Qualifications:
• Bachelor's degree or higher in Science or Engineering
• Experience with a wide range of analytical techniques such as SEM/EDS, HPLC, GC, AES, wet chemical techniques, and surface analysis methods. Experience in applied electrochemistry is preferred
• Attention to detail and procedure as defined by best practices within the Metallization team
• Strong team player and must be able to work independently with limited supervision
• Effectively communicates verbally and in writing to team members and management on all aspects of program activity
• Previous experience and knowledge of metallization processes used for conductive and non-conductive substrates
• Previous semiconductor, circuit board manufacturing or industrial experience
Responsibilities:
• Performing routine tests according to established protocols and procedures.
• Evaluation of new metallization products and processes and the new technologies.
• Optimization and improvement of processes within the Electroplating and Making Holes Conductive (MHC) areas
• Processing and evaluation of plated samples using cross-sectioning, X-Ray analysis and surface characterization techniques
• Analyzing and monitoring bath compositions using analytical methods such as titration and electrochemical measurements
• Support the Field Service Team with new product installations, troubleshooting and related technical activities
• Operate and maintain electroplating equipment to ensure optimal performance
• Collaborate effectively with other functional groups (such as Marketing, R&D, Applications Technical Support, Customer Service, Supply/Demand Planning, etc...) to deliver a high-quality customer service to
• Adhere to and promote environmental, health, and safety (EHS) best practices