Senior Hardware Design Engineer - Aerospace, Defense & Imaging

FAE Technology SpA

  • Tucson, AZ
  • 3 days ago

    Highlights

    The role involves: Hardware Architecture and Design: Define the electronic architecture of complex multi-platform systems, selecting key components (FPGA, SoC, memories, power management) based on cost, space, power consumption, and reliability constraints. The successful candidate will lead hardware development from requirements definition through laboratory bring-up, with a strong focus on multicore FPGA/SoC-based systems and the management of ultra-high-speed digital interfaces (High-Speed Digital Design).

    Numbers & Facts

    LocationTucson, AZ

    Description

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    Senior Hardware Design Engineer - Aerospace, Defense & Imaging

    We offer: Contract type and compensation will be defined based on the candidate's experience.

    Workplace: Bergamo, Roma, Faenza, Padova

    We are looking for a highly experienced Senior Hardware Design Engineer to join our R&D team. The ideal candidate will be responsible for the architecture and electronic design of highly complex motherboards and embedded systems. The successful candidate will lead hardware development from requirements definition through laboratory bring-up, with a strong focus on multicore FPGA/SoC-based systems and the management of ultra-high-speed digital interfaces (High-Speed Digital Design).

    The role involves:

    • Hardware Architecture and Design: Define the electronic architecture of complex multi-platform systems, selecting key components (FPGA, SoC, memories, power management) based on cost, space, power consumption, and reliability constraints.
    • Schematic Design: Develop electrical schematics for complex multilayer boards, primarily using Siemens Xpedition and Altium Designer (knowledge of the Cadence Allegro/OrCAD suite will be considered an advantage).
    • High-Speed Routing & PCB Layout Supervision: Define guidelines and constraint management rules for high-speed trace layout, working closely with PCB layout designers to ensure signal integrity.
    • High-Speed Interfaces: Design and optimize digital buses and high-performance serial interfaces, including DDR5/DDR4, PCIe Gen4/Gen5, HDMI, DisplayPort, 10/100G Ethernet, and image sensor interfaces.
    • Signal & Power Integrity (SI/PI): Perform or supervise Signal Integrity and Power Integrity analyses (pre- and post-layout) to mitigate reflection, crosstalk, jitter, and voltage-drop issues on FPGA core power rails.
    • Power Supply and Power Management: Design complex power stages (POL, synchronous DC/DC converters) capable of delivering high currents with ultra-precise voltages for state-of-the-art SoCs and FPGAs.
    • Laboratory Testing and Bring-up: Conduct validation, functional testing, and debugging of prototype boards in the laboratory, using advanced instrumentation (high-bandwidth real-time oscilloscopes, TDR, spectrum analyzers).
    • Industry Standards and Qualification: Ensure design compliance with Defense/Aerospace industry standards (MIL-STD, DO-160) and electromagnetic compatibility standards (EMC/EMI).

    Requirements:

    HARD SKILLS

    • Education: Master's Degree in Electronic Engineering or equivalent background.
    • Experience: At least 7+ years of experience in the hardware design of complex high-speed digital electronic boards.
    • Design Tools: Full proficiency in schematic entry using Siemens Xpedition Enterprise and Altium Designer. Knowledge of the Cadence ecosystem (OrCAD/Allegro) is a strong plus.
    • Semiconductor Expertise: Proven design-in experience with very high pin-count FPGA/SoC devices (BGAs with hundreds/thousands of balls, e.g. AMD/Xilinx UltraScale+/Versal, Intel Agilex).
    • PCB Layout and Construction Knowledge: Knowledge of PCB manufacturing technologies (HDI technologies, buried/blind vias, multilayer stack-ups, low-loss materials such as Megtron).
    • Instrumentation: Expert use of network analyzers, high-speed oscilloscopes, and logic analyzers.

    SOFT SKILLS

    • Project & Team Leadership: Ability to coordinate small teams of layout designers or junior engineers and interface with PCB vendors and assemblers.
    • Rigor and Precision: Strong attention to detail in preparing bills of materials (BOM), test specifications, and project technical documentation.
    • Languages: Excellent command of written and spoken technical English.

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