level integration to support advanced SoCs, FPGAs, high‑power devices, and complex test conditions. The Senior Hardware Engineer in the hardware group is responsible for designing, developing, and validating high‑current, high‑power sourcing and switching hardware used in semiconductor automated test equipment.
Principal Product Engineer Taiwan Semiconductor Manufacturing Co LtdPrincipal Product EngineerHillsboro, OR$108,235–$156,729 / yearResponsibilities included but not limited to: Strategic Yield Leadership: Architect and lead complex yield improvement programs, collaborating strategically with Fab Process Integration and Module teams to achieve significant and sustainable gains. Advanced Failure Analysis: Employ advanced statistical data analysis, electrical characterization, and physical failure analysis techniques to proactively identify and mitigate complex failure modes and mechanisms, thereby enhancing product yield and stability.
Principal Silicon Engineer Microsoft CorpPrincipal Silicon EngineerHillsboro, OR$142,800–$274,800 / yearRequired Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. Preferred Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 12+ years technical engineering experience OR equivalent experience.
Principal Silicon Engineer - System Modeling Microsoft CorpPrincipal Silicon Engineer - System ModelingHillsboro, OR$142,800–$274,800 / yearThere is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year. To achieve this goal, the Interface IP Team team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware.
Principal Software Engineer, Rack-Scale System Software - CSP Engagements NVIDIA CorpPrincipal Software Engineer, Rack-Scale System Software - CSP EngagementsORWhat you'll be doing: Drive rack-scale SW/FW architecture alignment across CSP engagements - including fabric management software, link health monitoring, GPU/NVSwitch error handling, SW/FW serviceability features (e.g., hot-plug support, component isolation, firmware-driven recovery), and multi-component firmware orchestration. Drive technical work streams with CSP engineering teams on rack-scale system software - ensuring they deeply understand fabric management, NVSwitch behavior, error handling and recovery policies, health telemetry APIs, and SW/FW-controlled recovery operation.
Principal Software Engineer, GPU Firmware and GPU System Software - CSP Engagements NVIDIA CorpPrincipal Software Engineer, GPU Firmware and GPU System Software - CSP EngagementsORWe're looking for a Principal Software Engineer to join our CSP Engagements team as the technical focal point for GPU firmware and GPU system software, working directly with engineering teams of key CSP / hyperscale customers to ensure they can reliably manage, update, and operate NVIDIA GPU firmware at fleet scale. You will drive work streams with engineering teams of key CSPs/hyperscale customers to build shared understanding of GPU firmware and system software integration, incorporate their feedback into NVIDIA's feature roadmap and delivery plan, and ensure customer-side automation and recovery procedures are ready before each firmware release.
Principal Firmware Engineer Microsoft CorpPrincipal Firmware EngineerHillsboro, OR$142,800–$274,800 / yearThere is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year. Experience with platform initialization, Board support package porting, low level drivers for peripherals such as PCIe, I2C, eMMC, SPI, USB, UARTs as well as Memory Management, Scheduling, Interrupts and multi-threading.
Principal Circuit Design Engineer Microsoft CorpPrincipal Circuit Design EngineerHillsboro, ORRequired Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
Principal Platform Power and Performance Engineer Microsoft CorpPrincipal Platform Power and Performance EngineerHillsboro, OR$142,800–$274,800 / yearRequired Qualifications: Masters Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 7+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience OR equivalent experience. To achieve this goal, the CHSE (Cloud Hardware Systems Engineering) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware.
Principal Firmware Validation Engineer Microsoft CorpPrincipal Firmware Validation EngineerHillsboro, OR$142,800–$274,800 / yearDoctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
Principal Field Robotic System Engineer/Architect Analog Devices IncPrincipal Field Robotic System Engineer/ArchitectOR$186,300–$256,163 / yearThis is a high-impact, customer-facing role focused on: Scaling platform and solution engagements across robotics ecosystems (OEMs, disruptors, and partners), in collaboration with ADI BUs, Sales, Software, ADI Garage, Innovation Hubs, and AI teams. At its core, this role executes ADI's platforms & solutions strategy in the field-driving near-term business impact while scaling repeatable system solutions and strengthening ADI position within key robotics ecosystems.
Principal Product Engineer Microsoft CorpPrincipal Product EngineerHillsboro, OR$142,800–$274,800 / yearDoctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. To achieve this goal, the Silicon, Manufacturing, and Packaging Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware.
NewDesign Verification Principal Engineer Rambus IncDesign Verification Principal EngineerHillsboro, OR$127,400–$236,600 / yearThe successful candidate will participate in pre-silicon RTL Verification activities related to Memory Controller SoftIP development, on leading-edge DDR, HBM, and GDDR DRAM controller technologies. Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional Senior/Principal Design Verification Engineer to join our Memory Controller IP team in Hillsboro, Oregon.
Principal Engineer - AI Data And Infrastructure, Remote AledadePrincipal Engineer - AI Data And Infrastructure, RemoteMyrtle Point, ORRemoteWe were founded in 2014, and since then, we've become the largest network of independent primary care in the country - helping practices, health centers and clinics deliver better care to their patients and thrive in value-based care. Proven track record in end-to-end architecture and delivery - guiding large teams (50+ engineers) across multiple product areas from initial conception through maturity.
Sr Principal/ Principal RF Engineer Skyworks Solutions IncSr Principal/ Principal RF EngineerHillsboro, OR$143,000–$286,400 / yearThis position is ideal for a hands-on expert with a passion for innovation, a strong production track record in wireless systems such as Bluetooth and Wi-Fi, and a desire to make a lasting impact on cutting-edge semiconductor solutions. As a key technical leader, you will drive the end-to-end design of RF and mixed-signal blocks, from architecture and modeling through silicon validation and production.