Senior Manufacturing Engineer - Thin Film Engineering (Pvd, Pecvd, ALD & Rie)

About Ensurge Micropower

Ensurge Micropower (OSE: ENSU) is a pioneer in solid-state microbattery technology,

enabling the next generation of intelligent, connected devices. Leveraging proprietary thin-film and roll-to-roll manufacturing, Ensurge delivers safe, high-energy-density batteries for

wearables, health tech, industrial sensing, and defense applications. As our technology

transitions from development to production, disciplined manufacturing execution becomes the

differentiator.

Role Overview

Ensurge is seeking a Senior Manufacturing Engineer (IC) to own and scale the Thin-Film

Engineering processes - deposition (PVD/Sputtering, PECVD, ALD) and etch (RIE) - from

pilot through early production. This role is not just about process - it is about delivering

manufacturing results.

Responsibilities

Own daily manufacturing performance for the PVD/Sputtering, PECVD, ALD, and RIE

process areas

• Drive output, yield, uptime, and cycle time
• Support production directly - troubleshooting issues in real time
• Partner with Operations to ensure line execution meets plan

Convert R&D processes into repeatable, production-ready workflows

• Define and lock critical process parameters (CPPs) - e.g., chamber pressure, Ar/process

gas flow, RF/DC power, substrate bias, deposition rate, film stress and thickness

uniformity targets (PVD/PECVD); precursor/co-reactant pulse and purge times, cycle

count, growth per cycle (GPC), and substrate temperature (ALD); RF power, gas

chemistry (e.g., CF4/O2/Cl2), etch rate, selectivity, sidewall profile/anisotropy, DC bias,

and endpoint detection (RIE)

• Define and lock control limits and OCAPs
• Ensure processes are robust, stable, and scalable

Work with Equipment Engineering to:

• Define tool requirements (sputter cathodes/targets, PECVD chambers, ALD reactors and

precursor delivery systems, RIE/ICP-RIE chambers and endpoint detection systems,

RF/DC power supplies, vacuum, gas delivery, and abatement/scrubber systems)

• Improve reliability and uptime
• Implement process-driven upgrades
• Lead tool qualification and process acceptance
• Ensure equipment supports throughput, precision, and repeatability

Own flow from substrate input deposition/etch downstream handoff to assembly

• Reduce bottlenecks, WIP, and inefficiencies
• Improve line balance and production scheduling alignment
• Support layout and flow improvements as the system scales

Partner with Quality to implement:

• SPC and process control on film thickness, stress, uniformity, and conformality
• Film characterization (ellipsometry, profilometry, XRD, SEM/AFM, four-point probe) to validate deposition results against CPPs
• Traceability and data capture

Build and maintain:

• SOPs
• Process specs
• Control plans
• Ensure manufacturing is data-driven and auditable

Lead structured RCA on:

• Yield loss
• Defects
• Downtime
• Use characterization data (SEM, XRD, cross-section imaging) to root-cause excursions
• Implement sustainable fixes - not workarounds
• Drive continuous improvement aligned to operational excellence principles (standard work, DMS, etc.)

Qualifications

Required

• 7-12+ years in manufacturing engineering with thin-film deposition and etch

(PVD/sputtering, PECVD, ALD, and/or RIE) in battery, semiconductor, or thin-film

industries

• Proven experience owning manufacturing processes on the floor
• Strong track record of driving yield and throughput improvements
• Experience supporting or leading pilot production scale-up
• Hands-on mindset - comfortable working directly with equipment, technicians, and

operators

• Working knowledge of thin-film characterization techniques (e.g., ellipsometry,

profilometry, XRD, SEM) and their use in validating and controlling deposition processes

Preferred

• Understanding of film stress engineering, plasma physics, RF coupling, and DC self-bias
• Understanding of plasma etch chemistry, selectivity, anisotropy, and endpoint detection

(RIE/ICP-RIE)

• Familiarity with ALD precursor chemistry, self-limiting surface reactions, and pulse/purge sequencing
• Vacuum systems and chamber conditioning experience
• Experience with image-based film/defect characterization (SEM, optical microscopy) and

correlating characterization data back to process control limits

• Experience with MES, traceability systems, or data-driven manufacturing

Salary Range:

$162,000-$198,000

The base salary range is specific to California. The salary of the final candidate selected for this role will be determined by a variety of factors, including, but not limited to, internal equity, experience, education, specialty, and training.