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MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

MACOM Technology Solutions Holdings Inc

Facilities Engineer, Life Safety Systems

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The Quality Engineer serves as the site Management Representative for Quality, holds Quality Authority for final disposition decisions for materials and product, and works directly with customers, auditors, suppliers, operations, engineering, product development, commercial teams, and Corporate Quality. Provide supervisory oversight and day-to-day leadership of the site quality team, including the Quality Technician/direct report, performance management, coaching, accountability, and capability development.

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TekniPlex

Quality Engineer

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OTHER

The Packaging Engineer is responsible for managing Axalta's finished product packaging offerings including packaging materials, EH&S requirements, global regulatory requirements, cost optimization efforts, packaging consolidation and associated process related improvements that support business and customer needs. Evaluate and qualify new packaging (e.g., corrugated, cans, bottles, drums, IBCs, labels, pails, etc.) to support both waterborne and solventborne coating products, considering supply chain stability, costs, operations and potential supply gaps.

Axalta Coating Systems

Engineer - CB3 - NM

Broadbean

Technical knowledge: Experience in electromechanical design including mechanical actuation and electrical equipment enclosure and packaging design, including creating specifications, defining application space, designing technical solution concepts, and building and testing prototypes to validate models/hypotheses and documenting results. Minimum 7 years of electromechanical design including mechanical actuation and electrical equipment enclosure and packaging design, including creating specifications, defining application space, designing technical solution concepts, and building and testing prototypes.

Eaton is a power management company with 2016 sales of $19.7 billion. We provide energy-efficient solutions that help our customers effectively manage electrical, hydraulic and mechanical power more efficiently, safely and sustainably. Eaton is dedicated to improving the quality of life and the environment through the use of power management technologies and services. Eaton has approximately 95,000 employees and sells products to customers in more than 175 countries. For more information, visit <a href="http://www.eaton.com/Eaton/index.htm" target="_blank">Eaton.com.</a>

Eaton Corporation

Mechanical Engineer Specialist - Emerging Technologies

Rivian may use your Candidate Personal Data for the purposes of (i) tracking interactions with our recruiting system; (ii) carrying out, analyzing and improving our application and recruitment process, including assessing you and your application and conducting employment, background and reference checks; (iii) establishing an employment relationship or entering into an employment contract with you; (iv) complying with our legal, regulatory and corporate governance obligations; (v) recordkeeping; (vi) ensuring network and information security and preventing fraud; and (vii) as otherwise required or permitted by applicable law. You will collaborate closely with cross-functional teams, including IC Design, Signal/Power Integrity (SI/PI), PCB Layout, Mechanical, Thermal, and Test Engineering, as well as substrate vendors and OSAT partners to deliver robust, cost-effective packaging from concept through volume production.

Rivian Automotive Inc

IC Package Design Engineer

In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets. Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.

At Amazon, we don’t wait for the next big idea to present itself. We envision the shape of impossible things and then we boldly make them reality. So far, this mindset has helped us achieve some incredible things. Let’s build new systems, challenge the status quo, and design the world we want to live in. We believe the work you do here will be the best work of your life. 
Wherever you are in your career exploration, Amazon likely has an opportunity for you. Our research scientists and engineers shape the future of natural language understanding with Alexa. Fulfillment center associates around the globe send customer orders from our warehouses to doorsteps. Product managers set feature requirements, strategy, and marketing messages for brand new customer experiences. And as we grow, we’ll add jobs that haven’t been invented yet. 
It’s Always Day 1 
At Amazon, it’s always “Day 1.” Now, what does this mean and why does it matter? It means that our approach remains the same as it was on Amazon’s very first day – to make smart, fast decisions, stay nimble, invent, and stay focused on delighting our customers. In our 2016 shareholder letter, Amazon CEO Jeff Bezos shared his thoughts on how to keep up a Day 1 company mindset. “Staying in Day 1 requires you to experiment patiently, accept failures, plant seeds, protect saplings, and double down when you see customer delight,” he wrote. “A customer-obsessed culture best creates the conditions where all of that can happen.” You can read the full letter <a href="https://hiring.amazon.com/why-amazon/culture#/">here</a> 
Our Leadership Principles 
Our Leadership Principles help us keep a Day 1 mentality. They aren’t just a pretty inspirational wall hanging. Amazonians use them, every day, whether they’re discussing ideas for new projects, deciding on the best solution for a customer’s problem, or interviewing candidates. To read through our Leadership Principles from Customer Obsession to Bias for Action, visit <a href="https://www.amazon.jobs/principles" target="_blank">https://www.amazon.jobs/principles</a>

Amazon.com Inc

Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging

Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.

KLA Corporation

Opto-Mechanical Design Engineer (Precision Mechanism Design)

Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The flagship Surfscan products include the SPx platforms for wafer surface quality and wafer defect inspection tools and systems for inspection of polished wafers, epi wafers and engineered substrates during the wafer fabrication process.

Product Release Engineer

As the team''s subject matter expert for structural packaging, you will provide technical leadership, mentor fellow packaging engineers, and collaborate with cross-functional teams and supply chain partners to deliver high-quality, cost-effective packaging solutions. Morgan Street Holdings' portfolio provides best-in-class sourcing and supply chain capabilities, brand-defining marketing and promotion services, innovative consumer products, and dining and refreshment food solutions.

PMI WW Brands

Senior Packaging Engineer

Experience with PWB/CCA Package/Enclosure Design (IDX files, board outlines, connector selection, artwork review, component mounting, cooling techniques) CAD modeling and drafting experience (CREO,SolidWorks and/or similar CAD data modeling experience, model based engineering). The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use.

Headquartered in Bethesda, Maryland, Lockheed Martin is a global security and aerospace company that employs approximately 125,000 people worldwide and is principally engaged in the research, design, development, manufacture, integration and sustainment of advanced technology systems, products and services.
	Our Mission:&nbsp; We solve complex challenges, advance scientific discovery and deliver innovative solutions to help our customers keep people safe and provide them essential services. 
	
	Our Vision:&nbsp;Be the global leader in supporting our customers to strengthen global security, deliver citizen services and advance scientific discovery.
	Our Values:
	
	<li style="margin: 0px 0px 0px 15px;">Do What's Right</li>
	<li style="margin: 0px 0px 0px 15px;">Respect Others</li>
	<li style="margin: 0px 0px 0px 15px;">Perform With Excellence</li>

Lockheed Martin Corporation

Electro Mechanical Engineer Staff- Level 4

You will collaborate closely with other engineers (e.g., electrical engineers, chip designers, software engineers, robotics engineers) as well as neuroscientists, neurosurgeons, clinicians, animal care specialists, and other industry experts. Developing, maintaining, and executing test plans and electro-mechanical test systems for verification and validation of products ranging from components to sub-assemblies, full consumer electronics products, or production environments.

Neuralink

Mechanical Engineer, Implant

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location.

Skyworks Solutions Inc

Sr. Packaging Engineer

You are equally comfortable working with engineers, warehouse personnel, production teams, suppliers, and global colleagues to drive practical solutions and continuous improvement. You are a motivated problem solver who enjoys working across departments to improve processes, support operations, and ensure materials are available when and where they are needed.

Welser Profile North America

Packaging Engineering/Technician

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. Requirements: This position requires a background in Electrical Engineering, familiarity with office productivity tools such as Microsoft Excel and Words, and basic knowledge of CAD tools and procedures used for PCB design and fabrication.

HOUR

Hardware Engineer - Intern

Embedded Software Engineer (C/C++ | Micro Controller)

The position spans SOIC, lead-frame, QFN, LGA, BGA, and WLCSP package technologies and requires close collaboration with R&D, device and process engineering, module design, program management, operations, internal assembly sites, and outsourced semiconductor assembly and test partners. Lead end-to-end product readiness and the transition from development to production release, coordinating Design, Process, Test, Operations, and Module teams to meet quality, performance, and schedule objectives.

Principal Packaging Engineer

Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. Strong troubleshooting and root cause analysis skills across software, infrastructure, networking, operating systems, GPUs, and hardware platforms, with the ability to collaborate effectively with vendors, cross-functional engineering teams, and customers.

Software Engineer - IMC Platform And Cluster Infrastructure

You'll oversee a team of Quality Engineers, Technicians, and Inspectors while partnering closely with Operations, Production, Engineering, R&D, and Supply Chain to ensure product quality, food safety, regulatory compliance, and continuous improvement initiatives remain best-in-class. If you're a Quality Manager (with HACCP & SQF certifications) who thrives in a fast-paced manufacturing environment and enjoys building teams, driving continuous improvement, and partnering closely with operations, this opportunity deserves a closer look.

HIKINEX

Quality Manager - Packaging for DRI Plastics

Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. Our Systems Engineers are the driving force behind the development process-combining deep technical expertise, strong problem-solving skills, and a clear understanding of customer needs to deliver complex, high-performance solutions.

System Engineer

Our highly engineered components and coining dies are used in demanding environments where quality, reliability, and performance are essential, including applications that support life‑changing and life‑saving technologies. Coining, part of AMETEK Specialty Metal Products, is a global manufacturer of precision metal solutions supporting critical applications across aerospace, medical, electronics, automotive, and industrial markets.

AMETEK, Inc. is a leading global provider of industrial technology solutions serving a diverse set of attractive niche markets with annual sales over $7.0 billion.
AMETEK is committed to making a safer, sustainable, and more productive world a reality. We use differentiated technology solutions to solve our customers’ most complex challenges. We employ 21,000 colleagues, in 35 countries, that are grounded by our core values: Ethics and Integrity, Respect for the Individual, Inclusion, Teamwork, and Social Responsibility. AMETEK (NYSE:AME) is a component of the S&P 500. Visit <a title="www.ametek.com" href="https://urldefense.com/v3/__https:/jobs.ametek.com/job/Peabody-Mechanical-Assembler-2nd-Shift-MA-01960/1227162200/www.ametek.com__;!!D1XWH5In!Qe6CY6Xjeo7hJeMe15YOtCEgPEXWMI-tgryDnyf9xk9G-u30G60-2eSWkgNSopi-5Aw934gT_JIuhwSVKLBpr9dv3kA$" target="_blank" rel="noopener">www.ametek.com</a> for more information.

Packaging Engineer Jobs in the United States

Facilities Engineer, Life Safety Systems MACOM Technology Solutions Holdings Inc

Quality Engineer TekniPlex

Engineer - CB3 - NM Axalta Coating Systems

Mechanical Engineer Specialist - Emerging Technologies Eaton Corporation

IC Package Design Engineer Rivian Automotive Inc

Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging Amazon.com Inc

Opto-Mechanical Design Engineer (Precision Mechanism Design) KLA Corporation

Product Release Engineer KLA Corporation

Senior Packaging Engineer PMI WW Brands

Electro Mechanical Engineer Staff- Level 4 Lockheed Martin Corporation

Mechanical Engineer, Implant Neuralink

Sr. Packaging Engineer Skyworks Solutions Inc

Packaging Engineering/Technician Welser Profile North America

Hardware Engineer - Intern MACOM Technology Solutions Holdings Inc

Embedded Software Engineer (C/C++ | Micro Controller) KLA Corporation

Principal Packaging Engineer Skyworks Solutions Inc

Software Engineer - IMC Platform And Cluster Infrastructure KLA Corporation

Quality Manager - Packaging for DRI Plastics HIKINEX

System Engineer KLA Corporation

Packaging Operator Ametek, Inc.

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