Principal Microelectro Packaging Engineer

We're looking for a Principal Microelectronic Packaging Engineer to lead the development of next-generation packaging technologies that make our microelectronic assemblies smaller, faster to manufacture, more reliable, and more cost-effective. This is a highly collaborative advanced-technology role where you'll shape new processes and materials, guide cross-functional engineering teams, and bring innovative microelectronics concepts from experimentation and prototyping into production.

Starkey is a world leader in the manufacturing and distribution of advanced hearing technologies. We are in the business of connecting people and changing lives. Our teams come to work each day focused on ensuring people everywhere have the products and services they need to hear better and live better.

Founded in 1967 by Bill Austin, Starkey is known for our cutting-edge hearing health innovations, industry-leading research and development, and not being afraid to push the edge of what's possible.

We are headquartered in Eden Prairie, Minnesota, have over 5,000 employees in 29 facilities across the globe, and do business in more than 100 markets worldwide.

Watch this video to see more of what sets Starkey apart: https://youtu.be/9cUYwTlCepg?si=wkovx8_R_iINfrc6

JOB SUMMARY DESCRIPTION / PRIMARY PURPOSE OF JOB

This position will drive miniaturization and optimization of microelectronic packaging and assemblies by investigating new processes, packaging technologies, and advanced materials/sets. These technologies will be developed through prototyping, conducting experiments, and analyzing materials and processes, to improve build times, reduce size, reduce cost, and promote higher quality assemblies. Some of these technology advancements may require engagement of outside vendors specializing in these areas. The Principal Microelectronic Packaging Engineer will lead concept design, guide Mechanical Engineers, Electrical Engineers and ECAD Designers as part of a multi-functional advanced technology development team to create new and innovative ideas for microelectronic circuits, assemblies, and packaging. The Principal Microelectronic Packaging Engineer shall contribute to investigating and solving hearing aid and accessory electronic packaging issues by driving and coordinating activities.

JOB RESPONSIBILITIES/RESULTS

• Investigate and develop new processes that will make microelectronic assemblies more efficient to manufacture, smaller insize, lower cost, more reliable, and promote reuse across designs.

• Work as a member of the Microelectronic Design group to further circuit packaging and assembly capabilities.

• Provide packaging proposals and deliver written reports on experiments, processes, and evaluations.

• Collaborate with microelectronic manufacturing team to develop new processes and capabilities.

• Establish improved material and material sets that will create more robust microelectronic packaging with superior performance and/or provide protection for the core electronics against damage during manufacturing.

• Evaluate process with Quality/Reliability department.

• Coordinate the production of prototype product builds using new processes.

• Drive designs that will aid in reducing manufacturing cycle times and lowering costs.

• Establish and validate PCB/A and microelectronic assembly design techniques and guidelines.

• Investigate tools and equipment needed to improve capabilities.

• Define Design of Experiments to sufficiently validate new assemblies and processes.

• Coordinate and support the introduction of new processes into assembly facilities.

• Collaborate with microelectronic manufacturing team to develop and validate new processes and capabilities.

• Provide process support for manufacturing problems and concerns as directed.

• Ensure new designs are manufacturable by active participation in design reviews.

• Work with the sourcing team to identify and engage capable suppliers for outsourcing new technologies or methods that are leading edge.

• Benchmark and explore competitive solutions and new technologies.

• Maintain current knowledge of microelectronic assembly and packaging industry suppliers and technologies.

• Establish regular scanning of future technologies of interest

• Attend technology seminars and present pertinent information for Starkey.

• Participate in local, national, and international industry organization meetings.

• Benchmark and explore new technologies.

JOB REQUIREMENTS

Education

• At least a 4-year college degree (M.S. or Ph.D. degree preferred) in engineering or a physical science with a strong emphasis in metrology, materials science, electrical engineering, chemical engineering, physical analysis, and chemical analysis

Experience

• Minimum 15 years in microelectronic packaging with a B.S. degree (13 years of experience with M.S. or 10 years of experience with Ph.D.) in process or manufacturing engineering required including failure analysis of printed circuit boards and/or electrical components, using DOE and SPC tools and other formal problem-solving techniques.

Relevant experience should include:

• Multi-layer microelectronic packaging and PCB assembly design, process development, and manufacturing.
• Reliability testing and failure analysis of microelectronic packages and assemblies.
• Semiconductor wafer fabrication and backend processing including RDL, thinning, bumping, assembly, and testing.
• PCB design and PCBA layout using ECAD tools.
• Schematic capture review and electronic hardware design support.
• Electronic laboratory characterization and correlation measurements.
• Qualification and introduction of advanced packaging processes into production environments.
• Technical leadership of cross-functional engineering teams and development programs.
• Mentoring and developing engineers and technicians.
• Representation of the company in technical conferences, industry working groups, standards organizations, or supplier engagements.

Knowledge / Technical Requirements

The successful candidate shall possess expert-level knowledge and demonstrated experience in the design, development, manufacturing, qualification, and reliability assessment of advanced microelectronic packaging technologies.

• Multi-layer PCB and microelectronic packaging design, manufacturing, assembly, and verification processes.

• Advanced packaging technologies including TSV/TGV, fan-out wafer level packaging (FOWL), package-on-package (PoP), system-in-package (SiP), wire bond packaging, embedded component packaging, vertical interconnect technologies (VICs), multi-chip modules (MCM), compression molding technologies, and related advanced semiconductor packaging methodologies.

• Rigid and flexible PCB technologies and advanced PCB design, manufacturing, and assembly processes.

• Wafer backend processes such as redistribution layer (RDL), wafer thinning, bumping, assembly, and test methodologies.

• Electronic packaging design reviews, schematic capture review, and PCB/PCBA layout practices.

• Statistical process control, design of experiments, root-cause investigation, and process optimization methodologies.

• Reliability and Failure Analysis

• Package and interconnect reliability characterization.

• Solder joint and assembly reliability evaluation.

• Environmental and accelerated life testing.

• Failure analysis methodologies for semiconductor devices, PCBs, and assembled electronic products.

• Root-cause determination and corrective action development for packaging and manufacturing issues.

• Analytical and Materials Characterization Tools

• Experience with advanced analytical and characterization techniques, including SEM, EDX, Auger, FTIR, GC/MS, SIMS, AA, LC, TGA, DSC, DMA, ionography, and contamination analysis techniques.

• Experience performing mechanical and thermal finite element analysis (FEA) of printed circuit boards (PCBAs), electronic components, and microelectronic assemblies.

Competencies, Skills & Abilities

• Lead complex cross-functional engineering projects.
• Expert level structured problem solving
• Mentor and develop engineers and technicians.
• Drive technical strategy and advanced packaging technology roadmaps.
• Represent Starkey in industry forums, technical societies, standards organizations, and supplier collaborations.
• Evaluate and introduce emerging packaging technologies into product development programs.
• Demonstrate independent work skills and expert-level critical decision making.
• Apply unique analytical, design, research, processing, and testing skills to microelectronic packaging challenges.

WORK CONTEXT

Working Conditions

• Normal office/lab conditions
• Travel: Less than 10% of the time

Equipment Operation

• Software tools used in design and analysis software tools of microelectronic packages and assemblies
• Laboratory test, measurement, and failure analysis equipment

Salary and Other Compensation:

The target pay rate for this position is between $137,000 - $186,900 annually. Factors which may affect starting pay within this range may include: geography/market, skills, education, experience and other qualifications of the successful candidate.

This position is eligible for a bonus based upon performance results. There is no guarantee of payout.

The following benefits for this position, subject to applicable eligibility requirements, include medical, dental and vision insurance, 401(k) retirement plan with company match, company-paid life and short-term disability insurance, long-term disability insurance, employee assistance plan, hearing aid benefits, Paid Time Off, paid holidays, paid floating holidays, paid volunteer service day, paid paternity and maternity leave and tuition reimbursement.

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