You will:- Lead the design, architecture, and analysis of high‑current, low‑voltage DC power‑distribution systems (1 kW–100 kW+) for AI server and rack‑scale platforms, including bus bars, high‑power PCBAs, and early‑phase power‑delivery ccurrent density, thermal behavior, electromagnetic/inductive/resistive effects, isolation/creepage/clearance, and EMI/EMC in high‑current applications- Collaborate cross‑functionally with mechanical, thermal, and architecture teams to deliver manufacturable, scalable designs and support rapid prototyping, bring‑up, and early validation- Document designs, drive trade studies, stay current on materials/connector technologies, and contribute to product strategy for next‑. You will architect and design high-current DC bus bars, power shelves, HV/LV distribution networks, and high‑power PCB assemblies that support the next generation of AI compute platforms and datacenter rack-level architectures.