Assembly Drawings, Ball Grid Array (BGA), Bill of Materials (BOM), Communication Skills, Integrated Circuits (ICs), MPI, Presentation/Verbal Skills, Soldering, Surface Mount Technology, Writing Skills
We are looking for a temp to hire TU/RW operator to join the team in Milpitas, CA. Day Shift OR Swing Shift.
Job Description
- Perform Hand solder & Touch-up rework for SMT & Through-hole (including BGA and ICs) components and Jumper wire, remove/install components as per IPC-A-610 is a plus
- Perform rework based on the ECO, Process Deviation, and/or MPI instruction using certain type of solder/Flux (Leaded/Lead-Free clean or No clean process).
- Must Understand ESD, Board handling, and Safety Practices.
- Install and hand solder all 2nd op. & SMT parts required per MPI & deviation process.
- Ability to lift materials/equipment’s from 15 – 50 lbs.
- Be flexible to work on all SMT and/or T/H components as/when required.
Job Qualification
- 1-2 years of experience using a soldering iron
- 1-2 years of experience performing touch up/rework on SMT components
- 1-2 years of experience performing touch up/rework on thru-hole components
- Good written and verbal communication skills required.
- Must be capable of reading and interpreting assembly drawing, specifications, BOM, MPI, components value as per the job on hand and the process instruction/procedure.