| Location | San Francisco, California |
| Website | https://www.orionsleep.com/ |
Responsibilities
Architect, design, and build our second generation hardware platform from concept to production
Own full system design including PCB layout, component selection, power management, and thermal management systems
Design and integrate thermoelectric cooling solutions with appropriate thermal control and monitoring
Develop cable assemblies and interconnect solutions for product reliability and manufacturability
Build robust, production-ready boards that can withstand real-world use and stress conditions
Establish hardware validation protocols including environmental stress testing, thermal cycling, and reliability testing
Work directly with overseas vendors and CMs for component sourcing, manufacturing, and quality control
Mentor and manage junior hardware engineers as the team grows
Ensure seamless integration between hardware, firmware, mobile apps, and backend services
Drive DFM (Design for Manufacturing) and cost optimization while maintaining quality standards
Requirements
5+ years designing and shipping consumer electronics products
Hands-on experience with Realtek and STM32 microcontrollers and their ecosystems
Expertise in WiFi/BLE integration and RF debugging
Strong background in power electronics design and thermal management systems
Specific experience with thermoelectric cooling (Peltier) design and control
Proven ability to design robust, reliable boards for high-volume consumer products
Experience working with overseas suppliers and CMs across the full product lifecycle
Experience mentoring junior engineers and building technical teams
Track record of conducting comprehensive stress testing (thermal, vibration, drop, EMC)
Strong plus: Firmware development experience (embedded C/C++, RTOS, driver development)
Strong plus: Has owned complete hardware products end-to-end from concept through mass production
Preferred: Experience taking consumer products through FCC/CE certification