You will:- Lead the design, architecture, and analysis of highācurrent, lowāvoltage DC powerādistribution systems (1 kWā100 kW+) for AI server and rackāscale platforms, including bus bars, highāpower PCBAs, and earlyāphase powerādelivery ccurrent density, thermal behavior, electromagnetic/inductive/resistive effects, isolation/creepage/clearance, and EMI/EMC in highācurrent applications- Collaborate crossāfunctionally with mechanical, thermal, and architecture teams to deliver manufacturable, scalable designs and support rapid prototyping, bringāup, and early validation- Document designs, drive trade studies, stay current on materials/connector technologies, and contribute to product strategy for nextā. You will architect and design high-current DC bus bars, power shelves, HV/LV distribution networks, and highāpower PCB assemblies that support the next generation of AI compute platforms and datacenter rack-level architectures.