Thermal/Mechanical Engineer

Kaizen Stackup

  • Santa Ana, California
  • 30+ days ago

    Highlights

    The Thermal/Mechanical Engineer will design, model, and validate advanced thermal solutions for high-performance memory and storage hardware used by top-tier OEMs, ODMs, and hyperscale clients. We are seeking a highly skilled Thermal/Mechanical Engineer to join a leading engineering team in the development of innovative thermal solutions for memory and storage products .

    Numbers & Facts

    LocationSanta Ana, California

    Description

    Thermal/Mechanical Engineer

    Location: California
    Reports To: Vice President, Systems Engineering
    Salary Range: $150,000 – $170,000

    Overview

    We are seeking a highly skilled Thermal/Mechanical Engineer to join a leading engineering team in the development of innovative thermal solutions for memory and storage products. This role will play a critical part in shaping next-generation technologies that support AI, cloud computing, and enterprise infrastructure.

    Position Summary

    The Thermal/Mechanical Engineer will design, model, and validate advanced thermal solutions for high-performance memory and storage hardware used by top-tier OEMs, ODMs, and hyperscale clients. The ideal candidate will combine deep technical expertise with hands-on design and problem-solving skills.

    Key Responsibilities

    • Create mechanical and thermal models of electrical and mechanical assemblies using CAD files or from scratch.

    • Design or source thermal solutions for advanced memory and storage products.

    • Run simulations to validate that thermal designs meet specified requirements.

    • For custom solutions, specify required materials and prepare detailed fabrication and assembly drawings.

    • Develop and implement Design of Experiments (DoEs) to evaluate thermal properties of assemblies.

    • Collaborate with electrical engineering teams, providing feedback and design suggestions.

    • Generate assembly drawings and ensure proper documentation of assembly processes.

    • Partner with manufacturing to guarantee assemblies are built to specifications.

    Qualifications

    • Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or a related field.

    • 8+ years of industry experience in IC packaging design, thermal, or mechanical engineering.

    • Proficiency in mechanical drawing tools such as AutoCAD and SolidWorks.

    • Experience with thermal analysis and simulation tools such as Flowtherm or Icepak.

    • Familiarity with thermal interface materials (heat sinks, spreaders, greases, gap pads, etc.) is desirable.

    • Strong problem-solving abilities, attention to detail, and ability to innovate.

    • Excellent communication skills, professionalism, and ability to work cross-functionally.

    • Proven stakeholder management and influencing skills.

    • Knowledge of memory and storage components (DDRx, LPDDRx, NAND) and modules (DIMMs, SSDs, etc.) is highly desirable.

    • Willingness to travel occasionally (less than 10%).

    Why This Role Stands Out

    • Work on cutting-edge thermal solutions powering the next generation of computing and storage.

    • Collaborate with world-class engineers in a fast-paced, innovative environment.

    • Competitive salary and growth potential.

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