Texas Instruments' Advanced Technology Development team is looking for an energetic engineer with a passion for process development. This position provides the opportunity to enable new technologies for future Texas Instruments revenue growth. We are searching for a self-directed, highly motivated engineer to join our Lehi, UT Process Development team.
The responsibilities of a Process Development Engineer in this role include:
- Develop new processes and define processing and equipment requirements, specifications, and manufacturing methods for advanced semiconductor applications.
- Influence process integration schemes and support technology development from early paper studies and pilot work through full-scale manufacturing.
- Translate business unit roadmap requirements into pathfinding and process development projects.
- Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications
- Lead or support projects involving new process concepts, equipment selection, chemistry development, automation technologies, and novel manufacturing approaches.
- Provide technical engineering support in manufacturing and drive process and equipment modifications that improve production efficiency, technical capability, and yield.
- Develop and apply statistical methods, including Design of Experiments (DOE) and Statistical Process Control (SPC), to identify physical causes of yield loss and improve quality.
- Partner with equipment suppliers and vendors to define and execute equipment and process development roadmaps.
- Work across 300mm deposition platforms, including current single-wafer ALD and CVD systems.
Minimum requirements:
- Master's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
- 5+ years relevant experience in 300mm Advanced (
- Working knowledge of Process development, characterization and control of Thin films processing equipment, CVD, PE-CVD, Single-wafer ALD
- Strong supplier engagement skillset
- Strong foundation in statistical process control, Design of Experiments (DOE), data analysis, model-based problem solving, engineering change control, and process release strategies
Preferred qualifications:
- 5 years relevant experience in 300mm Advanced logic of advanced memory device technologies: Specific experience on RMG products
- Working knowledge of advanced CMOS device physics and reliability mechanisms
- Hands on Process Experience across multiple 300mm deposition platforms for dielectric, High-K and Metals
- Experience with Single-wafer ALD such as ASM XP4 Pulsar & XP8 platforms, as well as Batch ALD platforms
- Familiarity with 300mm Semiconductor Single wafer Thermal, RTA, Laser Anneal systems
- Direct R&D experience in 300mm semiconductors
- Experience with HKMG, Silicon Photonics
- Device physics training with understanding of materials, material evolution; structural characterization and electrical test characterization
- Data analysis skills
- Ability to work in teams and collaborate effectively with people in different functions and locations
- Strong relationship-building, communication, time management, and results-oriented collaboration skills to enable on-time project delivery
Minimum requirements:
- Master's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
- 5+ years relevant experience in 300mm Advanced (
- Working knowledge of Process development, characterization and control of Thin films processing equipment, CVD, PE-CVD, Single-wafer ALD
- Strong supplier engagement skillset
- Strong foundation in statistical process control, Design of Experiments (DOE), data analysis, model-based problem solving, engineering change control, and process release strategies
Preferred qualifications:
- 5 years relevant experience in 300mm Advanced logic of advanced memory device technologies: Specific experience on RMG products
- Working knowledge of advanced CMOS device physics and reliability mechanisms
- Hands on Process Experience across multiple 300mm deposition platforms for dielectric, High-K and Metals
- Experience with Single-wafer ALD such as ASM XP4 Pulsar & XP8 platforms, as well as Batch ALD platforms
- Familiarity with 300mm Semiconductor Single wafer Thermal, RTA, Laser Anneal systems
- Direct R&D experience in 300mm semiconductors
- Experience with HKMG, Silicon Photonics
- Device physics training with understanding of materials, material evolution; structural characterization and electrical test characterization
- Data analysis skills
- Ability to work in teams and collaborate effectively with people in different functions and locations
- Strong relationship-building, communication, time management, and results-oriented collaboration skills to enable on-time project delivery