Business Line Description:
NXP s Front End Operations plays an essential role in the company s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers.
Job Summary:
Photolithography Equipment Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required. Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/KLA SL3/Archers/UVs/ASET/HRPs, Onto IRIS is desirable.
Key Challenges:
- Identification and reduction of reoccuring machine faults
- Creation of hard down action plans driving to root cause
- Developing and improving tool maintenance procedures
- Training maintenance technicians
- Reducing overall cost of equipment and scrap
- Improving tool utilization and availability
- Participating in and/or leading cross-functional and lean activity teams
- Supporting process development activities
- Sourcing and releasing new equipment
- Training maintenance technicians
- Knowledge of Six-Sigma root cause problem solving, SPC, 8D, FMEAs
Cross functional aspects:
- Working closely with Photo process team to identify and reduce source of process variation and implementing zero defect process
Job Qualifications:
- Must have a BS or MS degree in engineering or a degree in relevant field of studies
- More than 5 years of process engineering experience in a similar high volume semiconductor manufacturing environment