Camera SIPI Engineer

Apple is where individual imaginations gather together, committing to the values that lead to great work. Every new product we build, service we create, or Apple Store experience we deliver is the result of us making each other's ideas stronger. That happens because every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. It's the diversity of our people and their thinking that inspires the innovation that runs through everything we do. When we bring everybody in, we can do the best work of our lives. Here, you'll do more than join something - you'll add something.

Do you love taking on big challenges that require exceptionally creative solutions? Do you deeply understand how an incredible camera experience should work? As part of our Camera Technologies group, you'll help design the innovative technology that allows each generation of Apple products to produce photos even more incredible than the last. You'll design and develop groundbreaking ideas for everything involved in our camera systems, from sensor to lens. You'll collaborate with teams across Apple to research, design, develop, test, and qualify camera hardware for Apple products. Together, we'll craft a magical photography experience that redefines what millions of customers can expect from their cameras. Bring passion and dedication to your job and theres no telling what you could accomplish! The Camera Hardware Engineering group is responsible for the design, development, and innovation of camera hardware for all related Apple products. This covers RGB wide, ultra-wide, & tele rear cameras as well as the "selfie" front camera. Additionally, we support rear depth sensing as well as the "face ID" front sensing modules. Our target is to deliver superior camera hardware to enable best-in-class camera user experience. We are looking for an enthusiastic, high energy individual who can help us with tomorrow's challenges. They should be highly self-motivated and proactive with critical thinking.Model and analyze camera sub-system SI/PI performance & component-level EM (Desense & Susceptibility) risk and provide feedback/recommendations for design optimization Assist senior team members to drive new design characterization, validation and correlation Collaborate with system team for high speed channel and power delivery network budgeting for camera feature integration Participate in design feasibility studies for future technologies Develop new simulation methodologies for sign-off analysisBS in Electrical Engineering or other relevant field of interest. Experience in high speed signal and/or PDN fundamentals. Experience in main-stream tool chain e.g HFSS, SI-Wave/PSI, Q3D, CST and/or ADS.MS/PhD in Electrical Engineering or other relevant field of interest with at least 10 years of industry related experience. Academic or industry exposure to camera or SI/PI technical areas and/or electro-magnetic concepts. Experience running substrate, package, flex, and/or PCB level SI/PI simulations. Comfortable to handle VNA, TDR, and/or Oscilloscope in academic or professional settings. Great communication skills to work with x-functional teams. Academic knowledge or experience with image sensor or camera module. Proficient in using JMP for statistical analysis. Experience in Python scripting for automating simulation setup.