BACKGROUND PROFILE: Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field. Work directly with customers to optimize wafer or panel-level encapsulation and molding processes.
Numbers & Facts
Location
Anaheim, California
Description
RESPONSIBILITIES:
Serve as the technical lead for advanced semiconductor packaging materials.
Work directly with customers to optimize wafer or panel-level encapsulation and molding processes.
Troubleshoot complex material and process issues for both developmental and commercial products.
Ensure successful product adoption by delivering clear, measurable value to customers.
Solve technology-specific challenges across product lines through innovative application development and material characterization.
Collaborate closely with R&D, sales, and product teams to translate customer needs into technical solutions.
BACKGROUND PROFILE:
Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field.
10+ years of experience in semiconductor advanced packaging materials or processes.
Strong expertise in wafer-level encapsulation and molding technologies.
Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging.
Proven ability to work independently and lead technical discussions with customers.
Strong communication skills with a customer-focused, ownership-driven mindset.
Effective project and time management skills, with a consistent focus on quality and delivery.