Core Process Development & Optimization
- Set up assembly parameters: Program and fine-tune SMT line equipment, including screen printers, Solder Paste Inspection (SPI), Pick and Place machines, multi-zone Reflow-Vacuum Ovens and the following processes:
- Selective/Wave Soldering
- De-panel Router
- Automatic Press fit
- Inline Chemical and DI Washer
- Develop thermal profiles: Create and validate reflow soldering profiles tailored to specific printed circuit board (PCB) layouts, component densities, and solder paste types.
Quality Control & Troubleshooting
- Drive root-cause analysis: Investigate SMT defects (e.g., misalignments, bridging, voids) using Automated Optical Inspection (AOI), X-ray inspection, and microscopic failure analysis
- Monitor with SPC: Use Statistical Process Control (SPC) and process capability studies (Cp/Cpk) to track line variability and catch deviations early.
- Ensure compliance: Maintain adherence to strict industry standards like IPC-A-610 and J-STD-001.
Continuous Improvement & Line Efficiency
- Improve OEE (Overall Equipment Effectiveness): Track cycle times, line balancing, and machine downtime to maximize factory output.
- Apply Lean/Six Sigma: Implement 5S, DMAIC, or Kaizen events to reduce waste and lower production costs.
- Create documentation: Write and update Standard Operating Procedures (SOPs), PFMEAs, and machine control plans
FabrinetWest including its subsidiaries, is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, national origin, sex, sexual orientation, gender identify, age, disability, genetic information, veteran status, or any other characteristic protected by law.