Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGAEvaluate and select packaging materials (substrates, mold compounds, underfills, adhesives) based on thermal, mechanical, and electrical propertiesDrive thermal management strategies within packages, including simulation and implementation of heat dissipation techniquesDefine and execute reliability test plans (e.g., thermal cycling, uHAST, HTOL) for qualification of package designsUtilize EDA/CAD tools (e.g., AutoCAD) for mechanical layout, with experience in ANSYS or other simulation tools as a plusApply DFM methodologies to ensure manufacturability, reliability, and testability from concept through productionProvide technical guidance for IC assembly and packaging processes, including SMT, die attach, reflow, wire bonding, underfill, and encapsulationConduct and support failure analysis investigations using tools like X-ray, SEM, FIB, and cross-sectioning to drive root cause and corrective actionsPerform root cause analysis and data-driven troubleshooting using tools such as FMEA, SPC, and Six Sigma methodologiesCollaborate with PCB and substrate design teams to ensure co-design compatibility and package-board integrationOwn project timelines, risks, and deliverables related to packaging initiatives and report progress to key stakeholders. Akoustis is now operating as a wholly owned subsidiary of SpaceX, providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary and connecting the world through Starlink.