Technical Product Manager - AI Data Center Interconnect

Overview

Own the roadmap and product definition for next-generation copper, optical, and RF interconnect solutions used in AI and hyperscale data centers. Combine system-level technical depth with customer-facing product leadership.

Responsibilities

Define product strategy and requirements for high-speed interconnects (copper, optical, RF).

Translate customer needs into MRDs/PRDs and drive cross-functional execution.

Work with system architects, ASIC/xPU teams, board designers, and SI engineers.

Support technologies including co-packaged optics, near-packaged optics/copper, and advanced interconnect architectures.

Engage with hyperscalers, OEMs, and ecosystem partners to validate roadmaps and requirements.

Develop technical collateral and support product launches.

Qualifications

• MS in Electrical Engineering or related field.
• 5-7 years in system design, cable/interconnect design, or technical product management.
• Strong understanding of signal integrity, high-speed channels, and data-center system architectures.
• Experience working with technical and commercial customer teams.
• Excellent communication and cross-functional leadership skills.

Location(s)

Silicon Valley, CA (San Jose metro area) Irvine, CA (Orange County area)