Advanced Packaging Engineer INTELAdvanced Packaging EngineerHillsboro, OR$148,100–$209,100 / yearThe successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions.
Process Engineer - RF Test INTELProcess Engineer - RF TestLafayette, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Senior IC Packaging Engineer MicrosoftSenior IC Packaging EngineerHillsboro, OR$119,800–$234,700 / yearDoctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 3+ years technical engineering experience OR Masters Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 8+ years technical engineering experience OR equivalent experience. Doctorate in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 5+ years technical engineering experience OR equivalent experience.
Packaging Engineer International Flavors & FragrancesPackaging EngineerClackamas, OR$91,744–$114,680 / yearThe Packaging Engineer will provide technical leadership for finished format packaging operations, including oversight of equipment, packaging materials, and inputs to contract manufacturing partners. Define and maintain critical material specifications (e.g., coefficient of friction, seal strength, thickness tolerance, heat resistance) to ensure consistent line performance.
NewPackaging Module Development Engineer IntelPackaging Module Development EngineerHillsboro, OregonEstablishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure materials technology, quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Job Description: We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across cross-functional teams to drive materials technology development for advanced packaging.
Silicon Packaging Design Engineer Intel CorpSilicon Packaging Design EngineerHillsboro, OR$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Technical Marketing Engineer Advanced IC Packaging Siemens AGTechnical Marketing Engineer Advanced IC PackagingWilsonville, OR$129,600–$233,300 / yearExperience level Experienced Professional Job type Full-time Work mode Hybrid (Remote/Office) Employment type Permanent Location(s) Wilsonville - Oregon - United States of America Siemens EDA is a global technology leader in Electronic Design Automation software. This role requires the ability to understand customer challenges and use cases, and to translate them into solution-oriented workflows by connecting planning, layout, and verification tools using scripting technologies such as Tcl and Python.
Advanced Packaging Dry Etch Module Development Engineer Intel Corp.Advanced Packaging Dry Etch Module Development EngineerHillsboro, OR$133,800–$255,200 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Packaging Sales Engineer Pro Mach IncPackaging Sales Engineerwarrenton, OR$65,000–$100,000 / yearExperience: 2-5 years in technical support, maintenance, or roles related to packaging machinery (e.g., horizontal/vertical form-fill-seal machines, transverse jaws). Your mission: proactively generate leads, cultivate exceptional customer relationships, and promote our products and services to boost profitability in your region.
NewAdvanced Packaging Photolithography Development Engineer IntelAdvanced Packaging Photolithography Development EngineerHillsboro, OregonDevelop, characterize, and optimize photolithography processes for back-end applications, including Cu damascene pad patterning, dielectric via and trench lithography, bonding interface layer patterning, and alignment mark / overlay target design and optimization. - Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related fields with 3+ years of relevant experience.
Quality Engineering Manager-Assembly Packaging Testing Manufacturing Intel CorpQuality Engineering Manager-Assembly Packaging Testing ManufacturingHillsboro, OR$191,220–$269,950 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This position requires strong cross functional leadership and partnership with Foundry Central Services (FCS), including Supplier Quality & Reliability (Q&R) for Equipment, Materials, Contract Services (CS) and Automation teams, to drive supplier improvement programs that directly impact manufacturing performance.
Advanced Packaging Lithography Development Manager IntelAdvanced Packaging Lithography Development ManagerHillsboro, OregonJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Senior System And Manufacturing Codesign Architect - Power, Thermal And Packaging NvidiaSenior System And Manufacturing Codesign Architect - Power, Thermal And PackagingHillsboro, ORWhat you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.
Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging NVIDIASenior System and Manufacturing CoDesign Architect - Power, Thermal and PackagingHillsboro, CaliforniaSystem-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains. You wouldn't be maintaining existing solutions, you'd be identifying where physical constraints will erode NVIDIA's competitive edge before anyone else sees it coming, then building the cross-domain responses that ensure the next generation leapfrogs those limits entirely.
Principal Signal and Power Integrity Engineer Microsoft CorpPrincipal Signal and Power Integrity EngineerHillsboro, OR$142,800–$274,800 / yearRequired Qualifications: Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. Drives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry practices, and lessons learned from teams working across multiple product lines.
Principal Signal & Power Engineer (Die to Die and Chiplet Design) Microsoft CorpPrincipal Signal & Power Engineer (Die to Die and Chiplet Design)Hillsboro, OR$142,800–$274,800 / yearDrives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines. IP design, voltage regulator, motherboard, CPU package, silicon, decoupling capacitor solutions, dielectric and copper loss, high-frequency discontinuities, timing budgets, power supply induced jitter, etc.) for data center processors and corresponding platforms to ensure optimized performance.
Senior Mechanical Engineer PanthalassaSenior Mechanical EngineerPortland, OR$150,000–$225,000 / yearThis position requires a highly motivated, hands-on engineer who thrives in ambiguity, can execute with autonomy, and is eager to take on end-to-end ownership, defining requirements and architecture and driving through design, prototype testing, and final build. Familiarity with instrumentation and control components (pressure transducers, thermocouples, RTDs, strain gauges, accelerometers, flow meters, load cells, relays, solenoids, pneumatic valves).
Applications Development Engineer KLAApplications Development EngineerHillsboro, OregonEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA’s metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The FaST division is committed to support our customers to achieve performance entitlement of our solution and we effectively partner with our customers from their early research and development phase to the high volume in-line manufacturing implementation specific for their process needs.
FCO Strategic/Development Functional Area Industrial Engineer Intel Corp.FCO Strategic/Development Functional Area Industrial EngineerHillsboro, OR$89,010–$170,630 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We are seeking to hire a Strategic/Development Industrial Engineer to support the New Mexico site which has a unique charter to deliver high-volume advanced packaging manufacturing as well technology development of advanced packaging products/components and Intel Foundry customer programs.
SerDes Circuit Design Engineer Apple IncSerDes Circuit Design EngineerBeaverton, ORYou will work on the development of high-performance and high-speed AMS circuits used in SerDes PHY, including evaluation of different circuit topologies for specific product requirements (e.g., Rx, CDR, Tx, bias generator, high-speed clock generation and low-jitter distribution, high-speed analog signal chain, mixed-signal calibration and algorithms) with best in class power, performance, and area (PPA). Understanding and experience of designing analog mixed signal circuit blocks including Bandgap, biasing circuits, LDO regulators, amplifiers, comparators, switched-cap circuits, ADCs, DACs, Oscillators, Filters.
NewProcess Integration Engineer Jireh SemiconductorProcess Integration EngineerHillsboro, ORFull timeWork with the Product Engineering and Reliability group to test, characterize and evaluate device and processNew Product IntroductionCollaborate with product engineering team to perform NPI (New Product Introduction) on existing platform (analysis DOE/Pre-Production lots data/documentation according NPI procedure to release new product)Yield monitor/improvementresponse to newly released platform safe launch stage yield monitor/improvement actions low yield root cause identification (through failure analysis, inline data analysis and lot history)provide solution for low yield through process condition splits designREQUIRED EDUCATION & EXPERIENCEMaster's or PhD in Electrical Engineering or a related engineering degree3+ years of experience in a development role ( power device development is preferred)Working knowledge in semiconductor process technology and wafer fabricationPREFERRED QUALIFICATIONS & SKILLSThe ideal candidate will have knowledge of semiconductor device physics and experience with device processing and integration, test structure definition, design rule generation, DOE, failure analysis, process control document (PCD) generation, and device characterization. AOS's portfolio of products targets high-volume applications, including but not limited to portable computers, flat panel TVs, LED lighting, smart phones, battery packs, consumer and industrial motor controls and power supplies for TVs, computers, servers and telecommunications equipment.
NewProcess Engineer - Thin Films Jireh SemiconductorProcess Engineer - Thin FilmsHillsboro, ORFull timeDUTIES & RESPONSIBILITIESSupporting and developing Thin Films deposition processes in the 200mm fabOptimizing and developing new processes and process controls for lower cost, higher productivity and enabling new productsImplementing and refining SPC controls to reduce process variation without personnel interventionPerforming statistically designed experiments, analyzing, writing report, qualifying process changesDisposition of discrepant material, troubleshoot process drift or human error, diagnose and implement preventative actions in a cost effective mannerMaintain documentation necessary for proper operation of the equipmentWriting specs of processes and operations, qualification plans, weekly updates, documentation of scrap and reworkImproving the performance of the area using Lean manufacturing techniquesREQUIRED EDUCATION & EXPERIENCE BS, Master or Ph. D. degree in electrical engineering, chemical engineering, material science, or other related discipline5+ years in Thin Films experience required (experience in Diffusion helpful)Experience in CVD and or PECVDExperience with defect reductionOTHER QUALIFICATIONS Strong background in statisticsMust have CVD/PVD process experienceMust have skills and ability to apply SPC to controlling processesMust have strong written and verbal communication skillsDemonstrated ability to work with people one on one and in a team environmentDemonstrated problem solving initiative in work area*Pay range listed in this job posting is an estimate only, and is not necessarily reflective of actual compensation that may be earned, nor a promise of pay for any specific employee future or past.
Senior Thermal Engineer PanthalassaSenior Thermal EngineerPortland, OR$155,000–$200,000 / yearWe are looking for a Senior Thermal Engineer who will own the end-to-end thermal simulation workflow for low- and high-power electromechanical systems operating in harsh marine environments, with a strong emphasis on rapid design iteration, first-principles thinking, and high-fidelity CFD where it adds real value. You will work closely with mechanical engineers, payload architects, electrical engineers, applied physicists, and the prototype team to evaluate concepts, improve designs, define thermal requirements, debug issues, and help move hardware from early architecture through prototype and field validation.
Module Engineer IntelModule EngineerHillsboro, OregonBy collaborating with cross-functional teams, equipment suppliers, and leveraging your technical knowledge, you will shape Intel's technological future and contribute to manufacturing excellence that supports the company's position as a global leader in semiconductor technology. Job Description: Join Intel as a Module Engineer, where you will play a pivotal role in driving innovation and advancing Intel's manufacturing capabilities from component feasibility through high-volume production.
Mechanical Engineer PanthalassaMechanical EngineerPortland, OR$125,000–$175,000 / yearThis position requires a highly motivated, hands-on engineer who thrives in ambiguity, can execute with autonomy, and is eager to take on end-to-end ownership, defining requirements and architecture and driving through design, prototype testing, and final build. We are a renewable energy and ocean technology company committed to rapidly developing and deploying technologies that will ensure a sustainable future for Earth by unlocking the vast energy potential of its oceans.
Customer Support Engineer KLACustomer Support EngineerHillsboro, OregonOur comprehensive services include: proactive management of tools to identify and improve performance; expertise in optics, image processing and motion control with worldwide service engineers, 24/7 technical support teams and knowledge management systems; and an extensive parts network to ensure worldwide availability of parts. The KLA Services team headquartered in Milpitas, CA is our service organization that consists of Service Sales and Marketing, Spares Supply Chain management, Field Operations, Engineering, Product Training, and Technical Support.
SoC HW (Digital, Analog or PnP) Validation Engineer Microsoft CorpSoC HW (Digital, Analog or PnP) Validation EngineerHillsboro, OR$102,100–$202,200 / yearPreferred Qualifications: Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 2+ years technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ years technical engineering experience OR Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field OR equivalent experience. Required Qualifications: Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 2+ years technical engineering experience OR equivalent experience.
Trade Compliance Engineer KLA CorpTrade Compliance EngineerHillsboro, OR$120,000–$204,000 / yearThis role serves as the primary technical liaison between engineering, product management, supply chain, legal, and global trade compliance teams to support product classification, licensing determinations, technology transfers, and regulatory compliance throughout the product lifecycle. The ideal candidate combines strong technical knowledge with expertise in trade regulations and has experience working within complex manufacturing, technology, semiconductor, aerospace, telecommunications, or high-tech environments.
Mixed Signal Logic Design Engineer Intel CorpMixed Signal Logic Design EngineerHillsboro, OR$141,910–$200,340 / yearBusiness group: The Central Engineering Group (CEG) is Intel''s data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). BS degree in Electrical Engineering or Computer Engineering or similar field of study with 4+ years relevant experience -OR- MS degree in Electrical Engineering or Computer Engineering or similar field of study with 3+ years relevant experience.
Analog and Mixed Signal Design Engineer Intel CorpAnalog and Mixed Signal Design EngineerHillsboro, OR$164,470–$269,100 / yearPreferred Qualifications: • Experience in one or more of the following areas is preferred: • GPIOs, high speed parallel or serial IO links and their subcomponents (data path, TX, RX, etc.), clock distribution, clock conditioning, clock recovery circuits, voltage regulators, voltage reference circuits, ADCs/DACs, inductors, transmission lines, RF and millimeter-wave circuits, test of custom analog and mixed-signal circuits. Business Group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
Principal Engineer - Standard Cell Design IntelPrincipal Engineer - Standard Cell DesignHillsboro, CaliforniaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, California, Santa Clara Additional Locations: US, Arizona, Phoenix, US, California, Folsom, US, Oregon, Hillsboro, US, Texas, Austin Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Analog And Mixed Signal Design Engineer Intel Corp.Analog And Mixed Signal Design EngineerHillsboro, OR$164,470–$269,100 / yearPreferred Qualifications: Experience in one or more of the following areas is preferred: GPIOs, high speed parallel or serial IO links and their subcomponents (data path, TX, RX, etc.), clock distribution, clock conditioning, clock recovery circuits, voltage regulators, voltage reference circuits, ADCs/DACs, inductors, transmission lines, RF and millimeter-wave circuits, test of custom analog and mixed-signal circuits. Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
DFT Application Engineer Intel Corp.DFT Application EngineerHillsboro, OR$122,440–$232,190 / yearBusiness group: The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). 3+ years of combined experience in the following: implementing ASIC DFT/DFM insertion (MBIST, LBIST, SCAN, JTAG) at both ASIC design block level and full chip level, including ATPG validation and DFT timing/signoff at SOC level.
NewSenior Physical Design Engineer - Neuromorphic Computing IntelSenior Physical Design Engineer - Neuromorphic ComputingHillsboro, OregonWith a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. Our Loihi series of research chips pioneered event-driven, sparse, and massively parallel neuro-inspired processing, fueling over 100 peer-reviewed publications that validate the promise of this novel approach.
Principal Systems Engineer Onto Innovation IncPrincipal Systems EngineerHillsboro, OROnto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. We are seeking a highly experienced Principal Systems Engineer to lead the architecture, integration, and validation of complex systems for advanced semiconductor Films and OCD metrology equipment.
Senior Applications And Solutions Engineer - Foundry Services Intel Corp.Senior Applications And Solutions Engineer - Foundry ServicesHillsboro, OR$122,440–$232,190 / yearWe seek a Senior ASIC Design Engineer to provide technical support to Intel Foundry Services customers on PDKs through ASIC design implementation flows and to perform ASIC physical design execution with specialized focus on complex multi-voltage domain (UPF/CPF) designs and power-intent (VCLP and Conformal LP) verification signoff. Business group: The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies).
NewEHS Environmental Engineer IntelEHS Environmental EngineerHillsboro, Oregon$120,860–$170,630 / yearJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We are looking for a candidate who brings not only technical expertise but also the leadership presence and collaborative mindset to drive meaningful environmental outcomes in a complex, fast-paced manufacturing environment: Analytical & Innovative Thinking: Demonstrated ability to challenge existing approaches, identify root causes, and develop creative, technology-forward solutions to complex environmental challenges.
Senior Applications and Solutions Engineer - Foundry Services Intel CorpSenior Applications and Solutions Engineer - Foundry ServicesHillsboro, OR$122,440–$232,190 / yearWe seek a Senior ASIC Design Engineer to provide technical support to Intel Foundry Services customers on PDKs through ASIC design implementation flows and to perform ASIC physical design execution with specialized focus on complex multi-voltage domain (UPF/CPF) designs and power-intent (VCLP and Conformal LP) verification signoff. Business group: The Central Engineering Group (CEG) is Intel''s data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies).
Electrical Project Engineer Koch IncElectrical Project EngineerToledo, ORElectrical Project Engineer - Toledo, Oregon, United States - 192102 - Koch. Koch Engineered Solutions.
Customer Engagement Applications Engineer - SWIFT KLACustomer Engagement Applications Engineer - SWIFTHillsboro, OregonEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA’s metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. SWIFT (Simultaneous Wafer Inspection at Fast Throughput) systems deliver all-wafer-surface (frontside, backside, and edge) macro inspection that is critical for automotive IC, MEMS, and advanced packaging processes as well as foundry/logic and memory fabs.
Customer Engagement Applications Engineer - SFS KLACustomer Engagement Applications Engineer - SFSHillsboro, OregonOur expert teams of physicists, engineers, data scientists and problem-solvers work together with the world’s leading technology providers to accelerate the delivery of tomorrow’s electronic devices. As an Applications Engineer, you’ll partner with customers and cross-functional teams to optimize SFS tools, create innovative applications, and drive enhancements for next-generation products.
Lead Solutions Design Engineer - SIMIO Warehouse & Transportation Simulation (REMOTE) Ryder System IncLead Solutions Design Engineer - SIMIO Warehouse & Transportation Simulation (REMOTE)Salem, ORRemote$100,000–$115,000 / yearWarehouse Design:Extensive knowledge of Warehouse Management operations, data analytics, Industrial Engineering, warehouse types (ambient, temp control, warehouse layout/ design and Lean methodsRequired knowledge of material handling solutions and automation types such as: powered industrial truck (PIT) applications; racking and other storage solution designs, packaging equipment; conveyor and sortation equipment; and other automation solutions (e.gAS/RS)Warehouse Design Tools e.g. Transportation Design:Extensive knowledge of Dedicated Services and Managed Transportation NetworksRequired knowledge of all available equipment types such as; dry van, temperature control, flat bed, other specialized equipmentTransportation Design Tools ie; JDA, Appian, Network Design Tools ie; Llamasoft, Transportation Management Systems ie; JDA, OTM,, Mapping Software ie; Tableau expert required.
NewWarehouse Automation Engineer (remote) Ryder SystemWarehouse Automation Engineer (remote)Salem, ORRemoteSupport on-site Solution Acceptance Test (SAT) testing plan - Support tracking of Punch List after go-live for Uptime items+ Data Analytics:- Profile data from dashboard and systems to support system optimization projects- Perform data analysis on reports technology controls systems and WMS/WES+ Implementation Commissioning and Solution Validation:- Support Solutions Acceptance Testing (SAT )testing plan- Support tracking of Punch List+ Strategy and Success Measurements:- Review team strategy with manager to set personal goals+ Financial Responsibilities:- Validate spend with manager- Support Project Leads on tracking project budget+ Automation Troubleshooting:- Partner with vendor to resolve Priority 1-5 tickets related to down/degregated performance with site automation- Join on P1/P1 Resolutions calls**Additional Responsibilities**+ Support vendor communication for minor projects.+ Build ROI and justification based upon multiple criteria in order to select the optimal solution design- Support build of presentation with Lead Automation Solutions Engineer+ SOW (Scope of Work) Contractual Validation:-Support automation project lead on identifying gaps in vendor FSD/SOW using the FSD Checklist process+ Design Validation:- Provide input on automation solution designs to ensure that key items are considered for implementation and ongoing operational performance- Review design options for clearance issues, power requirments, cost effeictiveness and SLA targets.+
Staff Manufacturing Engineer, Advanced Components Biotronik, Inc.Staff Manufacturing Engineer, Advanced ComponentsLake Oswego, ORFull timeWith more than 40 years of experience in design and manufacturing of active implantable medical devices, our continuing success is based on our company's core values - innovation, quality, reliability, integrity, teamwork, and undisputed expertise - thus enabling us to inspire confidence and trust in physicians and patients worldwide. Implementation tasks including leading stage-gate approvals, documentation, supplier quality interface, characterization, verification and on-going sustaining support in a highly automated manufacturing environment.
Software Engineer 3 KLA CorporationSoftware Engineer 3Hillsboro, OR$115,900–$197,000 / yearEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The ideal candidate thrives in complex system environments, demonstrates deep technical expertise in multithreaded/multiprocessing software, and brings a strong troubleshooting mindset to solve challenging, real-world problems in semiconductor equipment.
Customer Support Engineer KLA CorporationCustomer Support EngineerHillsboro, OR$25.15–$42.75 / hourOur comprehensive services include: proactive management of tools to identify and improve performance; expertise in optics, image processing and motion control with worldwide service engineers, 24/7 technical support teams and knowledge management systems; and an extensive parts network to ensure worldwide availability of parts. The KLA Services team headquartered in Milpitas, CA is our service organization that consists of Service Sales and Marketing, Spares Supply Chain management, Field Operations, Engineering, Product Training, and Technical Support.
Applications Development Engineer KLA CorporationApplications Development EngineerHillsboro, OR$102,000–$173,400 / yearEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The FaST division is committed to support our customers to achieve performance entitlement of our solution and we effectively partner with our customers from their early research and development phase to the high volume in-line manufacturing implementation specific for their process needs.
Customer Applications Development Engineer, Mach Hillsboro/Beaverton KLA CorporationCustomer Applications Development Engineer, Mach Hillsboro/BeavertonHillsboro, OR$102,000–$173,400 / yearEnabling the movement toward advanced chip design, KLA's Measurement, Analytics and Control group (MACH) is looking for the best and brightest research scientists, software engineers, application development engineers and senior product technology process engineers to join our team. Our MACH team develops leading-edge solutions for patterning process analytics and control technologies, thereby providing customers with critical insight at the feature level, field level and cross-wafer analysis.
Product Install Engineer - Swift-90% Travel KLA CorporationProduct Install Engineer - Swift-90% TravelHillsboro, OR$31.78–$54.04 / hourOur comprehensive services include: proactive management of tools to identify and improve performance; expertise in optics, image processing and motion control with worldwide service engineers, 24/7 technical support teams and knowledge management systems; and an extensive parts network to ensure worldwide availability of parts. The KLA Services team headquartered in Milpitas, CA is our service organization that consists of Service Sales and Marketing, Spares Supply Chain management, Field Operations, Engineering, Product Training, and Technical Support.
Product Development Engineer KLA CorporationProduct Development EngineerHillsboro, OR$80,800–$137,400 / yearEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The FaST division is committed to support our customers to achieve performance entitlement of our solution and we effectively partner with our customers from their early research and development phase to the high volume in-line manufacturing implementation specific for their process needs.