Staff Electronic Engineer

Qualifications:

• AA degree, BSEET, or equivalent experience in Electronics, Electrical Engineering, or a related technical field. 
• 5+ years of experience laying out complex multilayer PCBs for commercial, industrial, or related electronic products. 
• Advanced proficiency with Altium Designer, Cadence Allegro, or comparable PCB layout platforms. 
• Strong expertise in multilayer PCB layout, including analog, digital, mixed-signal, high-speed, and power board design. 
• Hands-on experience applying signal integrity, power integrity, EMI/EMC mitigation, stackup definition, and DFM/DFA methodologies. 
• Experience creating manufacturing release packages including Gerber files, ODB++ files, fabrication drawings, and assembly documentation. 
• Experience supporting prototype builds and resolving PCB layout issues during system bring-up. 
• Experience with semiconductor equipment, industrial automation, or other high-reliability electronic systems preferred. 

Responsibilities:

• Create and optimize PCB layouts for complex multilayer printed circuit boards, including routing, stackups, controlled impedance requirements, and manufacturing release preparation. 
• Apply signal integrity, power integrity, EMI, and EMC design practices to ensure performance, reliability, and stable power delivery. 
• Collaborate with electrical, mechanical, firmware, test, and manufacturing teams to translate system requirements into manufacturable PCB designs. 
• Generate complete production release packages, maintain PCB libraries, and ensure footprint accuracy and design consistency. 
• Support prototype builds, resolve layout-related issues, incorporate DFM and DFA requirements, and work with manufacturing vendors to address stackup and fabrication requirements.