As a Packaging Module Development Engineer, you will take the lead in designing and optimizing advanced packaging processes and equipment that enable Intel's cutting-edge semiconductor technologies. You will focus on developing innovative solutions that enhance product reliability, quality, manufacturability, and performance in high-volume manufacturing environments. Your contributions will be critical to ensuring Intel remains a leader in the competitive semiconductor industry while driving rapid advancements in packaging technologies.

This role is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which is dedicated to developing and scaling semiconductor packaging solutions that meet the demands of mobile, edge, and high-performance computing applications. The group plays a key role in enabling Intel's technological leadership by delivering innovative assembly processes and materials that align with Intel's broader goals of providing world-class solutions to global customers.

Key Responsibilities

• Develop, optimize, and qualify packaging assembly processes and equipment to meet quality, reliability, yield, and cost targets.
• Apply principles of design of experiments (DOE) and statistical process control (SPC) to improve process efficiency and manufacturability.
• Lead experimental design and prototype development to evaluate packaging technologies under simulated field-use conditions.
• Collaborate with cross-functional teams to address key risk areas and provide technical consultation on packaging challenges.
• Establish specifications for materials and equipment while interfacing with suppliers to ensure performance, quality, and adherence to requirements.
• Innovate techniques, tools, and quality screens to identify potential issues early and address packaging reliability concerns.
• Document technical findings, process improvements, and experimental results in reports, qualification summaries, and technical papers.
• Drive standardization across qualification procedures, manufacturing systems, and packaging methods to achieve operational consistency.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.  

Minimum Qualifications

PhD in Engineering, Physics, Chemistry, or a related STEM field 

6+months in one or more of the following. 

• Proficiency in statistical methods, including Statistical Process Control (SPC) and Design of Experiments (DOE).

• Hands-on experience with process development and characterization in packaging or manufacturing environments.

Preferred Qualifications

• Familiarity with semiconductor fabrication processes, packaging flows, and assembly methodologies.

• Knowledge of quality systems and documentation standards for manufacturing and packaging processes.

Be part of Intel's journey to redefine semiconductor packaging and assembly technologies. Contribute your expertise, lead innovation, and drive transformative impact-apply today.