align, bake, coat, expose, develop), electrochemical plating, die Attach, thermal compression bonding, compression molding/overmold, wafer dicing, scribe & break, stripping/etching, plasma, reactive ion etching (RIE), thin films deposition (CVD/PVD/ALD), dry film lamination & imaging • Proficiency in data analysis and process control software for statistical process control (SPC) • Physical stamina to manage equipment in a cleanroom suit and handle sensitive substrates • Experience with metrology tools such as confocal scanning acoustic microscopy (C-SAM), 3D profilometers, stereoscopes, optical tensiometers (goniometer), X-Ray fluorescence (XRF) • Excellent manual dexterity with the ability to work with both hands under a microscope. bouffant caps, gowns, masks, nitrile gloves, ESD footwear, bunny suits, hoods) for full shifts • Standing for long periods, bending, grasping, sitting, pulling, pushing, stooping & stretching • Must be able to lift up to 35lbs.