Albuquerque, NM30+ days ago
ul>Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Microelectronics, Semiconductor Processing, or related field.• 12-20+ years of experience in semiconductor packaging, substrate manufacturing, PCB, display, semiconductor fab, MEMS, RF module, or high-tech manufacturing. Lead root-cause analysis for defects such as opens, shorts, delamination, voids, dendrite growth, seed residue, plating defects, dielectric defects, warpage, adhesion failures, and via resistance variation.•