Senior Director, Advanced Packaging Disruptive Technology

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Salary: $200,000.00 - $275,000.00

Location: Austin, TX, Covington, GA, Santa Clara, CA

You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Senior Director, Principal MTS

The Senior Director, Principal MTS is a senior technical leader responsible for defining and driving panel scaling technology strategy and customer-facing execution across next-generation advanced packaging and substrate platforms. This role leads cross-functional alignment to accelerate panel-level form factor scaling, RDL scaling, and ecosystem readiness-connecting customer needs to integrated equipment/process solutions and strategic partnerships.

Key Responsibilities

• Panel Scaling Technology Strategy & Roadmap Ownership • Own the panel scaling technology roadmap across form factor scaling, interconnect scaling, and substrate scaling, including transitions from wafer-based approaches to panel-based architectures. • Define technology inflections and integration milestones for advanced panel build-up and align internal roadmaps to customer adoption cycle

• Ecosystem & Partnership Development • Build and manage a partner ecosystem spanning substrate makers, material suppliers, OSATs, foundries, and research institutes to close panel scaling gaps (design rules, warpage, overlay, defectivity, metrology/inspection, reliability). • Identify, evaluate, and activate disruptive partners and collaborations to accelerate panel readiness and strengthen differentiation.

• Program Governance & Executive Communication • Lead executive-ready storytelling and decision frameworks • Drive internal alignment across engineering, product lines, marketing, and finance on portfolio gaps and priorities required to lead in advanced panel packaging. • Resolves exceptionally complex field process issues utilizing systematic troubleshooting methodology generally involving multiple processes.

• Functional Knowledge • Demonstrates broad and comprehensive understanding of different systems, theories and practices regarding advanced packaging as well as the changing business environment

• Business Expertise • Applies in-depth advanced packaging knowledge, business and commercial expertise to differentiate itself from the competition

• Leadership • Visionary Business & Technology Leader: Shapes strategy at the intersection of advanced technology and customer value, turning complex challenges into scalable, market‑leading solutions. • Trusted Executive Partner: Builds credibility with C‑suite leaders, customers, and partners through clear communication, strong judgment, and a collaborative leadership style. • Decisive Change Agent: Thrives in fast‑paced, ambiguous environments-driving alignment, making high‑impact decisions, and delivering results. • People‑First Leader: Inspires and develops world‑class teams, fostering a culture of innovation, accountability, and continuous growth.

• Problem Solving • Evaluates key business challenges; directs the development of new or innovative solutions

• Interpersonal Skills • Influences and negotiates at the top executive levels, with great latitude on outcomes; presents and defends complicated or delicate issues

Core Qualifications

• 15+ years experience in semiconductor packaging, substrates, panel processing, lithography/patterning, deposition/etch, or adjacent advanced manufacturing domains. • Demonstrated leadership in technology strategy + customer execution (principal-level account leadership, platform adoption, or roadmap ownership). • Strong working knowledge of advanced packaging drivers: panel form factor scaling, RDL scaling, TGV/glass & organic substrate trends, and manufacturing/yield constraints at large format. • Proven ability to lead cross-functional organizations and influence without direct authority across engineering, product teams, and external partners. • Executive communication strength: translating complex technical tradeoffs into business outcomes and decisions.

Preferred Qualifications

• PhD/MS in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or equivalent experience. • Prior experience launching new platforms (e.g., panel-based process modules, integrated packaging lines, or disruptive substrate architectures). • Demonstrated track record of ecosystem building (materials, substrate suppliers, research institutes, foundries/OSATs).

Travel

Travel as needed for strategic customer engagements, partner meetings, and industry/consortia events.

Additional Information

Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 25% of the Time Relocation Eligible: Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.