Reporting directly to the Process Engineering Manager, the supervisor will lead, mentor, and direct a team of process engineers dedicated to optimizing manufacturing workflows, improving product yields, maintaining quality standards, and implementing advanced PCB manufacturing technologies.
Duties/Responsibilities:
- Supervise, mentor, and evaluate the day-to-day performance of a team of process engineers.
- Assign engineering projects, establish goals, monitor milestones, and ensure technical accountability across all assignments.
- Promote a culture of continuous learning, technical growth, teamwork, and continuous improvement.
- Assist the Process Engineering Manager with resource planning, performance reviews, and hiring process.
- Will be required to perform other duties as requested, directed, or assigned.
- Oversee and troubleshoot PCB fabrication processes across wet processing (plating, etching, surface finish), dry processing (drill, route, lamination), imaging, and solder mask.
- Drive root-cause analysis and corrective/preventive actions (CAPA) for yield losses, customer returns, or scrap spikes.
- Establish, standardize, and maintain standard operating procedures (SOPs) and short sheets (SS).
- Support new product introduction (NPI) to ensure seamless transition from design/prototyping to full-scale volume production.
- Lead Six Sigma and Lean Manufacturing initiatives to enhance throughput, reduce waste, and increase overall equipment effectiveness.
- Apply Statistical Process Control (SPC) tools to monitor capability (Cp & Cpk), identify trends, and maintain tight process windows.
- Work collaboratively with Quality Assurance, Operations, and Maintenance teams to maintain compliance with industry standards (IPC, ISO, AS9100, NADCAP).
Requirements:
- Bachelor's degree in Chemical Engineering, Mechanical Engineering, or a related field.
- 3+ years of process engineering experience in printed circuit board (PCB) or semiconductor fabrication.
- 1-3 years of team lead, supervisory, or project management experience within a manufacturing environment.
- Excellent problem solving, communication and leadership skills.
- Proficient computer skills and knowledge.
- Highly motivated, enthusiastic, and committed to driving excellence.
- Deep understanding of printed circuit board manufacturing, IPC standards, and Quality Management Systems (QMS).
- Certification in Six Sigma, Lean Manufacturing, or related methods.
- Experience with advanced PCB technologies (e.g., HDI, RF, Flex, Rigid Flex, Book Binders).
- Proficiency in statistics and statistical software such as Minitab.
- Familiarity with CAD/CAM tools.
- Excellent verbal and written communication skills with the ability to bridge complex details with shop-floor execution.
Amphenol offers a competitive salary and benefits. The candidate must be able to legally work in the United States; we are unable to provide sponsorship. Position requires candidate to be a U.S. person as defined in ITAR, 22 CFR 120.15 (U.S. Citizenship or Resident Alien Status) and defined by 8 U.S.C. 1101(a) (20). Amphenol is a proud Equal Opportunity Employer as to all protected groups, including Individuals with Disabilities and Protected Veterans. For consideration for this position, please apply online to: https://amphenol-apc.acquiretm.com
APC1014
Amphenol is a proud Equal Opportunity Employer as to all protected groups, including Individuals with Disabilities and Protected Veterans.