Process Engineer Rotational Program

3D Glass Solutions Inc

  • Albuquerque, NM
  • 4 days ago
  • $75,000–$100,000 Per Year

Highlights

Module/ What youll work on/ Typical tools and methods Photolithography Critical dimension (CD) and overlay control, resist processes, reticle qualification Exposure, tracks, overlay metrology Etch Wet etch recipe development, profile and selectivity control Single and batch processing Thin Films (CVD / PVD / ALD) Film thickness, uniformity, stress and defect control Deposition chambers, ellipsometry, XRF, stress gauges Electroplating Cu electroplating TSV or RDL Single chamber electroplate tools, XRF, profilometry Yield and Integration Linking inline data and electrical test to defects and process shifts Defect inspection, wafer maps, parametric test, statistical analysis. https://www.everify.gov/sites/default/files/everify/posters/IER_RightToWorkPoster%20Eng_Es.pdf https://www.e-verify.gov/sites/default/files/everify/posters/EVerifyParticipationPoster.pdf .

Numbers & Facts

LocationAlbuquerque, NM
Salary$75,000–$100,000 Per Year

Description

About the program 3DGS is hiring new college graduates into a 24-month Process Engineering Rotational Program at our Albuquerque wafer fab. You will complete two 12-month rotations across process modules, then place into a permanent process engineering role based on your interests, performance and business needs. Process engineers own the recipes, equipment performance and yield of the steps that turn bare glass into working chips. From your first week, you will work on live production problems with real impact on output, cost and quality.

Location: Albuquerque, NM (on-site)Level: 0-5 years of experience Program length: 24 months, 2 rotations Job type: Full-time, exempt Compensation: $75,000 - $100,000 DOE

Rotation structure Each rotation places you in a different process module with a dedicated mentor and a defined project. Module/ What youll work on/ Typical tools and methods Photolithography Critical dimension (CD) and overlay control, resist processes, reticle qualification Exposure, tracks, overlay metrology Etch Wet etch recipe development, profile and selectivity control Single and batch processing Thin Films (CVD / PVD / ALD) Film thickness, uniformity, stress and defect control Deposition chambers, ellipsometry, XRF, stress gauges Electroplating Cu electroplating TSV or RDL Single chamber electroplate tools, XRF, profilometry Yield and Integration Linking inline data and electrical test to defects and process shifts Defect inspection, wafer maps, parametric test, statistical analysis

After your 2-year rotation, you will be placed in one of the modules based on your preference in combination of business needs. What youll do

Monitor process steps with statistical process control (SPC) and respond to out-of-control events on the production line. Run designed experiments (DOE) to optimize recipes for yield, throughput, uniformity and defect density. Investigate excursions and yield loss using root cause analysis methods such as 8D, 5 Whys and fishbone diagrams. Qualify new tools, chambers, materials and recipe changes through formal change control. Partner with equipment engineers, technicians, integration and yield teams to keep tools up and processes in spec. Analyze large manufacturing datasets in JMP, Python, SQL or similar tools and present findings to engineering leadership. Write and maintain process specifications, FMEAs, control plans and out-of-control action plans (OCAPs). Support continuous improvement goals for cost, cycle time, safety and sustainability.

Required qualifications

Bachelors degree in Chemical Engineering, Mechanical Engineering, Materials Science, Physics or Chemistry Coursework or project experience in semiconductor processing. Working knowledge of basic statistics and data analysis. Clear written and verbal communication, including presenting technical results. Ability to work on-site in a cleanroom environment, including occasional off-shift or weekend support during rotations. Must be a US citizen

Preferred qualifications

Hands-on cleanroom or nanofabrication lab experience from university research, a co-op or an internship. Familiarity with semiconductor metrology such as SEM, ellipsometry, AFM, XPS or four-point probe. Exposure to DOE, SPC or Six Sigma methods. Programming or scripting experience in Python, MATLAB, R or SQL. Experience with JMP statistical software

What we offer

Compensation: Based on experience, sign-on bonus or paid relocation and equity. Mentorship: A technical mentor in each rotation plus a program manager who supports you for the full 24 months. Visibility: Regular project reviews with senior engineers and fab leadership. Benefits: Medical, dental and vision coverage, IRA, paid time off and holidays, tuition assistance and relocation support.

Work environment and physical requirements This role splits time between the cleanroom and the office. In the cleanroom you will wear full gowning (bunny suit, gloves, hood, safety glasses) for extended periods.

Stand and walk for several hours at a time and lift up to 25 lb (11 kg). Follow strict safety and chemical handling procedures, including work near hazardous gases, chemicals and high-voltage equipment.

Reasonable accommodations are available for qualified individuals with disabilities.

3DGS participates in E-Verify to confirm employment eligibility. https://www.everify.gov/sites/default/files/everify/posters/IER_RightToWorkPoster%20Eng_Es.pdfhttps://www.e-verify.gov/sites/default/files/everify/posters/EVerifyParticipationPoster.pdf

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