For 80 years, Murata Electronics has been a tireless innovator, committed to developing technologies that profoundly change the world around us. Our solutions are inside more state-of-the-art products than you may imagine. Additionally, we enable other global companies to turn their visions into reality - from mobile communications to computers and networking, medical devices to power solutions, smart home technologies to automotive electronics. Our past innovations drive todays technology - and our present innovations are shaping tomorrows.
Whatever the future holds, you can be sure that Murata will be a part of it.
Why Consider This Job Opportunity
The Senior Power Engineer leads technical marketing for next generation AI data center power delivery from PDB/IBC through package/on-die delivery networks. Work directly with customers and internal engineering teams to translate emerging system challenges into quantitative requirements, technology roadmaps and new R&D initiatives.
Workplace Policy
Hybrid from San Jose, CA.
What To Expect (Essential Job Responsibilities)
- Analyze end to end AI server power delivery from rack/PDB and 48V IBC stages through multiphase VRs, PoL converters, and integrated regulators.
- Translate customer needs into quantitative electrical, thermal, mechanical including voltage, current efficiency, power density, transient response.
- Identify the system-level problem behind customer component specifications.
- Create and advance design-in, joint-evaluation, and co-development opportunities by connecting customer roadmaps with internal product and R&D capabilities.
- Serve as the technical interface among customers, sales, product divisions, corporate R&D, and external partners; proactively initiate communication to obtain required information and drive decisions.
Miscellaneous Job Responsibilities
- Monitor emerging technologies and ecosystem changes, including 800 VDC rack distribution, vertical power delivery, TLVR, switched-capacitor and hybrid converters, IVR, backside power delivery, glass-core substrates, through-glass vias, embedded power components, and advanced cooling.
- Build relationships with universities, startups, semiconductor companies, packaging suppliers, and research institutes to identify collaboration and innovation opportunities.
- Support predominantly virtual collaboration with sales, technical support, and customer teams across Dallas, San Jose, and other U.S. and global locations; travel as required for customer and partner engagements.
- Perform other related duties and support cross-functional initiatives as assigned. This position is currently intended as an individual-contributor role with no direct supervisory responsibility unless otherwise assigned.
What Is Required (Qualifications)
- Bachelor's degree in electrical engineering, Power Electronics, Semiconductor Engineering, Electronic Packaging, or a closely related technical field.
- 5+ of relevant industry experience in power electronics, server/data center power architecture, board- or package-level PDN/power integrity, semiconductor power applications, power modules, magnetics, or passive components.
- Strong understanding of DC-DC power conversion, including buck and multiphase converters; working knowledge of IBC, POL, switched-capacitor, coupled-inductor, or related architectures.
- Working knowledge of target impedance, decoupling, voltage droop, transient response, and parasitic resistance and inductance across board and package interconnects.
- Ability to convert customer needs into measurable technical requirements, product specifications, technical proposals, or development plans.
- Strong communication and presentation skills with the ability to engage circuit designers, package
- engineers, system architects, commercial teams, and senior leadership.
- Ability to work independently, initiate cross-site communication, and lead projects across organizational and geographic boundaries.
How To Stand Out (Preferred Qualifications)
- Masters degree or Ph.D. in Electrical Engineering, Power Electronics, Semiconductor Engineering, Electronic Packaging, or a related field.
- Experience with Hyperscalers, AI accelerator companies, server OEMs/ODMs, power solution suppliers, or advanced packaging organizations.
- Experience with 48 V/54 V power delivery, high-voltage DC distribution, TLVR, vertical power delivery, IVR, hybrid converters, or processors operating above 1 kW or at kiloampere-class current levels.
- Knowledge of advanced packages, interposers, glass-core substrates, TGV, embedded passives, backside power delivery, thermal design, or liquid cooling.
- Previous technical marketing, product management, field applications, new product definition, customer co-development, design-in, or design-win experience.
Travel
Infrequent domestic and international travel.
Perks
- Comprehensive benefits package including medical, dental, and vision insurance.
- Generous Paid Time Off including paid holidays and floating holidays.
- 401(k) employer match on retirement planning.
- Hybrid working schedule for eligible positions.
- Tuition reimbursement on approved programs.
- Flexible and health spending accounts.
- Talent Development program.
Imagine the possibilities as a member of Muratas innovative global team.
Be an innovator - Join Murata!
Murata offers competitive compensation and comprehensive benefits.
Equal Opportunity/Affirmative Action Employer - M/F/Disabilities/Veterans