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Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging Amazon.com IncPackage Layout Design Engineer , Annapurna Labs - AI Silicon PackagingTempe, AZ
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Packaging Module Development Engineer Intel Corp.Packaging Module Development EngineerPhoenix, AZ$133,800–$188,890 / year
Packaging Module Equipment Development Engineer IntelPackaging Module Equipment Development EngineerChandler, Arizona
Packaging Research and Development Engineer Intel CorpPackaging Research and Development EngineerChandler, AZ$115,110–$219,550 / year
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerScottsdale, AZ
Foundry Advanced Packaging Customer Engineer IntelFoundry Advanced Packaging Customer EngineerChandler, Arizona
Senior Principal Engineer, Global Product Management - Advanced Packaging ASMSenior Principal Engineer, Global Product Management - Advanced PackagingPhoenix, Arizona
Senior Director, Global Structural Design and Packaging Sustainability IgnitelySenior Director, Global Structural Design and Packaging SustainabilityGlendale, Arizona
Advanced Packaging Intern, MS - Summer 2027 Marvell Technology IncAdvanced Packaging Intern, MS - Summer 2027Chandler, AZ
ADCE Packaging Design Architect Intel CorpADCE Packaging Design ArchitectPhoenix, AZ$220,920–$311,890 / year
Adce Packaging Design Architect Intel Corp.Adce Packaging Design ArchitectPhoenix, AZ$220,920–$311,890 / year