p>ā¢ Determine layer stack-up, perform component package selection, component placement, routing feasibility studies, and signal routing of digital, analog, RF, and power conversion of printed circuit boards (PCB) ā¢ Perform multilayer PCB layout (20+ layers), including component placement, high-speed routing (differential pairs, length matching), controlled impedance, and power/ground plane design ā¢ Conduct pre- and post-layout SI/PI simulations to mitigate crosstalk, reflections, and EMI/EMC issues ā¢ Perform DRC/ERC checks, peer reviews, and design audits; collaborate with hardware/firmware engineers for functional validation and prototype bring-up support ā¢ Produce fabrication deliverables (Gerber, ODB++, IPC-2581, drill files, stack-up drawings, assembly files) ā¢ Analyze designs for manufacturability; incorporate production feedback from fabrication houses and assembly partners to reduce costs and improve yield ā¢ Collaborate with internal teams and PCB vendors to continually improve design rules, constraints, and design for test and manufacture guidelines ā¢ Customize and verify symbols, footprints, and 3D models; interface with PCB librarians for new parts and resolve library discrepancies ā¢ Work with mechanical, thermal, RF, and test engineers on stack-up planning, thermal vias, shielding, and enclosure integration; participate in design reviews and risk assessments ā¢ Assist our librarians in creating, updating, and maintaining accurate PCB component libraries including symbols, footprints, 3D STEP models, and parametric data in CAD tools like Altium and Xpedition ā¢ Drive the future roadmap for SpaceX to incorporate custom AI tools to radically improve the efficiency of PCB design tasks. ā¢ 2+ years of experience with PCB layout and routing in one or all of the following areas: modern passive and active electronics components, surface-mount, RF components, ball-grid array and similar fine pitch, or high pin density components ā¢ 1+ years of experience with ECAD libraries and library configuration management ā¢ Demonstrated understanding of design for manufacturability, assembly, and test ā¢ Experience with Mentor Xpedition and/or Altium Designer (Mentor Xpedition preferred) ā¢ Experience with layout of mixed analog and digital designs, high-speed buses, FPGA, DRAM and CPU designs, power supplies, DC-DC converters, transmission lines, impedance-controlled traces and power traces ā¢ Proficiency in generating fabrication outputs (Gerber, ODB++, IPC-2581, drill files), DFM/DFA analysis, constraint-driven design, and collaboration with libraries (symbols, footprints, 3D models) ā¢ Ability to visualize component placement and interconnectivity ā¢ Proficiency in Python, Altium/Mentor Xpedition scripting, or similar for automating library tasks, data extraction, and validation ā¢ Demonstrated cross-functional project management skills and ability to collaborate with other engineering disciplines ā¢ Ability to work in a fast-paced, autonomously driven, and demanding start-up atmosphere ā¢ Excellent verbal and written communication skills.