Application Monitoring & Automation Engineer Pinnacle Technical Resources
- Contractor
| Location | Fort Worth, TX |
For our site in Holon, we are looking for a Thermal and Flow Analysis Engineer to join a multidisciplinary team developing advanced electronic packaging solutions in a dynamic and innovative environment
In this role you will:
Perform thermal and flow analyses for electronic packaging systems
Work in accordance with aerospace standards and environmental conditions such as MIL-STD810
Lead and manage projects from thermal and structural aspects
Participate in and support thermal and dynamic environmental laboratory tests
Manage and guide subcontractors in analysis and design activities
Requirements:
B.Sc. in Mechanical Engineering
At least 5 years of experience in analysis engineering
Experience in thermal and dynamic testing
Knowledge in material and coating selection - Advantage
Knowledge in static and dynamic structural calculations - Advantage
High level of English
Team player with creative thinking and ability to work flexible hours when needed
#Holon