Principal Engineer, Design for Test (DFT)

Ayar Labs

  • 30+ days ago

    Highlights

    You will work closely with ASIC Design, AMS, Photonics, Physical Design, Validation, Firmware, and Product Engineering teams to deliver high-quality silicon with strong manufacturability, test coverage, and production readiness. Backed by industry leaders and manufactured in partnership with the world’s leading semiconductor ecosystem, Ayar Labs’ co-packaged optics solutions are enabling next-generation AI scale-up architectures.

    Numbers & Facts

    Location
    Websitehttps://ayarlabs.com/careers/

    Description

    Principal Engineer, Design for Test (DFT)

    Location: Bengaluru, India  (On-site, flexible hours)

    Ayar Labs is shattering AI data bottlenecks by moving data at the speed of light. As pioneers of co-packaged optics (CPO), we are using light instead of electricity to move data faster, further, and with a fraction of the energy needed to fuel the explosive growth of AI models. Backed by industry leaders and manufactured in partnership with the world’s leading semiconductor ecosystem, Ayar Labs’ co-packaged optics solutions are enabling next-generation AI scale-up architectures.

    The Principal DFT Engineer will lead Design-for-Test architecture, implementation, and silicon bring-up for complex electro-optical SoCs and chiplet-based systems. This role requires strong technical leadership across scan architecture, ATPG, MBIST/LBIST, silicon debug, and production test methodologies.

    You will work closely with ASIC Design, AMS, Photonics, Physical Design, Validation, Firmware, and Product Engineering teams to deliver high-quality silicon with strong manufacturability, test coverage, and production readiness.

    The ideal candidate is a hands-on technical leader who thrives in a fast-paced startup environment and can drive DFT execution from architecture definition through production ramp.



    KEY RESPONSIBILITIES
    • Define and drive SoC-level DFT architecture and implementation strategy for advanced ASIC and electro-optical SoCs
    • Lead scan insertion, ATPG generation, MBIST/LBIST integration, JTAG/boundary scan, and compression methodologies
    • Develop and validate DFT constraints, timing requirements, and test modes in collaboration with RTL and Physical Design teams
    • Drive fault coverage closure, pattern validation, and silicon test debug activities
    • Collaborate with ASIC, AMS, Packaging, Firmware, Validation, and Product Engineering teams to ensure successful silicon bring-up and production readiness
    • Support post-silicon validation, characterization, yield analysis, and manufacturing ramp activities
    • Develop automated methodologies, flows, and infrastructure to improve DFT quality and execution efficiency
    • Drive root-cause analysis for silicon test failures and manufacturing issues
    • Work closely with EDA vendors and external partners on DFT tool flows and methodologies
    • Mentor engineers and provide technical leadership across DFT and related domains


    REQUIRED QUALIFICATIONS
    • BS or MS in Electrical Engineering, Computer Engineering, or related field
    • 12+ years of experience in ASIC/SoC DFT implementation and silicon bring-up
    • Strong expertise in:  Scan architecture and scan compression, ATPG and fault coverage analysis, MBIST/LBIST methodologies, JTAG and boundary scan, At-speed testing and silicon debug and DFT signoff and manufacturing test flows
    • Strong knowledge of RTL-to-GDSII ASIC development flows
    • Experience with industry-standard DFT and ATPG tools
    • Strong understanding of timing constraints, clocking architectures, and multi-clock domain designs
    • Experience debugging silicon and supporting high-volume manufacturing
    • Strong scripting and automation skills using Python, Tcl, or similar languages
    • Excellent debugging, problem-solving, and cross-functional collaboration skills


    PREFERRED QUALIFICATIONS
    • Experience with advanced-node SoCs and chiplet-based architectures
    • Experience with high-speed SerDes, UCIe, PCIe, CXL, Ethernet, or optical interconnect technologies
    • Experience with mixed-signal integration and electro-optical systems
    • Experience with silicon bring-up, yield improvement, and production ramp
    • Familiarity with advanced packaging technologies and multi-die integration
    • Experience working in startup or fast-paced product development environments
    • Experience mentoring and leading geographically distributed engineering teams


    WHAT WE VALUE
    • Strong ownership and accountability
    • Execution-focused mindset with high attention to quality and predictability
    • Ability to drive complex technical problems to closure
    • Collaborative leadership and mentoring capability
    • Passion for building scalable methodologies and delivering production-quality silicon
    •  
    NOTE TO RECRUITERS:
    Principals only. We are not accepting resumes from recruiters for this position. Remuneration for recruiting activities is only applicable subject to a signed and executed agreement between the parties. Please don’t send candidates to Ayar Labs, and do not contact our managers.
     

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