Substrate Layout Engineer - 176081

Zp Group Llc

  • Sarasota, CA
  • 6 days ago
  • $180,000–$270,000 Per Year

Highlights

Responsibilities: of the Substrate Layout Engineer: • Perform physical layout of organic substrates and interposers, including die placement, bump-map alignment, netlist implementation, escape routing, signal routing, power routing, reference planes, via structures, and stack-up implementation. • Support routing feasibility studies and collaborate with package integration, ASIC, signal integrity, power integrity, and mechanical engineering teams.

Numbers & Facts

LocationSarasota, CA
Salary$180,000–$270,000 Per Year

Description

Responsibilities: of the Substrate Layout Engineer: • Perform physical layout of organic substrates and interposers, including die placement, bump-map alignment, netlist implementation, escape routing, signal routing, power routing, reference planes, via structures, and stack-up implementation. • Develop routing solutions for high-speed interfaces and high-current power delivery networks. • Support routing feasibility studies and collaborate with package integration, ASIC, signal integrity, power integrity, and mechanical engineering teams. • Apply and maintain layout constraints while coordinating design reviews with cross-functional stakeholders. • Perform connectivity verification, DRC, DFM, and manufacturing rule checks. • Prepare release databases, design documentation, and manufacturing deliverables. • Work directly with substrate suppliers, fabrication partners, and manufacturing teams to resolve design and manufacturability challenges. • Support package interface board layout activities and contribute to process improvements and best practices. Requirements of the Substrate Layout Engineer: • 8+ years of hands-on experience with substrate, package, interposer, or complex multilayer PCB layout design. • Experience with Siemens Xpedition, Cadence Allegro, or comparable package and PCB layout tools. • Strong knowledge of high-density routing, bump escape techniques, via structures, and stack-up implementation. • Working understanding of high-speed signal routing and/or power delivery network design. • Experience performing connectivity checks, design rule checks (DRC), design for manufacturability (DFM), and manufacturing release procedures. • Ability to collaborate effectively with engineering teams, suppliers, and manufacturing partners. • Experience supporting multi-die, chiplet-based, or advanced package designs is highly preferred. • Bachelor's degree in Engineering or equivalent combination of education and relevant industry experience. Compensation: for the Substrate Layout Engineer: • Salary range: $180,000 - $270,000 base salary • Full Comprehensive Benefits: Health, Vision, Dental, PTO, Paid Holiday and Sick Leave if Required by Law.

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