
Electrical Design Engineer Leidos
- $87,100–$157,450
| Location | Huntsville, AL |
| Salary | $110,000 Per Year |
Join a pioneering company at the forefront of robust computing solutions tailored for aerospace, defense, and industrial sectors. Contribute to the next wave of RF and mixed-signal hardware innovation pivotal for advanced radar and communication systems. Utilize your expertise alongside exemplary FPGA, PCB, and embedded software engineers to craft RF solutions that elevate mission-critical technology.
This company is a major player in technology, boasting a significant global presence and extensive influence in embedded computing industries. Their contributions extend across land, sea, air, and space, nurturing a culture synonymous with innovation and engineering excellence.
You'll be a crucial member of the team that supports cutting-edge FMC and RFSoC products addressing formidable RF and signal processing challenges. Enjoy a workspace that entrusts engineers with problem-solving autonomy and celebrates collaboration.
The position is grounded in a career at a company that offers competitive remuneration packages, a robust suite of insurance options, a 401(k) plan, ample vacation days, and opportunities for professional growth. Benefit from a culture rich in technical ingenuity, and be part of an initiative working on prominent defense technologies—a career in an expansive global engineering network awaits you.
Located in one of America's burgeoning technology cities, Huntsville, Alabama, you'll experience life in a city that offers diverse career paths and a robust quality of life. The region promises scenic beauty combined with an active engineering community.
Your expertise will be instrumental in shaping complex analog front-end architectures for high-performing embedded computing products. Engage in all stages of the product lifecycle, from design to execution, influencing pivotal architectural choices and resolving intricate signal integrity complications. Your skills will be important in advancing RF and mixed-signal platforms for demanding applications.



