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MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

HOUR

MACOM Technology Solutions Holdings Inc

Packaging Engineer Intern

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The successful candidate will be responsible for the design, integration, automation, and qualification of precision optical assemblies, including photodiodes, fiber-coupled devices, optical receivers, laser sources, and photonic integrated circuits (PICs). A Day in Your Life at MKS: As an Optomechanical Packaging Engineer at MKS, you will lead the development of advanced optical and optoelectronic packaging solutions for next-generation photonics and optical communication test systems.

YEAR

MKS Inc

Senior Optomechanical Packaging Engineer

Design, develop, analyze, document, and assist in testing resilient, precision opto-mechanical assemblies and laser packages. You'll have the opportunity to work on cutting edge technologies, work closely with leadership, and develop and implement engineering practices that support our mission and growth.

ESRhealthcare and EXEC STAFF RECRUITERS

Senior Laser Packaging Engineer

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Photonics Packaging Engineer

Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred. MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense.

Senior Principal Packaging Engineer

The LSB is part of SC Johnson, a family-owned company and leading manufacturer of household cleaning, home storage, air care, pest control and shoe care products, as well as professional products. In this highly visible role, you'll drive packaging strategy, advance sustainability initiatives, and collaborate across functions to deliver solutions that balance consumer needs, technical performance, and business objectives.

Method Products PBC

Manager, Packaging Engineer

FULL_TIME

Backed by strong funding and validated by commercial programs with Tier 1 industry leaders, Axiado has earned recognition through numerous industry awards, including the 2026 AI in Cybersecurity Innovation Award from TMCnet, a Diamond award for Zero Trust Solution of the Year at the 2026 Pinnacle Awards, and Gold at the 2026 Cybersecurity Excellence Awards for AI Security Solution, as well as being a finalist for the Start-Up to Watch Award from the Global Semiconductor Alliance. Founded in 2019, we’re a fast-growing, well-funded team of over 180 people worldwide, building the Trusted Control/Compute Unit (TCU), a new class of semiconductor that integrates hardware security, real-time platform management, and AI-driven optimization.

Axiado

Senior IC Packaging Engineer

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Axiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Company's 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliance's 2025 "Start-Up to Watch" award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.

Axiado Corporation

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Method

Job Summary: The Senior Optical Packaging Engineer is responsible for developing & implementing a high-performance & robust fiber-to-chip package and a scalable packaging process for optical systems comprised of optical fibers attached to a variety of chip-based photonic integrated circuits. Our application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact.

PsiQuantum

Senior Optical Packaging Engineer

If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions. Understanding of how memory die floorplan and architecture influence package structure and routing, with experience collaborating with memory die design teams.

<div class="col-md-4 passion" style="background-color: #666666; border-radius: 20px; -webkit-box-shadow: 2px 2px 2px 2px #979b91; -moz-box-shadow: 2px 2px 2px 2px #979b91; box-shadow: 2px 2px 2px 2px #979b91; color: #ffffff; font-family: calibri; font-size: 13px; padding: 17px; text-align: center;">
<h3 style="color: #ffffff; font-size: 16px; font-weight: normal;">We bring amazing people together to make amazing things happen.</h3>
<p>We’re a diverse collection of thinkers and doers, continually reimagining what’s possible to help us all do what we love in new ways. The people who work here have reinvented entire industries with the Mac, iPhone, iPad, and Apple Watch, as well as with services, including iTunes, the App Store, Apple Music, and Apple Pay. And the same passion for innovation that goes into our products also applies to our practices — strengthening our commitment to leave the world better than we found it.</p>
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<h3 style="color: #666666; font-weight: 500;">About Apple</h3>
<p>There’s a place here for every kind of brilliant.
Everyone here is an innovator, or an innovator-to-be, no matter what your team or your role. So bring your passion, courage, and original thinking and get ready to share it, because every new product, service, or feature we invent is the result of people working together to make each others’ ideas stronger. Innovation at this level depends on people who represent the variety of the human experience and inspire us with their own fresh perspectives. Together, we’ll do amazing work that can make a difference in people’s lives. Including your own.

<a href="https://www.apple.com/jobs/us">Learn more about working at Apple.</a>
</p>
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Apple Inc

Memory Packaging Engineer

To ensure your safety and help you navigate your job search with confidence, please keep the following critical points in mind: No Financial Requests: Anduril will never solicit payment or demand personal financial details (such as banking information, credit card numbers, or social security numbers) at any stage of our hiring process. This third-party service provider provides risk-intelligence services that may include analysis of sanctions and watchlists, adverse media, public-record information, and other lawful open-source or commercial data sources.

Anduril Industries Inc

Packaging Engineer, Product Development

Some hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach, encapsulation/molding, under-fill, ball attach, package singulation and Tape & Reel. In this fast-paced environment, your role is to interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies.

Packaging Engineer

Packaging Engineer, Supply Chain

PART_TIME

Understanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. Experience with MAP, barrier films, laminated structures, COEX films, SUPs, flexo print, shrink, stretch, and poly bag structures is preferred.

Destiny Packaging Inc.

Flexible Packaging Engineer

Backed by industry giants like NVIDIA, AMD and Intel and manufactured in partnership with the world’s leading semiconductor ecosystem, Ayar Labs’ co-packaged optics solution is key to unleashing next-generation AI scale-up architectures. The primary responsibility of the Advanced Packaging Engineer is to define an advanced packaging technology roadmap, enabling the transition from successful design of validation systems to incorporation into high-volume manufacturing.

Ayar Labs

Principal Engineer, Advanced Packaging

Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques, including: wedge bonding, ball bonding, silver epoxy application, expansion coefficient and thermal conductivity of materials, plating, hard and soft substrate materials, printed circuit board manufacturing methods and techniques. Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment.

Mini-Circuits

Sr. Packaging Engineer

If you are applying to perform work for MiniMed in any position which will involve performing at least two (2) hours of work on average each week within the unincorporated areas of Los Angeles County, you can find here a list of all material job duties of the specific job position which MiniMed reasonably believes that criminal history may have a direct, adverse and negative relationship potentially resulting in the withdrawal of a conditional offer of employment. Determines packaging specifications according to the nature of the product, cost limitations, legal requirements, and the type of protection required, considering the need for resistance to such external variables as moisture, corrosive chemicals, temperature variations, light, heat, rough handling, and tampering.

Minimed

Principal Packaging Engineer

If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. Our expertise in modifying materials at atomic levels and on an industrial scale helps our customers - who make smartphones, supercomputers, virtual reality headsets, autonomous vehicles and more - transform their ideas into reality.

<p>Applied Materials (Nasdaq: AMAT) is the leader in Materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible the technology shaping the future. To support customers around the world, Applied Materials employs approximately 22,000 people in over 100 locations in 18 countries.</p> 




Applied Materials

Packaging Engineer II, New College Grad- Master's (Santa Clara, CA)

Responsibilities for the position are broad; encompassing New Product Development, Product Maintenance, Cost Savings, and Sustainability while working closely with management and cross-functional teams to ensure successful project launches. Our entrepreneurial spirit, hands-on environment, and fast-paced culture encourage employees to be their best, bringing innovative solutions to reach the skincare professional and consumer.

Packaging Engineer Jobs in California

Packaging Engineer Intern MACOM Technology Solutions Holdings Inc

Senior Optomechanical Packaging Engineer MKS Inc

Senior Laser Packaging Engineer ESRhealthcare and EXEC STAFF RECRUITERS

Photonics Packaging Engineer ESRhealthcare and EXEC STAFF RECRUITERS

Senior Principal Packaging Engineer MACOM Technology Solutions Holdings Inc

Manager, Packaging Engineer Method Products PBC

Senior IC Packaging Engineer Axiado

Senior IC Packaging Engineer Axiado Corporation

Manager, Packaging Engineer Method

Senior Optical Packaging Engineer PsiQuantum

Memory Packaging Engineer Apple Inc

Packaging Engineer, Product Development Anduril Industries Inc

Packaging Engineer Apple Inc

Packaging Engineer, Supply Chain Anduril Industries Inc

Flexible Packaging Engineer Destiny Packaging Inc.

Principal Engineer, Advanced Packaging Ayar Labs

Sr. Packaging Engineer Mini-Circuits

Principal Packaging Engineer Minimed

Packaging Engineer II, New College Grad- Master's (Santa Clara, CA) Applied Materials

Senior Packaging Engineer Dermalogica Inc

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