Thermal / Mechanical Engineer

Netlist

  • Irvine, CA
  • 30+ days ago
  • $150,000–$170,000 Per Year

Highlights

Netlist is looking for an exceptional Thermal/Mechanical Engineer to develop thermal solutions for memory and storage products for sale to top tier OEMs/ODMs and Hyperscalar customers. BSEE or MSEE (preferred) in Mechanical Engineering, Thermal Engineering, or related field of study with 8+ years of directly related industry experience in IC Packaging Design.

Numbers & Facts

LocationIrvine, CA
Salary$150,000–$170,000 Per Year

Description

Thermal/Mechanical Engineer 

Reports To: Vice President, Systems Engineering

Company Overview:

Netlist Inc. (NASDAQ: NLST) is a leading provider of high-performance modular memory subsystems and next-generation storage-class memory solutions. We specialize in cutting-edge technologies that enable innovation in AI, cloud computing, and enterprise infrastructure. Our product portfolio includes DDR4/DDR5 DIMMs, NAND-based SSDs, and advanced interconnect technologies such as CXL and PCIe.

Join our world-class engineering team and be part of shaping the future of memory and storage architecture.

Position Summary

Netlist is looking for an exceptional Thermal/Mechanical Engineer to develop thermal solutions for memory and storage products for sale to top tier OEMs/ODMs and Hyperscalar customers.

Key Responsibilities:

  • Create mechanical and thermal models of electrical and mechanical assembles either from scratch or from PCB CAD files
  • Source or design thermal solutions for memory and storage products.
  • Run thermal simulations to verify the thermal solutions meet the specified requirements
  • For custom designs, specify all the required materials and create fabrication and assembly drawings as necessary
  • Create and implement Design of Experiments (DoEs) to evaluate thermal properties of electrical assemblies
  • Feedback concerns and suggestions to electrical team
  • Create assembly drawings which specify the assembly process
  • Work with manufacturing to ensure that assemblies are created properly

Required Qualifications:

  • BSEE or MSEE (preferred) in Mechanical Engineering, Thermal Engineering, or related field of study with 8+ years of directly related industry experience in IC Packaging Design.
  • Must have knowledge of mechanical drawing tools (AutoCAD, SolidWorks, etc.)
  • Must have knowledge of thermal analysis/simulation tools (Flowtherm, Icepak, etc.))
  • Knowledge of thermal materials (IC heat sinks and heat spreaders, thermal greases and epoxies, thermal gap pads, etc.) is desirable.
  • Must possess the drive to innovate and tackle new challenges.
  • Must possess good communication skills and professionalism in representing his/her work.
  • Must have excellent problem-solving skills
  • Must have strong interpersonal skills, stakeholder management, communication and influencing skills
  • Must have the ability to assume responsibility and be proactive  in taking initiative to address issues, set direction and meet commitments
  • Knowledge of memory/storage components (DDRx, LPDDRx, NAND) and modules (DIMMs, SSDs, etc.) is very desirable.
  • Physical demands for an office position with heavy computer use
  • Ability to travel (less than 10%)

Salary Range: $150,000 - 170,000

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