SoC IP and System Applications

TYLsemi

  • San Jose, California
  • 29 days ago

    Highlights

    Technical fluency in SoC or chiplet design flows — enough to understand RTL milestones, DV sign-off, PD handoffs, and silicon bring-up phases without needing translation. Translate customer requirements (silicon architecture, interface specs, package form factor, delivery schedules) into internal program plans with clear owners and dates.

    Numbers & Facts

    LocationSan Jose, California

    Description

    About the role

    TylSemi is looking for a IP and Systems Application Engineer who can sit at the intersection of silicon, IP, and customer success. You will own the operational thread that connects our stretagic initiatives to customers — making sure every engagement moves with precision from idea to silicon.

    This is a high-visibility, high-ownership role at a company in its earliest and most consequential stage. You will work directly with founders, customers, the leading semiconductor ecosystem players. No layers, no ambiguity about impact.

    What you'll do

    • Manage active customer engagements: from IP and SoC architectural spec alignment through silicon and systems bringup and volume shipment milestones
    • Ensure alignment with internal enginering and ecosystem partners — including foundries, OSAT/packaging houses, EDA vendors (Synopsys, Cadence), and IP partners
    • Translate customer requirements (silicon architecture, interface specs, package form factor, delivery schedules) into internal program plans with clear owners and dates
    • Build and maintain trackers, risk registers, and executive dashboards covering each engagement
    • Drive gate reviews and weekly program syncs across internal RTL/DV, physical design, and validation teams
    • Manage internal and external scoping and delivery timelines in coordination with technical and business teams
    • Identify and escalate risks early; propose and implement mitigations before they become schedule threats

    What you bring

    • 15+ years of technical customer management experience in semiconductor, custom silicon, or chiplet/advanced packaging environments
    • Experience interfacing with ecosystem partners — chip development schedules, interdepencies on EDA and IP, tape-out schedules and system bringup timelines
    • Familiarity with silicon fabrication, advanced packaging formats: CoWoS, InFO, 2.5D/3D integration, substrate/interposer-based assembly
    • Technical fluency in SoC or chiplet design flows — enough to understand RTL milestones, DV sign-off, PD handoffs, and silicon bring-up phases without needing translation
    • Strong communication skills — comfortable presenting program status and risk posture to internal and external stakeholders
    • Proficiency with program tracking tools (and spreadsheet-based trackers); experience building program infrastructure from scratch is a plus
    • Familiarity with key connectivity IPs UCIe, PCIe Gen 5/6/7+, or high-bandwidth D2D interconnect standards is a strong plus

    Nice to Have to Shine

    • Prior experience at an IP company, chiplet startup, merchant silicon company, or systems company
    • Background in AI/ML infrastructure silicon — accelerators, network switches, CPO-enabled platforms
    • Exposure to EDA infrastructure programs (SNPS/CDNS cloud flows)

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