Senior Substrate Design Layout Engineer

Responsibilities: of the Senior Substrate Design Layout Engineer include: · Lead detailed layout activities for complex organic substrates, including bump planning, routing schemes, and multilayer stack‑up development. · Define routing and power‑delivery strategies that support high‑speed interfaces and high‑current architectures across advanced package substrates. · Collaborate closely with integration, silicon, SI/PI, and mechanical teams to ensure cohesive co‑design and layout feasibility. · Evaluate design risks early in development and recommend layout‑driven improvements to meet electrical, mechanical, and manufacturability constraints. · Interface with substrate suppliers and OSAT partners to validate design readiness, manufacturability, and overall yield performance. Qualifications: for the Senior Substrate Design Layout Engineer include: · 10+ years of experience in advanced organic substrate design or high‑performance IC package layout. · Background working with multi‑die, chiplet, or high‑density module architectures using ABF and multilayer organic technologies. · Proficiency in Siemens Xpedition (preferred) and experience with tools such as Cadence Allegro/APD. · Hands‑on experience collaborating with OSATs and global substrate vendors, including driving designs through tape‑out. · Strong understanding of SI/PI concepts, HDI structures, and routing practices supporting high‑speed signals and advanced power delivery networks. Compensation: for the Senior Substrate Design Layout Engineer: Salary Range: $235,000-$265,000/year (USD) Comprehensive Benefits: Medical, Dental, Vision, sick leave if required by law, and 401K This job opens for applications on 10/30/26. Applications for this job will be accepted for at least 30 days from the posting date.