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Description
As a Technical Project Lead (TPL) at Seek Thermal, you will own the technical critical path of one or more new-product programs-the chain of design decisions, integrations, and verifications that determines whether the product works and ships. You will be accountable for design outputs, design reviews, and technical trade-offs-working alongside program management while coordinating engineering across electrical, mechanical, software/firmware, optics, and systems to bring LWIR thermal imaging products from concept through production. The Technical Project Lead will report directly to the SVP of Engineering.
This is not a remote Position
RESPONSIBILITIES:
- The Technical Project Lead will own the technical critical path of new product development (NPD) programs through phase gates (concept through DV, PV, and production release)-know at all times which technical task gates the program, and keep the multidisciplinary team focused on it.
- Ensure design outputs and design-review materials are complete and defensible at every gate, and provide the technical readiness signal for gate sign-off.
- Make and document technical trade-offs (e.g., image quality, runtime, cost, architecture), with cross-functional approval for scope and design changes.
- Identify technical risks early, assess their critical-path impact, and drive mitigation of technical exposure across the program.
- Assign engineering tasks, drive technical status at program meetings in step with program management, and own design documentation and approvals per Seek's design-control process.
- Drive root-cause and corrective action (8D) when sensor, manufacturing, or integration failures threaten a milestone
- Ensure PRD requirements are testable and verification is defined before design gates; pull hardware/software integration risks off the critical path early.
- Provide technical deliverables (SOWs, specifications) for supplier engagements and represent engineering with customers, change control boards, and leadership.
SKILLS KNOWLEDGE AND ABILITIES:
- The Technical Project Lead should possess hands-on embedded systems depth (e.g., RTOS debugging, multicore SoC/MPSoC platforms, I2C/SPI, MIPI CSI, hardware/software co-design) with independent technical judgment.
- Experience developing products under structured quality and development processes (e.g., functional safety, ASPICE, ISO 9001, or similar) within formal design controls.
- Fluency with phase-gate development, PRD/requirements management, DV/PV verification, 8D, RASIC, and planning tools (Jira, SmartSheets).
- Proven technical coordinator of distributed cross-functional teams and a clear communicator-holds a technical position, escalates cleanly, and commits once decided.
- Preferred: thermal/IR imaging (FPA/ROIC, NUC/AGC, LWIR optics), automotive qualification, semiconductor packaging/yield analysis, Agile/Scrum leadership.
Requirements
- Bachelor's or Master's degree in Electrical Engineering, Software Engineering, Mechatronics, Physics, Optical Engineering, or related field.
- 5+ years of engineering experience, including 2+ years owning the technical critical path of embedded hardware/software programs, with at least one shipped sensing or electro-optical product taken through production.
- Must be a U.S. Person (U.S. citizen, lawful permanent resident, or protected individual) as required by ITAR/EAR export control regulations.
PM18
Salary Description
$140,000 - $160,000 Plus bonus potential